A powder injection molding process is developed and optimized for piezoelectric PAN-PZT ceramics. Torque rheometer experiments are conducted to determine the optimal solids loading, and the rheological property of the feedstock is evaluated using a capillary rheometer. Appropriate debinding conditions are chosen using a thermal gravity analyzer, and the debound specimens are sintered using sintering conditions determined in a preliminary investigation. Piezoelectric performance measures, including the piezoelectric charge constant and dielectric constant, are measured to verify the developed process. The average values of the measured piezoelectric charge constant and dielectric constant are 455 pC/N and 1904, respectively. Powder injection molded piezoelectric ceramics produced by the optimized process show adequate piezoelectric performance compared to press-sintered piezoelectric ceramics.

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity (λ) and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.