Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and SiOx-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

There have been many studies on superwetting surfaces, ranging from superhydrophilicity to superhydrophobicity, owing to the variety of their potential applications. There are some drawbacks to developing these films for certain applications, such as the fragility of the microscopic roughness feature that is vital to ensure superwettability. At the first part of in this presentation, we fabricated intrinsically stable superwetting films using the organosilicate based layer-by-layer (LbL) self-assembly method in order to control hierarchical roughness and adjusted the surface chemistry of the multilayer structures. At the second part, hydrophilic branched poly(ethylenimine) and nanoparticle were assembled into LbL multilayers in the presence of UV-curable poly(urethane acrylate).

Generally, in the previous researches, it is found that a water droplet is respectively in Wenzel and Cassie-Baxter states on hydrophilic/hydrophobic rough surfaces. And Wenzel and Cassie-Baxter equations are used to estimate the apparent contact angle on the surfaces. However, difference between measured apparent contact angle and estimated apparent contact angle with the equations is recently reported and new model to estimate apparent contact angle on rough surfaces is proposed. In this study, wetting state and apparent contact angle on the surfaces with micro-pillars should be investigated to find solution of this argument. Using the high resolution microscope, the wetting state of the D.I.water droplet on the surface with micro-pillars was visualized and apparent contact angle of the D.I.water droplet was measured. On the basis of experimental data, the equations to estimate apparent contact angle were verificated and the general wetting characteristics on the surfaces with micro-pillars are finally classified.

SiC 보강재 표면에 도금된 Cu금속층이 Al/SiC복합재료의 젖음성에 미치는 영향을 검토하였다. 보강재에 대한 금속층의 도금은 무전해도금법을 이용하였으며, Al/SiC 복합재료의 제조는 텅스텐 발열체 진공로의 670˚C~900˚C에서 제조하여 보강재와 기지간의 접촉부위를 촬영하여 젖음성을 측정하였다 젖음성 측정 결과 보강재에 도금된 Cu층은 젖음성을 향상시켰고, 젖음성의 개선은 보강재에 도금된 금속층과 기지간의 반응에 의해 계면에너지를 변화시킴으로서 나타난 결과이며. 반응을 통한 산화피막의 배제도 영향을 미친 것으로 판단된다