Surface morphology and optical properties such as transmittance and haze effect of glass etched by physical and chemical etching processes were investigated. The physical etching process was carried out by pen type sandblasting process with 15~20 μm dia. of Al2O3 media; the chemical etching process was conducted using HF-based mixed etchant. Sandblasting was performed in terms of variables such as the distance of 8 cm between the gun nozzle and the glass substrate, the fixed air pressure of 0.5bar, and the constant speed control of the specimen stage. The chemical etching process was conducted with mixed etching solution prepared by combination of BHF (Buffered Hydrofluoric Acid), HCl, and distilled water. The morphology of the glass surface after sandblasting process displayed sharp collision vestiges with nonuniform shapes that could initiate fractures. The haze values of the sandblasted glass were quantitatively acceptable. However, based on visual observation, the desirable Anti-Glare effect was not achieved. On the other hand, irregularly shaped and sharp vestiges transformed into enlarged and smooth micro-spherical craters with the subsequent chemical etching process. The curvature of the spherical crater increased distinctly by 60 minutes and decreased gradually with increasing etching time. Further, the spherical craters with reduced curvature were uniformly distributed over the etched glass surface. The haze value increased sharply up to 55 % and the transmittance decreased by 90 % at 60 minutes of etching time. The ideal haze value range of 3~7 % and transmittance value range of above 90 % were achieved in the period of 240 to 720 minutes of etching time for the selected concentration of the chemical etchant.

The expansion of the display market could mass-produce the product which becomes the super-slim and ultra-lighting according to the demand of customer. This change etched the mobile display panel in order to make the thin glass. The wet etching refers to the process of removing selectively the unnecessary part in order to form the circuit pattern among the semi-conductor or the LCD manufacturing process. The wet etching can progress the etching about a large amount at a time but the thickness of glass is not smooth or not etched according to the process condition. In this study, the defect factor in the etching process tries to be analyze. The experimental design was established and the processing condition was optimized in order to minimize under non-etch part generation by the experiment of design.

There is legal uncertainty and ambiguity with regards to the classification and disposal of sludge generated from glassetching process. Moreover, secondary effect on the environment such as corrosion of landfill construction by the sludgeproduced in glass etching process was observed in waste landfill site. As part of response to the parliament’s request forthe relevant data and local media coverage, exhaustive investigation of glass etching process was required. Accordingly,we conducted an exhaustive investigation of 8 glass etching manufacturers. Glass etching business is one of the businessesthat have seen rapid growth since 2010 with the development of semiconductor and electronics industry, and glass etchingproducers are mostly located in Gumi, Cheongju, Sejong, Gongju, and Cheonan cities. In this study, we investigated theharmful effects of wastes generated from the glass etching process, how those wastes are classified and treated, problemsarose from the process, and secondary effects on the environment observed in waste landfill site. The study found thatcyanide, lead, mercury, trichloroethene, and perchloroethene were not detected in the sludge produced from glass etchingprocess, and hexavalent chromium, copper, and arsenic were either not detected or reported at very low level, which wasbelow the threshold concentration level of designated waste. In contrast, pH of sludge produced from glass etching processwas between 1.7 and 2.3, pH of hydrofluoric acid used for glass etching showed acidic value of 1.5, which suggests thatthe classification system of such hazardous substance requires reconsideration.