Thin-film shape technology is recognized for its core technology to enhance the technology of LCD, PDP, semiconductor manufacturing processes, hard disks and optical disks, and is widely used to form coated thin films of products. In addition, resistance (electron beam filament) technology for heating is used to manufacture filament for ion implants used in semiconductor manufacturing processes. By establishing an electronic beam filament production system and developing seven specifications of electronic beam filament, it is contributing to improving trade dynamics and increasing exports to Japan through localized media of theoretical imports to domestic companies. In this study, CAE analysis was performed after setting electron beam filament specification and development objectives, facilities and fabrication for electron beam filament production, electron beam filament JIG & fixture design and fabrication followed by electron beam filament prototype. Then, the automation and complete inspection equipment of the previously developed electronic beam filament manufacturing facilities was developed and researched to mass-produce them, to analyze and modify prototypes, design and manufacture automation facilities, and finally, to design and manufacture the complete inspection equipment. In this paper, design and manufacture of electronic beam filament total inspection equipment for mass production were dealted with.

In this study is a study to measure the section by voltage through the high integration of the circuit of the inspection equipment for the power supply circuit of semiconductor equipment. The experiment was conducted by increasing the -1.5∼4 voltage section by 0.5V. At this time, the tolerance was applied to ±0.1%+5mA. Although the voltage increased through the experiment, the accuracy of the measurement data did not change, and it was confirmed through this experiment that the null hypothesis(H0) was adopted in each section through the hypothesis test.

This study deals with replacement analysis of deteriorated equipment for improving productivity of production system. Frequent breakdown of the deteriorated equipment causes a situation that reduces productivity such as low product quality, process delay, and repair cost. However, the replacement of new equipment will be required a high initial investment cost, so it is important to analysis the economic feasibility. Therefore, we analyze the effect of the production system due to the aging effect of the equipment and the feasibility of equipment replacement based on the economic analysis. The process flow, working time, logistics movement, etc. are analyzed in order to build the simulation modeling for a ship and land switchboard production system. Using numerical examples, the economic feasibility analysis of equipment replacement through replacement of existing deteriorated equipment and additional arrangement of new facilities is performed.

This paper suggests a specific model that could efficiently improve the interaction and the interface between MES(Manufacturing Execution System) server and POP(Point of Production) terminal through electronic document server and electronic pen, bluetooth receiver and form paper in disassembly and process inspection works. The proposed model shows that the new method by electronic document automation system can more efficiently perform to reduce processing time for maintenance work, compared with the current approach by handwritten processing system. It is noted in case of the method by electronic document automation system that the effects of proposed model are as follows; (a) While the processing time per equipment for maintenance by the current method was 300 minutes, the processing time by the new method was 50 minutes. (b) While the processing error ratio by the current method was 20%, the error ratio by the new method was 1%.

In order to secure competitiveness of companies in the semiconductor industry, state management of equipment is one of the most important key factors. Particularly, after carrying out preventive maintenance (PM) work to maintain the best equipment condition, process reliability inspection is carried out. This work must be performed manually by the intervention of the operator. This inspection work is becoming more and more difficult due to the difficulty of the manufacturing worker, the increase of the simple repetitive workload, and the increase of the inspection items for the engineer, as the condition and the procedure continuously change as the semiconductor scaling down. Therefore, we would like to carry out an empirical study on the construction of an automatic inspection system in order to carry out the more reliable and efficient inspection procedure by eliminating the problems and unreasonableness of the past based on the investigation and analysis of the work procedures and conditions of the existing manual method.

In this paper, the on-site applicability review was carried out on the actual site so that the inspection equipment for inspection of tunnel vertical-type vent can be developed to promote the safety of the inspection engineer and improve the inspection cost.