YAG (Yttrium Aluminum Garnet, Y3Al5O12) has excellent plasma resistance and recently has been used as an alternative to Y2O3 as a chamber coating material in the semiconductor process. However, due to the presence of an impurity phase and difficulties in synthesis and densification, many studies on YAG are being conducted. In this study, YAG powder is synthesized by an organic-inorganic complex solution synthesis method using PVA polymer. The PVA solution is added to the sol in which the metal nitrate salts are dissolved, and the precursor is calcined into a porous and soft YAG powder. By controlling the molecular weight and the amount of PVA polymer, the effect on the particle size and particle shape of the synthesized YAG powder is evaluated. The sintering behavior of the YAG powder compact according to PVA type and grinding time is studied through an examination of its microstructure. Single phase YAG is synthesized at relatively low temperature of 1,000 ℃ and can be pulverized to sub-micron size by ball milling. In addition, sintered YAG with a relative density of about 98 % is obtained by sintering at 1,650 ℃.

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10−6/℃) than did the monolithic synthesized Cu sintered body.

본 연구는 PVA(polyvinyl alcohol) 섬유와 VAE(vinyl acetate ethylene) 분말 폴리머를 사용한 시멘트복합체의 압축·휨강도 와 온도변화에 따른 충격파괴거동을 연구하였다. 충격시험은 -35℃, 0℃ 및 35℃의 선정된 온도조건에서 실시하였다. 본 실험에서는 시멘트 복합체와 일반 모르타르에 대한 충격파괴 에너지와 변위, 시간을 얻기 위해 낙하 충격시험기(Ceast 9350)를 사용하여 충격시험을 수행하였다. 강도 시험결과, PVA 섬유와 VAE 분말 폴리머의 휨강도는 모두 증가하였다. PVA 섬유보강 시멘트복합체의 경우 재령 28일에서의 압축강도는 약간 감소하였으나, 휨강도는 일반 모르타르 강도보다 24.4% 증가하였다. 낙하 충격시험 결과, PVA 섬유보강 시멘트복합체 시편은 섬유의 가교역할로 인한 균열발생의 억제와 에너지 분산에 의한 미세균열이 발생하였으며, 충격에 의한 배면파괴와 관통에 대하여 억제되었다. 반면 VAE 분말 폴리머 시멘트복합체와 일반 모르타르의 시편은 대부분 큰 균열이나 관통파괴 되었다. 충격하중을 받는 시멘트복합체와 일반 모르타르의 시편은 대부분 국부적인 취성파괴거동을 보이며, PVA 섬유보강에 의한 휨성능 증진으로 인해 충격에 대한 저항성능이 크게 향상되었다.