Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at 200oC shows a highly dense and well-sintered microstructure and has a resistivity of 7.60 μΩ·cm. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.

In this study, we successfully synthesized a nano-sized lanthanum-modified lead-titanate (PLT) powder with a perovskite structure using a high-energy mechanochemical process (MCP). In addition, the sintering behavior of synthesized PLT nanopowder was investigated and the sintering temperature that can make the full dense PLT specimen decreased to below by using powder as sintering agent. The pure PLT phase of perovskite structure was formed after MCP was conducted for 4 h and the average size of the particles was approximately 20 nm. After sintered at 1050 and , the relative density of PLT was about 93.84 and 95.78%, respectively. The density of PLT increased with adding and the specimen with the relative densitiy over 96% were fabricated below when 2 wt% of was added.