Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been

Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication that has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.

Co-60 및 Ir-192 등의 방사성 동위원소가 비파괴 검사(Non-Destructive Test; NDT) 등의 분야에서 널리 쓰 임에 따라 방사선 안전관리가 매우 중요시되고 있다. 본 연구에서는 요오드화수은(Mercury(Ⅱ) Iodide; HgI2) 의 선원추적 시스템 적용 가능성을 평가하였다. HgI2로 제작된 Unit cell 센서의 신뢰도 검증을 위한 전기적 특성평가를 수행한 후, 방사선에 대한 센서의 위치의존성을 분석하고, Planning system의 선량 분포와 비교 하였다. 평가결과, R-sq>0.99 이상의 선형성과 CV<0.015 이하의 재현성을 보이며 신뢰도가 높은 것으로 나타났다. 또한, 위치의존성 평가에서는 센서의 isocenter에서 최댓값이 측정되었으며, 거리에 따라 점진적 감소를 나타냈다. 그러나 Planning system 상의 선량 분포 데이터와는 최대 30%의 차이를 보였는데, 센서는 단일지점으로부터 데이터를 수집하는 Planning system과 달리 면적으로부터 수집하기 때문으로 사료된다.

PFC (perfluorocompound) gases have an extremely high global warming potential (GWP). A study of the destruction of NF3, CF4 and SF6 gases emitted from the semiconductor industry was attempted by plasma power at 4.4 kW, 5.5 kW, 6.0 kW, 6.6 kW, 7.6 kW, 8.1 kW and 9.1 kW. As electric power increased, DRE (destruction and removal efficiency) of NF3, CF4 and SF6 was also increased. It was confirmed through experiment that the DRE of NF3 is 99% at 7.6 kW, 97% for CF4 at 9.14 kW and 100% for SF6 at 7.6 kW of plasma power. By-products formed by PFC destruction were mainly F2, SO2F2, NOx and CO gases. In addition, particulate matter was formed, and particle were proven to be AlF3.