PURPOSES : The objective of this study was to evaluate the field applicability of chip seals using recycled aggregates by comparing performance between natural aggregates and recycled aggregates for chip seals. METHODS : In order to check the performance of chip seals using recycled and natural aggregates, Bitumen Bond Strength (BBS) test, Vialit and bleeding tests were carried out. Cationic emulsions (RS(C)-2 and latex modified RS(C)-2L) were used in the tests. Granite aggregates were used as the natural aggregate and recycled aggregate from road wastes were used as the recycled aggregate. The aggregate was used with uniform gradation between 10 mm and 4.75 mm to clearly compare the performance difference between natural and recycled aggregates. RESULTS : Test results showed that the aggregate retention was low for both natural and recycled aggregates when applying RS(C)-2 (unmodified emulsion), but there was almost no difference between them when applying RS(C)-2L and RS(C)-2L-1 (modified emulsion) in the Vialit test results. In the bleeding tests, there was no bleeding for both natural and recycled aggregates when applying RS(C)-2 and RS(C)-2L. CONCLUSIONS: It was possible to apply chip seals using recycled aggregates in the field because the chip seals with recycled aggregates and RS(C)-2L (modified emulsion) showed aggregate retention similar to that of natural aggregates, and there was no bleeding.

현재 아스팔트 도로 분야에서 신규건설 수요는 점차 감소되고 있으며, 기존 공용중인 도로의 사용기간 이 증가함에 따라 도로포장의 파손이 증가하기 때문에 도로의 재포장 및 유지보수의 수요가 증가하는 실 정이다. 기존 도로의 유지보수 적용 시 교통통제가 야기하는 도로 사용자의 불편 및 경제적 손실을 고려 해야하며, 또한 유지보수를 위한 비용을 시공 후 공용성과 비교하여 고려해야 한다. 미국 주 교통국에서 는 이러한 문제점들을 고려하여 현장 상황에 적합한 유지보수 공법을 선정하여 적용하고 있으며, 칩실과 포그실로 대표되는 아스팔트 표면처리공법(Asphalt Surface Treatments)의 사용이 증가하고 있다. 칩실 은 여러 유지보수 공법 중 경제적이고 효과적인 공법으로 시공 후 3~4시간 후에 교통을 개방한다. 때문 에 칩실의 초기 양생시간(3~4시간)이 칩실의 충분한 공용성 발현에 중요한 역할을 한다. 본 연구에서는 칩실의 초기 공용성을 평가하기 위하여 CRS-2 일반 유화아스팔트와 5 종의 폴리머 개질 유화아스팔트 (PME-A, -B, -C, -D, -E)를 사용하여 칩실 시편을 제작한 후 증발 시험(Evaporation Test), 점착력 시험(Bitumen Bond Strength, BBS Test), Vialit Test, MMLS3 골재 탈리 시험을 통하여 칩실의 초기 골재 부착력 특성을 평가하였다. 그림 1에서 Vialit Test의 골재 탈리 결과와 BBS Test로 얻어지는 각 유 화아스팔트의 점착력을 비교하였고, 미국 알래스카 주 교통국에서 칩실의 공용성 판단 요소로 제시한 10% 골재 탈리율 기준을 MMLS3 시험 결과와 Vialit Test 시험결과 사이의 관계식을 통하여 13%로 수정 하여 실험 결과에 적용하여 평가하였다

PURPOSES : The objective of this study is to evaluate the effect of physical characteristics of emulsion asphalt and aggregate on performance of chip seal pavements. METHODS : In order to evaluate the performance of chip seal materials, the sweep tests and Vialit Plate Shock tests were conducted on the mixtures with five emulsion asphalt binders and three aggregate types. The sweep tests was intended to investigate the change of bonding properties between emulsion asphalt and aggregate with curing time. The Vialit Plate Shock test was used to evaluate the bonding properties of chip seal materials at low temperatures. RESULTS : Results from sweep tests showed that polymer modified emulsion asphalt can reduce the curing time by 1.5 hour comparing with typical emulsion asphalt. It is also found that the Flakiness Index of aggregates and absorption rate of binder are the major factors affecting the bonding properties of chip seal materials. The Vialit Plate Shock test results showed that the average aggregate loss of CRS-2 is ten times higher than CRS-2P No.2 indicating that the use of polymer additives in emulsion asphalt can improve the performance of chip seal materials in low temperature region. CONCLUSIONS : The use of polymer in emulsion asphalt can decrease the curing time of chip seal materials and increase the bonding properties between aggregates and asphalt binder. It is also concluded that the lower Flakiness Index and absorption rate of aggregates can improve the performance of chip seal pavement.