The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO2/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO2/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.

Cap decks used in slim floor system for reducing floor height act as molds for forming floor slabs in structures with a span of up to 6m without temporary supports. When deep decks are employed in a structure with a span of more than 6m, the problem of defection occurs. This study suggests placing tendons at the ends of cap decks in order to create cambers and control defection when preload is applied. Uniformly distributed load was applied by an UTM to the two L/4 points of specimens to observe the deflection of preloaded cap decks. For the test, three 7.5m specimens were fabricated. One of them was a plain cap deck specimen and the others were those with tendons (PC strands or steel bars.