고등 복합재료 구조물 제작에 적용되는 고온경화용 에폭시 수지 시스템 경화물의 물리적 특성을 연구하였다. 고온경화용 에폭시 수지 경화물의 표면 몰폴로지는 저온경화용 수지 시편의 표면과는 달리 균일한 몰폴로지를 보여주었다. 이 수지 경화물의 열중량분석 결과 300 oC까지는 무게감소가 거의 없는, 즉 열적으로 매우 안정한 것으로 나타났는데, 이는 높은 가교화밀도에 기인한 것이다. 300-500 oC 영역에 서 급격한 무게감도는 매트릭스 수지의 본격적인 열분해에 기인한 것이다. 시편의 인장 및 압축 특성, 열 변형온도, 밀도, 부피수축 등의 특성을 측정하고 평가하였다.

고성능 복합재의 설계와 제작에 있어서 경량화는 필수 트랜드이다. 본 연구에서는 DGEBA계 에폭시 그리고 폴리아마이드 아민으로 조합된 수지시스템과 글라스 버블을 이용한 경량 복합재료를 제조하고 그 특성을 평가하였다. 제조한 경량 복합제의 밀도는 0.31-0.53 g/cm3 범위였다. 실온에서 2일간 방치한 후 성형한 시료의 압축강도가 바로 60 oC에서 2시간 경화시킨 시편보다 2배 이상 높게 나타났다.

Multiwall carbon nanotubes (MWCNT) with two different (L/D) aspect ratios (7±2 μm/140±30 nm and 0.5–2 μm/8–15 nm) were surface treated using nitric acid (HNO3) and polyethyleneimine (PEI) prior to their deposition on carbon fibers (CF). Before the hierarchical reinforcement with CF-MWCNT, the CFs were treated with 3-glycidoxypropyltrimethoxysilane, a coupling agent (Z6040) and with poly(amidoamine) (PAMAM) a dendrimer containing an ethylenediamine core and amine surface groups. The MWCNT were deposited on the CF using two methods, by electrostatic attraction and by chemical reactions. The changes in the CF surface morphology after the MWCNT deposition were analyzed using SEM, which revealed a higher density and uniform coverage for the PAMAM-treated CF and the short MWCNTs. The interfacial adhesion of the composite materials was evaluated using the single fiber fragmentation technique. The results indicated an improvement in the interfacial shear strength with the addition of the short-MWCNTs treated with acid solutions and grafted onto the surface of the CF fiber using electrostatic attraction.

고성능 복합재료 제조에 사용되는 고온경화용 에폭시 수지 시스템의 성형성을 연구하였다. 테트라글리시딜 메틸렌 디아닐린계 에폭시 수지 시스템의 조성과 화학구조를 여러 가지 분석장비를 이용하여 분석하고 확인하였다. 이 수지 시스템은 보통의 작업온도 조건에서 시간 경과에 따른 점도 상승이 미미한 것으로 나타났다. 유전 경화 모니 터링 방법을 이용하여 선정한 수지 시스템의 경화거동을 연구하였다.

주파수 (30 ~ 300k Hz)와 온도 범위 (20 ~ 160 ℃)가 경화 조건에 따른 에폭시 수지의 전 기적 특성 (유전율 및 유전손실)에 미치는 영향을 조사하였다. 유리전이온도(Tg) 이하에서는 주파수와 상관없이 각각 3가지의 시편에서 유전분산 현상이 나타나지 않으며, 유리전이온도(Tg) 이상에서 유전분 산 현상이 나타났다.

약용매에 용해가 가능한 알킬기 변성 에폭시수지를 합성하기 위하여, 1단계에서 당량비 기준 dodecyl phenol (DP)/formaldehyde = 1.25~1.333/1.0로 하여, 합성된 도데실 페놀 노볼락 화합물의 벤젠 고리수가 3.0~5.0가 되도록 합성하였고, 2단계에서는 당량비 기준으로 1단계에서 합성된 도데실 페놀 노 볼락 화합물/비스페놀A형 에폭시수지 (YD-128) = 1/2로 합성하였고, 3단계는 지방산을 투입하여 지방산 변성 도데실 페놀 노볼락 에폭시수지를 합성하였다. 합성된 수지의 반응성도, 점성도와 분자량 변화, 약용 매 가용성 등을 측정한 결과, 1단계에서 합성된 도데실 페놀 노볼락 화합물의 벤젠고리수가 늘어남에 따라 지방산 변성 도데실 페놀 노볼락 에폭시수지의 점도가 상승하였고, 약용매 가용성이 우수하였다. 도료 제 조 후 물성을 측정한 결과, 개환촉매로 triphenylphosphine(TPP)을 사용한 DPFAC-5는 건조속도, 접착성, 도막경도, 내충격성, 내산성 및 저장안정성이 양호하였다.

에폭시 수지는 기계적 물성, 내약품성, 치수 안정성 등이 우수하기 때문에 고기능 소재로서 수요가 증가하고 있다. 이에 따라 에폭시 수지 제조공정에서 발생하는 부산물의 양도 증가하여 부산물 내의 원료 물질 회수에 대한 관심이 높아지고 있다. 본 연구에서는 원료물질을 회수하는 증류/분리막 복합 공정에 적용할 수 있는 탈수용 복합막을 연구하였다. 실리카-지르코니아 졸에 α-알루미나를 분산시킨 코팅용액과 실리카 졸을 이용하여 Dip-coating법으로 실리카 복합막을 제조하였다. 에폭시 공정 부산물인 Epichlorohydrin/IPA/H2O을 이용하여 투과증발 실험한 결과 복합막은 총투과도 0.1∼0.7 kg/m²⋅h, 물의 선택도 50∼110를 나타내었다.

Electronic products are a major part of evolving industry and human life style; however most of them are known to emit electromagnetic waves that have severe health hazards. Therefore, different materials and fabrication techniques are understudy to control or limit transfer of such waves to human body. In this study, nanocomposite powder is dispersed into epoxy resin and shielding effects such as absorption, reflection, penetration and multiple reflections are investigated. In addition, nano size powder (Ni, Fe2O3, Fe-85Ni, C-Ni) is fabricated by pulsed wire evaporation method and dispersed manually into epoxy. Characterization techniques such as X-ray diffraction, Scanning electron microscopy and Transmission electron microscopy are used to investigate the phase analysis, size and shape as well as dispersion trend of a nano powder on epoxy matrix. Shielding effect is measured by standard test method to investigate the electromagnetic shielding effectiveness of planar materials, ASTM D4935. At lower frequency, sample consisting nano-powder of Fe-85%Wt Ni shows better electromagnetic shielding effect compared to only epoxy, only Ni, Fe2O3 and C-Ni samples.

The conductive polymer composites have attracted considerable attention in the field of industry due to their electrical properties. To understand electrical properties of the composites, their volume specific resistance was measured. Electrical conductivity results showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in the composites composed of conductive filler and insulating matrix. It was found that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. The purpose of this study was to examine electrical properties of the epoxy resins filled with nickel. The sample was prepared using vehicle such as epoxy resin replenished with nickel powder, and the evaluation on their practical use was performed in order to apply them to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 4.666~13.074 when using nickel powder. Weight loss of the conductive composites took place at 350℃~470℃.

Multi-walled carbon nanotube (MWCNT)/epoxy composites are prepared by a vacuum assisted resin transfer molding (VARTM) method. The mechanical properties, fracture surface morphologies, and thermal stabilities of these nanocomposites are evaluated for epoxy resins with various amounts of MWCNTs. Composites consisting of different amounts of MWCNTs displayed an increase of the work of adhesion between the MWCNTs and the matrix, which improved both the tensile and impact strengths of the composites. The tensile and impact strengths of the MWCNT/epoxy composite improved by 59 and 562% with 0.3 phr of MWCNTs, respectively, compared to the epoxy composite without MWCNTs. Thermal stability of the 0.3 phr MWCNT/epoxy composite increased compared to other epoxy composites with MWCNTs. The enhancement of the mechanical and thermal properties of the MWCNT/epoxy nanocomposites is attributed to improved dispersibility and strong interfacial interaction between the MWCNTs and the epoxy in the composites prepared by VARTM.

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from 350℃~470℃.

In this study, we experimented that how influence chain extension to waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and machanical properties. By instruments analysis measurement we confirmed that synthesis of epoxy and hybrid resin. In this experiment we knew that polyurethane-epoxy hybrid resin have 5 grades of solvent resistance. Tensile strength measured in the polyurethane-epoxy resin(EDA 5.37g, 2.386 kgf/mm2) had the most strong strength.. Also polyurethane-epoxy hybrid resin had better result(EDA 5.37g. 37.4 mg. loss) than other hybrid resins. As hight proportion of EDA in hybid resin, we obtained low elongation and low flexibility. In this result, chain extension of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of EDA.

The relative viscosity was measured at different filler loadings for a cycloaliphatic epoxy resin and hexahydro-4-methylphthalic anhydride hardener system filled with micro/nano hybrid silica. Various empirical models were fitted to the experimental data and a fitting parameter such as critical filler fractions (φmax) was estimated. Among the models, the Zhang-Evans model gave the best fit to the viscosity data. For all the silica loadings used, ln (relative viscosity) varied linearly with filler loadings. Using the Zhang-Evans model and the linearity characteristics of the viscosity change, simple methods to predict the relative viscosity below φmax are presented in this work. The predicted viscosity values from the two methods at hybrid silica fractions of φ = 0.086 and 0.1506 were confirmed for a micro:nano = 1:1 hybrid filler. As a result, the difference between measured and predicted values was less than 11%, indicating that the proposed predicting methods are in good agreement with the experiment.

In this study, we experimented that how to synthesis waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and TGA for the machanical properties. By instruments analysis measurement we confirmed that synthesis of urethane and epoxy. In this experiment we knew that polyurethane and urethane-epoxy hybrid resin have 4~5 grades of solvent resistance. Tensile strength measured in the urethane-epoxy resin(epoxy 12%, 2.033kgf/mm2) had the most strong strength than polyurethane(1.833 kgf/mm2) emulsion samples. Also urethane-epoxy hybrid resin had better result than polyurethane in acid resistance and abrasion test. As hight proportion of epoxy in hybid resin, we obtained low elongation and low flexibility. In this result, the mechanical properties of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of epoxy emulsion.

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.