The semiconductor and display industries require the development of plasma resistant materials for use in high density plasma etching process equipment. Yttria (Y2O3) is a ceramic material mainly used to ensure good plasma resistance properties, which requires a dense microstructure. In commercial production, a sintering process is applied to reduce the sintering temperature of Y2O3. In this study, the effect of the addition of glass frit to the sintered specimen was examined when manufacturing yttria sintered specimens for semiconductor process equipment parts. The Y2O3 specimen was shaped into a Ø50 mm size and then sintered at 1,600 °C for 1~8 h. The characteristics, X-ray diffraction pattern, densities, contraction rate of the specimen, and swelling of the surface of the Y2O3 specimens were investigated as a function of the sintering time and glass frit addition. The Y2O3 specimen exhibited a density of over 4.9 g/cm3 as the sintering time increased, and the swelling phenomenon characteristics were improved by glass frit, by controlling particle size.

본 연구는 고상폐기물인 준설토와 혼합물질인 점토 및 유리프리트를 이용하여 기능성을 갖는 건축자재용으로의 재활용 가능성을 검토하고자 실시되었다. D항만 준설토의 중금속 함량은 Zn이 526.0~13,150.1 mg/kg의 범위를 나타내는 등 심한 오염상태이었다. 준설토(30P)의 주요 화학조성은 SiO₂(48.30 wt%), Al₂O₃(16.60 wt%), CaO(10.10 wt%), Fe₂O₃(7.75 wt%)이었으며, 점토는 SiO₂가 70.82 wt%, Al₂O₃ 18.78 wt%, 유리프리트는 SiO₂가 71.75 wt%, CaO 13.99 wt%, Na₂O 8.51 wt% 함유되어 있었다. 준설토를 점토에 10~40 wt% 첨가한 후 1,000℃와 1,100℃에서 소성한 시편의 압축 강도는 각각 132.6~178.5 kgf/cm2와 581.2~793.7 kgf/cm²이었다. 준설토가 40 wt% 첨가된 경우 (SC46) 1,100℃에서 소성한 경우가 793.7 kgf/cm²로 1,000℃에서 소성한 경우의 153.0 kgf/cm² 보다 5배 이상 높게 나타나 1,100℃ 온도가 소성에 더 적합한 것으로 판단되었으며, KS 1종벽돌 기준을 만족시켰다. 또한, 시편의 용출시험 결과 폐기물관리법상 지정폐기물 판정기준치를 크게 하회하는 것으로 나타났다.

The effect of sintering aids and glass-frit on the densification and resistivity of silver paste was investigated in an effort to enhance the sintered density and electrical conductivity of the silver electrode. To prepare Pb-free silver paste for use at low sintering temperatures, two commercial silver powders (0.8 μm and 1.6 μm in size) and 5wt.% lab-synthesized nanoparticles (30-50 nm in size) as a sintering aids were mixed with 3 wt.% or 6 wt.% of glass frit (Bi2O3-based) using a solvent and three roll mills. Thick films from the silver paste were prepared by means of screen printing on an alumina substrate followed by sintering at 450˚C to 550˚C for 15 min. Silver thick films from the paste with bimodal particles showed a high packing density, high densification during sintering and low resistivity compared to films created using monomodal particles. Silver nanoparticles as a sintering aid enhanced the densification of commercial silver powder at a low sintering temperature and induced low resistivity in the silver thick film. The glass frit also enhanced the densification of the films through liquid phase sintering; however, the optimum content of glass frit is necessary to ensure that a dense microstructure and low resistivity are obtained, as excessive glass-frit can provoke low conductivity due to the interconnection of the glass phase with the high resistivity between the silver particles.

Effects of chemical compositions on the sintering behavior of the lead borosilicate glass developed for barrier ribs of plasma display panels were investigated in this study. Formation of pores during sintering of the glass was noted and their formation mechanism was investigated using XPS, TG/DTA, and XRD. The results indicated that pores are formed by the oxygen released from Pb-oxides during sintering.

실험계획법을 이용하여 유리분말의 소결시 그 기공량에 영향을 미치는 각종 소결조건의 영향을 정량적으로 조사하였다. 본 실험범위내에서 결합제 유리의 총기공량, 개기공량 그미고 폐기공량은 모두 소결온도에 의해 가장 큰 영향을 받고 그 다음으로 소결온도에서의 유지시간에 의해 영향을 받으며 승온속도의 경우 그 영향이 상대적으로 미미함을 확인할 수 있었다. 이러한 결과들로부터 실제공정에 있어 승온속도보다는 다른 소결인자, 특히 소결온도를 조절하는 것이 결합제 유리의 기공량 조절에 가장 중요하리라 판단되며 실험계획법을 이용함으로써 보다 정확한 공전조건을 모색할 수 있었다.