해양산업시설에서는 많은 종류의 유해물질의 배출 가능성이 존재하기 때문에 이에 대한 체계적인 대응체계가 필요하다. 그 중 연속자동 측정이 가능하면서 ppb 수준의 낮은 검출하한 (limit of detection:LOD)를 갖는 센서 구현은 매우 중요하다. 이를 위해 본 연구에서 는 활성탄소(carbon black)와 Indium tin oxide (ITO) 나노입자를 혼합한 film의 표면저항의 변화를 이용한 고성능 센서 제안 및 구현을 위해 성능인자를 최적화하였다. 센서 구조는 접촉 면적과 전극 간격을 최적화하였다. 접촉 면적이 증가하면 감도, LOD 성능이 향상되었으며 60 mm2에서 최적화되었다. 또한, 전극 간격은 접촉 면적을 일정하게 유지한 상태에서 변화시켰으며 센서 응답은 전극 간격이 감소함에 따라 증가하는 것을 확인하였다. 마지막으로 센서 표면에서의 유해물질의 잔류시간 증가를 위해 화학흡착제를 적용하였다. 화학흡착제는 유해 물질을 선택적으로 흡수할 수 있는 polyester계를 선택하였다. 그 결과 농도가 증가함에 따라 응답이 선형적으로 증가하여 센서로 활용이 가능한 것을 확인하였다. 이러한 3가지의 방법을 통해 센서를 제작하였을 때 액상 유해물질을 기존 센서의 LOD(89.9 ppb)와 비교 10~40 ppb 정도의 낮은 농도를 검출할 수 있는 센서를 구현하였다.

For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the “Newtonian flow” and has a low viscosity under 10 mPa·S, which is applicable to inkjet printing. The Cu patterns with a linewidth of 50~60 μm are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-comaleic acid)-free inks. The resistivities of Cu films are measured to be 10~15 μΩ·cm at annealing temperature of 300 ˚C.

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of CuSO4·5H2O as the main metal source, NaH2PO2·H2O as the reducing agent, C6H5Na3O7·2H2O and NH4Cl as the complex agents, and NiSO4·6H2O as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using NH4OH. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at 70˚C. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.