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The Effect of Deformation Stress-strain and Temperature on the Degradation of Bi-2223/Ag Tapes

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한국분말재료학회(구 한국분말야금학회) (Korean Powder Metallurgy Institute)
초록

In order to investigate 95% retained critical current of Bi-2223/Ag tapes under various stress-strain conditions, load cell attached tension and bending apparatus was used. The critical current of stress-strained tape was degraded below 95% retained critical current when tension and bending was simultaneously applied together. But only one of this tension or bending did not degrade the tape below 95% retained critical current. Deformation temperature was important to maintain the 95% retained Ic of Bi-2223/Ag tapes after bending or tension deformation because mechanical strength of tapes can be changed drastically between room temperature and 77 K.

저자
  • Ha
  • Hong-Soo
  • Kim
  • Sang-Cheol
  • Ha
  • Dong-Woo
  • Oh
  • Sang-Soo
  • Joo
  • Jin-Ho