Since korea must get 5.2% reduction of green gas emission and insecurity of economic impact is on the increase due to unstable oil market, the demands of energy saving techniques are increasing. In this paper, we investigate necessity of development of enormous energy used cleanroom energy saving techniques furthermore we also investigate the adoption of dependability management system to develop the energy saving cleanroom development process.

In recent semiconductor manufacturing clean rooms, air washers are used to remove airborne gaseous contaminants such as NH3, SOx and organic gases from outdoor air introduced into clean room. In order to improve the gas removal performance of the air washers, a hot water contact heat exchanger can be installed upstream of an air washer, heating and humidifying the incoming outdoor air before entering the air washer. In the present study, an experiment was carried out to examine closely the improvement of gas removal efficiency by the insertion of the hot water contact heat exchanger. The experiment showed that the gas removal efficiency was increased by the water vapor condensation effect.

Numerical analysis was conducted to characterize particle deposition on a heated rotating semiconductor wafer with respect to wafer diameter. The particle transport mechanisms considered in this study were convection, Brownian diffusion, gravitational settling, and thermophoresis. The averaged particle deposition velocities and their radial distributions on the upper surface of the wafer were calculated from the particle concentration equation in an Eulerian frame of reference at rotating speeds of 0 and 1000 rpm, wafer diameters of 100, 300 mm and wafer heating of =0 and 5K. It was observed from the numerical results that the averaged deposition velocities on the upper surface increase, when the wafer diameter confirms increase. The comparison of the present numerical results with the available experimental results showed relatively good agreement between different studies.

In recent models of semiconductor manufacturing clean rooms, air washers are used to remove airborne gaseous contaminants such as NH3, SOx and organic gases introduced from outdoor air into clean room. Meanwhile, there is a large quantity of exhaust air produced from clean room. It is desirable to recover heat from exhaust air and use it to reheat outdoor air. In the present study, an experiment was conducted to investigate heat recovery, particle collection, and gas removal in a heat recovery type air washer system for semiconductor manufacturing clean rooms.

건축물에서 사용되고 있는 건축 재료의 연소 특성 예측 및 성능 분류는 국내의 경우, 콘칼로리미터 시험 방법 등을 적용하여 건축법에서 불연/준불연/난연으로 구분하고 있다. 하지만 반도체 공정에서 사용되고 있는 고분자 재료 등에서는 이러한 열량 측정과 가스유해성 평가로는 정확한 연소 특성을 판단하기 어렵다. 건축물에서 화재위험성을 예측하고 대비하기 위해서는 사용되고 있는 재료에 대한 연소 특성 분석이 선행되어야 하며, 이를 위해서 재료가 연소되면서 발생되는 열량의 크기를 기본으로 하여 재료에 대한 연소 특성 예측 및 연소 성능 분류를 실시하고 있다. 하지만 점차 건축물에서는 다양한 재료가 사용되고 있고 이러한 재료에 대한 화재위험성은 열량 크기의 측정만으로는 한계를 가진다. 특히 플라스틱 재품은 발생되는 열량은 작지만 재료가 녹으면서 발생되는 가스 및 인접 재료에 대한 화재전파의 위험성을 높게 나타나고 있지만 현재 국내에서는 이러한 위험성을 예측할 수 있는 기준 및 시험방법이 미비한 실정이다. 따라서 본 연구에서는 FM 4910 시험 기준에 의해서 클린룸에서 사용되는 재료에 대한 연소특성을 예측하고 이를 토대로 하여 제시될 수 있는 연소 성능 기준에 대해 분석해 보고자 하였다.