The biocarbon (SKPH) was obtained from Sargassum spp., and it was evaluated electrochemically as support for the CO2 reduction. The biocarbon was synthesized and activated with KOH, obtaining a high surface area (1600 m2 g− 1) due to the activation process. Graphitic carbon formation after pyrolysis was confirmed by Raman spectroscopy. The XRD results show that SKPH has an amorphous structure with peaks corresponding to typical amorphous carbonaceous materials. FTIR was used to determine the chemical structure of SKPH. The bands at 3426, 2981, 2851, and 1604 cm− 1 correspond to O–H, C-H, and C-O stretching vibrations, respectively. Then, it compares SKPH films with different carbon films using two electrolytic systems with and without charge transfer. The SKPH film showed a capacitive behavior in the KOH, H2SO4, and, KCl systems; in the acid medium, the presence of a redox couple associated with carbon functional groups was shown. Likewise, in the [Fe(CN)6]−3 and Cu(II) systems, the charge transfer process coupled with a capacitive behavior was described, and this effect is more noticeable in the [Fe(CN)6]−3 system. Electrodeposition of copper on SKPH film showed two stages Cu(NH 3)2+ 4 /Cu(NH 3)+ 2 and Cu(NH 3)+ 2 ∕Cu in ammonia media. Hydrogen formation and the activity of CO2 are observed on SKPH film and are favored by the carbon’s surface chemistry. Cu/SKPH electrocatalyst has a catalytic effect on electrochemical reduction of CO2 and inhibition of hydrogen formation. This study showed that the SKPH film electrode responds as a capacitive material that can be used as an electrode for energy storage or as metal support.

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of CuSO4·5H2O as the main metal source, NaH2PO2·H2O as the reducing agent, C6H5Na3O7·2H2O and NH4Cl as the complex agents, and NiSO4·6H2O as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using NH4OH. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at 70˚C. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

황산구리 전해욕에 분산제인 콜로이달 실리카(SiO2현탁액)를 첨가시키는 분산도금의 방법과 Au pre-coating을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였다. 실리카 분산 및 Au pre-coating에 의하여 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였다. 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 15%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 구리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다.

황산구리 전해욕에 분산제인 콜리이달 실리카(SiO2현탁액)를 첨가시키는 분산도금의 방법을 이용하여 음극에 석출하는 전해 석출물의 결정구조, 표면형상, 결정방향 등의 변화를 검토하였고 내식성, 물리적 특성 또한 조사하였다. 콜로이달 실리카를 분산시킨 구리 전해욕의 석출피막의 특성에 대해서 조사한 결과, 다음과 같은 결론을 얻었다. 전해 석출피막의 결정입자가 미세화 되고, 균일하게 성장됨은 물론, 결정 수가 증가하였으며, 콜로이달 실리카의 분산 효과에 의해서 전해 석출피막의 경도가 대략 16%까지 상승하였다. 또한 콜로이달 실리카를 분산시킨 극리 전착층의 X-선 회절패턴이 (111)면, (200)면과 (311)면이 거의 소멸되어 우선 방위가 (111)에서 (110)면으로 변화되었다. 부식전위의 측면에서도 콜로이달 실리카의 흡착 효과에 의해서 구리 전착층의 전위가 귀하게 이동하는 효과를 얻을 수 있었다.

It is well known that the metallo- phthalocyanine (MPcs) are sensitive to toxic gaseous molecules such as NO2 and also chemically and thermally stable, Therefore, lots of MPcs have been studied for the potential chemical sensor for NO2 gas using quartz crystal microbalance(QCM) or electrical conductivity. In this study, ultra-thin films of octa(2-ethylhexyloxy)copper-phthalocyanine were prepared by Langmuir-Blodgett method and characterized by using UV-VIS absortion spectroscopy and ellipsometry. Transfer condition, and characterization of LB films were investigated and preliminary results of current-voltage(I-V) characteristics of these films exposed to NO2 gas as a function of film thickness and temperature were discussed.

ICB 공정으로 선행 증착한 Cu Seeding 층이 이후의 CVD 공정으로 증착하는 최종의 Cu 박막의 기계적 전기적 특성에 미치는 영향을 고찰하였고, seening을 하지 않은 CVD-Cu 박막과의 특성을 비교하였다. seeding 층을 형성한 경우의 CVD-Cu 박막에 있어서 증착 속도가 증가하였으며, grain 크기의 균일성도 향상되는 경향을 보였다. 증착된 Cu 박막은 seening에 무관하게 모두 FCC 우선배향인 (111)의 결정배향을 나타냈으며, seeding 우에 성정된 박막의 경우 I111/I200비가 향상되었다. 180˚C의 동일 조건하에서 증착하는 경우 40Å seeding층 위에 성장한 박막의 전기비저항이 2.42μΩ.cm로 낮은 값을 나타내었으며, 130Å seeding 경우는 오히려 전기비저항이 증가하는 경향을 나타내었다. Cu 박막의 접착력은 seeding층의 두께가 0Å에서 130Å으 증가함에 따라 21N에서 27N 으로 향상되었다.