We report the synthesis of bimetallic Cu-Au nanotubes (NTs) and Cu@Au core-shell nanowires (NWs) for use as anti-oxidative electrodes. The fabrication involved two key approaches: galvanic replacement to produce Cu-Au NTs and the physical deposition of Au to form Cu@Au core-shell NWs. The galvanic replacement process generated hollow NTs through the Kirkendall effect, driven by the unequal diffusion rates of Cu and Au during the redox reaction. In contrast, the physical deposition of Au, facilitated by fast reduction kinetics using L-ascorbic acid, enabled the formation of a Au shell encapsulating the Cu NWs, preserving their structural integrity. Morphological and structural analyses confirmed the successful formation of both nanostructures. While the Cu-Au NTs exhibited hollow interiors and increased dimensions, the Cu@Au NWs displayed a solid core-shell morphology with minimal diameter increase. Electrical conductivity and thermal stability tests revealed the superior performance of the Cu@Au NWs. The sheet resistance of Cu@Au NWs remained as low as 4 Ω sq-1 and showed exceptional thermal stability, with minimal resistance variation (R/Ro ~1.36) even after 36 h at 120 °C under ambient conditions. In contrast, the Cu-Au NTs suffered rapid oxidation and structural instability. The physical deposition approach holds significant promise for the development of robust, low-resistance electrodes for long-term applications in harsh environments.

Using current-voltage (I-V) and capacitance-voltage (C-V) measurements, the electrical properties of Au and Cu Schottky contacts to n-Ge were comparatively investigated. Lower values of barrier height, ideality factor and series resistance were obtained for the Au contact as compared to the Cu contact. The values of capacitance showed strong dependence on the bias voltage and the frequency. The presence of an inversion layer at the interface might reduce the intercept voltage at the voltage axis, lowering the barrier height for C-V measurements, especially at lower frequencies. In addition, a higher interface state density was observed for the Au contact. The generation of sputter deposition-induced defects might occur more severely for the Au contact; these defects affected both the I-V and C-V characteristics.

A semi-empirical method to estimate the surface tension of molten alloys at different oxygen partialpressures is suggested in this study. The surface tension of molten Ag-Sn and Ag-Cu alloys were calculatedusing the Butler equation with the surface tension value of pure substance at a given oxygen partialpressure. The oxygen partial pressure ranges were 2.86×10-12－1.24×10-9Pa for the Ag-Sn system and2.27×10-11－5.68×10-4 Pa for the Ag-Cu system. In this calculation, the interactions of the adsorbed oxygenwith other metallic constituents were ignored. The calculated results of the Ag-Sn alloys were in reasonableaccordance with the experimental data within a difference of 8%. For the Ag-Cu alloy system at a higheroxygen partial pressure, the surface tension initially decreased but showed a minimum at XAg = 0.05 to increaseas the silver content increased. This behavior appears to be related to the oxygen adsorption and thecorresponding surface segregation of the constituent with a lower surface tension. Nevertheless, the calculatedresults of the Ag-Cu alloys with the present model were in good agreement with the experimental data withina difference of 10%.

Si(100)기판상에 여러 가지 두께의 Au박막을 선행 증착(pre-deposition)한 후, 각각의 Au박막상에서의 Cu-MOCVD박막의 초기 핵생성과 성장 기구를 고찰하였고, 또한 각 계면에서의 상호 확산 거동을 여러가지의 분석 장비를 이용하여 조사하였다. 30Å두께의 Au 박막은 수소 가스 분위기중의 열처리에 의하여 평탄한 표면 상태에서 불연속의 응집된 도상(island)형태로 변화(Si 전체 표면중 약 20%)하였다. 반면에 1500Å두께의 Au박막상에서 성장한 Cu-MOCVD박막은 두께 증가에 따른 미세구조의 차이, 즉 Cu박막중으로 Au원자의 확산여부는 Au박막에 유기되는 열응력(thermal stress)을 완화하는 과정에서 일어난 결과이다.

페루 남동부 아뿌리막주 일대에 부존하는 트라피체 및 콘스탄시아 동-몰리브데늄-금광상의 새로운 U-Pb, Re-Os 지질연대 및 납동위원소 분석결과가 제시되었다. 금번 지질연대는 상기 지역에 대해 보고된 28~33 Ma 광화연령 구간의 첫 번째 광역적 펄스에 해당된다. 그리고 납동위원소 결과는 두 개의 광화작용 기원을 제시한다. 첫 번째는 상부지각에서 유래한 것이며 두 번째는 상부지각 및 하부지각의 혼합물로부터 기인한 것으로 사료된다.