The optical film for light luminance improvement of back light unit that is used in light emitting diode/liquid crystal display and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimized as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Variation of Burr and chip shape were discussed by material properties and machining method.

Micro trench structures are applied in gratings, security films, wave guides, and micro fluidics. These micro trench structures have commonly been fabricated by micro electro mechanical system (MEMS) process. However, if the micro trench structures are machined using a diamond tool on large area plate, the resulting process is the most effective man- ufacturing method for products with high quality surfaces and outstanding optical characteristics. A nonferrous metal has been used as a workpiece; recently, and hybrid materials, including polymer materials, have been applied to mold for display fields. Thus, the machining characteristics of polymer materials should be analyzed. In this study, machining characteristics were compared between nonferrous metals and polymer materials using single crystal diamond (SCD) tools; the use of such materials is increasing in machining applications. The experiment was conducted using a square type diamond tool and a shaper machine tool with cutting depths of 2, 4, 6 and 10 µm and a cutting speed of 200 mm/s. The machined surfaces, chip, and cutting force were compared through the experiment.

Many countries are enforcing the Product Liability Act to ask the responsibility for the supply of the safe products. Thus, the safety of the product becomes one of the most important elements in modern corporate management. Diamond tool industries producing risk-high products cannot make an except to this situation. This research presents how Diamond tool manufactures in korea to respond effectively to Product Liability through construction of Product Safety Management System.

This article presents the successful consolidation of the mixed Co and Diamond powders for a drilling segment by the combined application of magnetic pulsed compaction (MPC) and subsequent sintering, and their properties were analyzed. Homogeneous hardness (Hv 220) and density (97%) of sintered bulks fabricated by MPC were obtained by the new technique, where higher pressure has been employed for short period of time than that of general process. A fine microstructure and homogeneous hardness in the consolidated bulk were observed without cracks. Relatively higher drilling speed of 9.61 cm/min and life time of 6.55 m were found to the MPCed specimens, whereas the value of the specimens fabricated by general process was 11.71 cm/min and 7.96 m, respectively. A substantial improvement of mechanical properties of segment was achieved through this study.

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.

A new extra-fine grade Ni powder (XF Ni) has demonstrated increased sintering activity in Co-Fe-Ni binders for diamond tool applications. XF Ni has the advantage of significantly lower cost than XF Co. Up to 30% of XF Co was substituted with XF Ni while maintaining comparable apparent hardness and transverse rupture strength to pure Co binders. Ni substantially increased the diffusion of Fe. Diamond tool producers can take advantage of the improved sintering properties of XF Ni powder to substantially lower material costs.

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond cohesion. Strong cohesion between diamond and metal matrix prevents macro scratch on the wafer during CMP Process. Typically the diamond tool has been manufactured by sintered, brazed and electro-plated methods. In this paper, some results will be reported of cohesion between diamond and metal matrix of the diamond tools prepared by three different manufacturing methods. The cohesion force of brazed diamond tool is found stronger than the others. This cohesion force is increased in reverse proportion to the contact area of diamond and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of Cr in metal matrix and C in diamond, which enhance the interfacial cohesion strength between diamonds and metal matrix.