This paper presents a study of large grains by transmission electron microscopy in two WC-Co alloys, one W rich and one C rich. In the W rich alloy, some large grains are found in contact with the phase. The C content influences the morphology of large grains: they are flatter in the C rich alloy with smoother interfaces. Whatever the C content, they contain few dislocations compared to matrix grains except often in a small area. Small WC grains are often found inside the large grains. They have likely been engulfed during the growth of the large grains owing to the low boundary energy.

The driving forces and the probable processes of WC-Co grain growth are reanalysed from recent data of interface energy and microstructure. Grain growth is driven by the disappearing of the high energy WC/WC and WC/Co interfaces with habit planes different from {0001}, and facets and by the area decrease of the WC/WC and WC/Co interfaces with {0001} and habit planes. Grain growth mainly results of dissolution-precipitation. Abnormal grains are likely formed by defects assisted nucleation.

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smooths the composition gradient. Perspectives to control this migration are discussed.