While a wide ranges of previous researches on rapid construction of super structures are available, the studies on substructures are quite limited. The development of the precast segmental CFDST piers are briefly introduced herein and design formulas are presented for pier segment and Coping, Foundation joints. And present connect method for unit of Precast Bent Cap. The self-assembly Fabricated CFDST column is developed after the pros and cons are supplemented by the Experimental Study with the suggested connecting method.

개발된 완전 조립식 교량 하부구조에 대한 설계비교와 비선형 해석을 수행하였다. 조립식 교량 하부구조는 현행설계법과 하중저항계수설계법으로 설계하였다. 설계시에는 현 도로교설계기준에 규정된 DB-24 및 DL-24 설계활하중을 적용하였다. 이 연구는 비선형 유한요소해석을 통해서 완전 조립식 교량 하부구조의 현행 설계법인 KHBD (2005)와 AASHTO-LRFD (2007)를 평가하였다. 사용된 프로그램은 철근콘크리트 구조물의 해석을 위한 RCAHEST이다.

본 연구는 조립식 콘크리트 포장 공법을 이용하여 도심지 버스전용차로의 정거장 구간 아스팔트 포장을 강성 포장으로 교체하는 시공을 수행한 후 이러한 포장의 초기 공용성을 분석하기 위해 수행되었다. 추적조사 항목으로는 조립식포장의 진출입 구간에서 아스팔트 포장과 조립식포장과의 단차, 프리캐스트 슬래브간의 줄눈 간격 및 단차, 슬래브의 침하, 슬래브의 미끄럼저항 성능 등을 선정하였으며, 다이아몬드 그라인딩 공법의 적용성도 분석하였다. 추적조사 결과 조립식포장의 단차, 줄눈 간격, 미끄럼저항, 침하 등은 시간에 따라 변화가 거의 없었으며, 이를 통해 프리캐스트 슬래브가 차량하중을 안정되게 지지한다는 것을 알 수 있었다. 또한 다이아몬드 그라인딩 공법을 적용하면 슬래브의 단차 및 미끄럼저항 성능을 크게 개선할 수 있는 것도 확인할 수 있었다.

This research deals with multiple Gantry-type assembly machines for the optimization of PCB assembly line. The automated assembly machine has 6 nozzles which can linearly move the X axis and the Y axis different from the turret type assembly machine. Each

This paper considers a 2-stage assembly flowshop scheduling problem where each job is completed by assembling multiple components. The problem has the objective measure of minimizing total completion time. The problem is shown to be NP-complete in the str

본 연구는 조립식 콘크리트 포장 공법을 이용한 급속 도로 포장 보수 방법의 적용성을 분석하기 위하여 시험시공을 수행하고, 슬래브 접합 방식의 효과를 분석하기 위해 수행되었다. 시험시공은 줄눈콘크리트포장의 4개 슬래브를 교체하는 것으로 하였다. 시험시공을 위해 프리캐스트 슬래브를 설계하고 제작한 후, 기존 슬래브를 커팅하여 제거한 후 이 곳에 제작한 슬래브를 안착시켰다. 그 후 평탄성을 조절한 후 포켓 및 홀 부분과 슬래브 하부의 공간을 그라우팅 함으로써 시공을 신속 용이하게 수행할 수 있었다. 시험 시공을 수행하며 보수용 프리캐스트 포장의 설계 및 시공과 관련된 세부 사항을 면밀히 분석하였다. 또한 슬래브 간의 연결을 위한 방식으로 포켓과 홀 접합 방식을 모두 적용해 보았으며 실험을 통해 두 접합 방식에서의 슬래브의 컬링 거동을 비교하였다. 연구 결과 두 방식 모두 적용성이 우수했으나, 홀 접합 방식이 보다 적절한 것으로 파악되었다.

Hexagonal barium ferrite () nano-particles have been successfully fabricated by spraypylorysis process. precursor solutions were synthesized by self-assembly method. Diethyleneamine (DEA) surfactant was used to fabricate the micelle structure of Ba-DEA complex under various DEA concentrations. powders were synthesized with addition of Fe ions to Ba-DEA complex and then fabricated powders by spray-pyrolysis process at the temperature range of . The molar ratio of Ba/DEA and heat-treatment temperatures significantly affected the magnetic properties and morphology of powders. powders synthesized with Ba/DEA molar ratio of 1 and heat-treated at showed the coercive forces (iHc) of 4.2 kOe with average crystal size of about 100 nm.

In an automated industry PLC plays a central role to control the manufacturing system. Therefore, fault free operation of PLC controlled manufacturing system is essential in order to maximize a firm's productivity. On the contrary, distributed nature of manufacturing system and growing complexity of the PLC programs presented a challenging task of designing a rapid fault finding system for an uninterrupted process operation. Hence, designing an intelligent monitoring, and diagnosis system is needed for smooth functioning of the operation process. In this paper, we propose a method to continuously acquire a stream of PLC signal data from the normal operational PLC-based manufacturing system and to generate diagnosis model from the observed PLC signal data. Consequently, the generated diagnosis model is used for distinguish the possible abnormalities of manufacturing system. To verify the proposed method, we provided a suitable case study of an assembly line.

The emission characteristics of VOCs (Volatile Organic Compounds) from assembly metal product manufacturing industry (Korean standard industry classification code: 28) were studied. The sampling was carried out at 54 sites in Shiwha-Banwol industrial area with 3 M OVM (Organic Vapor Monitor) #3500 from August to October in 2008. The EPA 8020/8040 (10 chemicals) was used as a standard solution for the quantitative analysis with GC/FID. As the results, the VOCs concentration appeared to range from 0.9 ppb to 22,721.1 ppb, and the average concentration ratio of benzene : toluene : ethylbenzene : m,p-xylene : o-xylene : styrene appeared to be 0.005 : 1.000 : 0.198 : 0.096 : 0.057 : 0.110. Total VOC concentration of the "Manufacture of Structural Metal Products, Tanks, Reservoirs and Steam Generators" (KSIC code: 281) appeared to be seven times higher than that of "Manufacture of other fabricated metal products; metal working service activities" (KSIC code: 289).

Surface modification of silica nanoparticles was investigated using an aerosol self assembly. Stearic acid was used as surface treating agent. A two-fluid jet nozzle was employed to generate an aerosol of the colloidal suspension, which contained 20 nm of silica nanoparticles, surface modifier, and ethyl alcohol. Powder properties such as morphology, specific surface area and pore size distribution were analyzed by SEM, BET and BJH methods, respectively. Surface properties of the silica power were analyzed by FT-IR. The OH bond of the SiO2 surface was converted to a C-H bond. It was revealed that the hydrophilic surface changed to a hydrophobic one due to the aerosol self assembly. Morphology of the surface treated powder was nanostructured with lots of pores having an average diameter of around 2 μm. Depending on the stearic acid concentration (0.25 to 1.0 wt%), the pore size distribution of the particles and the degree of hydrophobicity ranged from 1.5 nm to 180 nm and 29.6% to 50.2%, respectively.

Hexagonal barium ferrite () nano-particles have been successfully synthesised using selfassembly method. Diethyleneamine (DEA) surfactant was used to fabricate the micelle structure of Ba-DEA complex under various DEA concentrations. powders were synthesized with addition Fe ions to Ba-DEA complex and then heat treated at temperature range of 800-1000. The molar ratio of Ba/DEA and heat-treatment temperature significantly affected the magnetic properties and morphology of powders. powders synthesized with Ba/DEA molar ratio of 1 and heat-treated at 1000 for 1 hour showed the coercive forces (iHc) of 4.84 kOe with average crystal size of about 200 nm.

This paper considers a coordinated scheduling problem between multi-suppliers and an manufacture. When the supplier has insufficient inventory to meet the manufacture's order, the supplier may use the expedited production and the expedited transportation. In this case, we consider a scheduling problem to minimize the total cost of suppliers and manufacture. We suggest an population management genetic algorithm with local search and crossover (GALPC). By the computational experiments comparing with general genetic algorithm, the objective value of GALPC is reduced by 8% and the calculation time of GALPC is reduced by 70%.

Robotic manipulators are increasingly deployed in complex environments or to perform complex tasks. Studies on dual-arm-robots have been continually carried out in robotics areas to provide robots in dangerous environments, similar to those which human beings would be normally in, without a special change to the working environment. In previous study, a dual-arm-robot has been designed. The robot, however, has some defects in its heavy weight and big shape. In order to reduce weight of an arm robot, the robot has been designed using a hollow-shaft-servo- assembly. The hollow-shaft-servo-assembly is composed of a hollow-shaft-servo-motor, a hollow- shaft-harmonic-drive, a hollow-shaft-brake, a hollow-shaft-encoder, and a servo-drive.

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.