The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150oC in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

본 연구는 통상 muntz metal로 불리는 구리와 아연의 합금 금속의 산화 환원 반응을 이용한 폐수 중 탈인 처리에 관한 연구이다. 연구를 위하여 200 ㎛ 두께의 극세사 형태로 제조된 구리 아연 금 속합금이 수용액 중에서 산화 환원 반응 작용으로 인하여 발생하는 OH radical을 이용하여 금속과 phosphate의 공침 반응에 의해 탈인 처리되는 원리를 이용한 인 처리법에 관한 연구이다. 인 제거 효율은 장시간의 순환 처리보다는 1회 처리에서 가장 제거 효율이 높았으며, 1시간 이후의 순환처리에서는 더 이 상의 제거효율을 보이지 않았다. 이는 금속합금 물질은 표면적이 넓어서 1회 처리만으로도 수용액의 pH 를 평형에 도달하게 하여 반응 효율이 높은 것으로 나타났다. 제조한 합성폐수의 pH 조건은 pH 5 에서 pH 9 사이이며, pH 8일 때 제거 효율이 가장 높았으며 pH 8 이상에서는 효율 증가를 보이지 않았다. 이때 인산염은 H2PO4 -, HPO4 2-의 형태로 가장 많이 존재하는 것으로 조사되었으며, 온도에 따른 인 제 거는 온도만의 영향이 아닌 타 영향인자와의 관계를 고려해야 하며 본 연구에서는 온도가 낮을수록 높은 인 제거 효율을 보였다.

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of Cu2O or Cu(OH)2 layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

The present study deals with the effects of tempering treatment on the microstructure and mechanical properties of Cu-bearing high-strength steels. Three kinds of steel specimens with different levels of Cu content were fabricated by controlled rolling and accelerated cooling, ; some of these steel specimen were tempered at temperatures ranging from 350˚C to 650˚C for 30 min. Hardness, tensile, and Charpy impact tests were conducted in order to investigate the relationship of microstructure and mechanical properties. The hardness of the Cu-added specimens is much higher than that of Cu-free specimen, presumably due to the enhanced solid solution hardening and precipitation hardening, result from the formation of very-fine Cu precipitates. Tensile test results indicated that the yield strength increased and then slightly decreased, while the tensile strength gradually decreased with increasing tempering temperature. On the other hand, the energy absorbed at room and lower temperatures remarkably increased after tempering at 350˚C; and after this, the energy absorbed then did not change much. Suitable tempering treatment remarkably improved both the strength and the impact toughness. In the 1.5 Cu steel specimen tempered at 550˚C, the yield strength reached 1.2 GPa and the absorbed energy at -20˚C showed a level above 200 J, which was the best combination of high strength and good toughness.

Microstructural and mechanical characteristics of Al-6Si-2Cu alloy for lightweight automotive parts were investigated. The test specimens were prepared by gravity casting process. Solution heat treatments were applied to as-cast alloys to improve mechanical properties. The microstructure of the gravity casting specimen presents a typical dendrite structure, having a secondary dendrite arm spacing (SDAS) of 37μm. In addition to the Al matrix, a large amount of coarsened eutectic Si, Al2Cu intermetallic phase, and Fe-rich phases were identified. After solution heat treatment, single-step solution heat treatments were found to considerably improve the spheroidization of the eutectic Si phase. Two-step solution treatments gave rise to a much improved spheroidization. The mechanical properties of the two-step solution heat treated alloy have been shown to lead to higher values of properties such as tensile strength and microhardness. Consequentially, the microstructural and mechanical characteristics of Al alloy have been successfully characterized and are available for use with other basic data for the development of lightweight automotive parts.

Effects of Cu and B on effective grain size and low-temperature toughness of thermo-mechanically processed high-strength bainitic steels were investigated in this study. The microstructure of the steel specimens was analyzed using optical, scanning, and transmission electron microscopy; their effective grain size was also characterized by electron back-scattered diffraction. To evaluate the strength and low-temperature toughness, tensile and Charpy impact tests were carried out. The specimens were composed of various low-temperature transformation products such as granular bainite (GB), degenerated upper bainite (DUB), lower bainite (LB), and lath marteniste (LM), dependent on the addition of Cu and B. The addition of Cu slightly increased the yield and tensile strength, but substantially deteriorated the low-temperature toughness because of the higher volume fraction of DUB with a large effective grain size. The specimen containing both Cu and B had the highest strength, but showed worse low-temperature toughness of higher ductile-brittle transition temperature (DBTT) and lower absorbed energy because it mostly consisted of LB and LM. In the B-added specimen, on the other hand, it was possible to obtain the best combination of high strength and good low-temperature toughness by decreasing the overall effective grain size via the appropriate formation of different low-temperature transformation products containing GB, DUB, and LB/LM.

This study is a basic research for repair material production which manufactured a Cu repair coating layer on the base material of a Cu plate using kinetic spray process. Furthermore, the manufactured material underwent an annealing heat treatment, and the changes of microstructure and macroscopic properties in the Cu repair coating layer and base material were examined. The powder feedstocks were sphere-shaped pure Cu powders with an average size of 27.7μm. The produced repair coating material featured 600μm thickness and 0.8% porosity, and it had an identical α-Cu single phase as the early powder. The produced Cu repair coating material and base material displayed extremely high adhesion characteristics that produced a boundary difficult to identify. Composition analysis confirmed that the impurities in the base material and repair coating material had no significant differences. Microstructure observation after a 500℃/1hr. heat treatment (vacuum condition) identified recovery, recrystallization and grain growth in the repair coating material and featured a more homogeneous microstructure. The hardness difference (δHv) between the repair coating material and base material significantly reduced from 87 to 34 after undergoing heat treatment.

해산규조류 Skeletonema cosatatum의 개체군성장률 (r) 을 사용하여 중금속 3종(Cd, Cu, Zn)의 독성영향 평가를 수행하였다. S. costatum을 Cd (0, 0.63, 1.25, 2.50, 5.00, 10.00 ppm), Cu (0, 0.25, 0.50, 0.75, 1.00, 1.25, 1.50 ppm) 그리고 Zn (0, 0.31, 0.63, 1.25, 2.00, 2.50, 5.00 ppm)에 노 출하고 96 h 이후에 r 값을 도출하였다. 대조구(Cd, Cu 그 리고 Zn을 포함하지 않은)에서 r은 0.05보다 높았으며 중금속 농도가 증가할수록 r은 감소하였다. 중금속에 의 해 농도의존적으로 r이 감소되었고 Cd 농도 1.25, Cu 농 도 1.25 그리고 Zn 농도 2.50 ppm 이상의 농도에서 명확 한 감소를 나타냈다. 중금속의 독성영향은 Cu¤Zn¤Cd 순서이며, 이때 EC50 값은 각각 1.11, 2.13 그리고 6.84 ppm으로 나타났다. 중금속 3종(Cd, Cu 그리고 Zn)에 노 출된 r의 최소영향농도는 각각 1.25, 1.00, 2.00 ppm으로 나타났다. 이 결과를 바탕으로, 해양환경에서 S. costatum 의 r은 Cd 농도가 1.25 ppm 이상, Cu 농도가 1.00 ppm 이 상, Zn 농도가 2.00 ppm 이상인 경우에 독성영향을 받았 다. 그러므로 S. costatum의 r은 해양환경에서 중금속 독 성영향 평가를 위한 매우 유용한 방법으로 판단된다.

Cu2O nanowires were synthesized at large scale on copper plate by thermal oxidation in air. The effect of oxidation time and temperature on the morphology of the nanowires was examined. The oxidation time had no effect on the diameter of the nanowires, while it had a great effect on the density and the length of the nanowires. The density and the length of the nanowires increased, and then decreased, with increasing oxidation time. The oxidation temperature had a tremendous effect on the size-distribution as well as the density of the nanowires. When the oxidation temperature was 700˚C, uniform size-distribution and high density of the nanowires was achieved. At lower and higher temperatures, the density of the nanowires was lower, and they displayed a broader size-distribution. It is suggested that the Cu2O nanowires were grown via a vapor-solid mechanism because no catalyst particles were observed at the tips of the nanowires.

This study was performed to obtain high conversion efficiency of NH3 and minimize generation of nitrogen oxides using metal-supported catalyst with Ag : Cu ratio. Through structural analysis of the prepared catalyst with Ag : Cu ratio ((10-x)Ag–xCu (0≤ x ≤6)), it was confirmed that the specific surface area was decrease with increasing metal content. A prepared catalysts showed Type Ⅱ adsorption isotherms regardless of the ratio Ag : Cu of metal content, and crystalline phase of Ag2O, CuO and CuAl2O was observed by XRD analysis. In the low temperature(150∼200 ℃), a conversion efficiency of AC_10 recorded the highest(98%), whereas AC_5 (Ag : Cu = 5 : 5) also showed good conversion efficiency(93.8%). However, in the high temperature range, the amounts of by-products(NO, NO2) formed with AC_5 was lower than that of AC_10. From these results, It is concluded that AC_5 is more environmentally and economically suitable.

This study manufactured a CIG-based composite coating layer utilizing a new warm spray process, and amixed powder of Cu-20at.%Ga and Cu-20at.%In. In order to obtain the mixed powder with desired composition, theCu-20at.%Ga and Cu-20at.%In powders were mixed with a 7:1 ratio. The mixed powder had an average particle size of35.4 µm. Through the utilization of a warm spray process, a CIG-based composite coating layer of 180 µm thicknesscould be manufactured on a pure Al matrix. To analyze the microstructure and phase, the warm sprayed coating layerunderwent XRD, SEM/EDS and EMPA analyses. In addition, to improve the physical properties of the coating layer, anannealing heat treatment was conducted at temperatures of 200℃, 400℃ and 600℃ for 1 hour each. The microstructureanalysis identified α-Cu, Cu4In and Cu3Ga phases in the early mixed powder, while Cu4In disappeared, and additionalCu9In4 and Cu9Ga4 phases were identified in the warm sprayed coating layer. Porosity after annealing heat treatmentreduced from 0.75% (warm sprayed coating layer) to 0.6% (after 600℃/1 hr. heat treatment), and hardness reducedfrom 288 Hv to 190 Hv. No significant phase changes were found after annealing heat treatment.

This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freezedrying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved usingthe Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at -25oC were generated bysublimation of the camphene during drying in air, and the green bodies were sintered at 750oC for 1 h in H2 atmo-sphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without anyreaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partlylarge pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large andaligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cupowders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rear-rangement and dispersion stability in slurry.

In this study, nanocrystalline Cu-Ni bulk materials with various compositions were cold compacted by a shock compaction method using a single-stage gas gun system. Since the oxide layers on powder surface disturbs bonding between powder particles during the shock compaction process, each nanopowder was hydrogen-reduced to remove the oxide layers. X-ray peak analysis shows that hydrogen reduction successfully removed the oxide layers from the nano powders. For the shock compaction process, mixed powder samples with various compositions were prepared using a roller mixer. After the shock compaction process, the density of specimens increased up to 95% of the relative density. Longitudinal cross-sections of the shock compacted specimen demonstrates that a boundary between two powders are clearly distinguished and agglomerated powder particles remained in the compacted bulk. Internal crack tended to decrease with an increase in volumetric ratio of nano Cu powders in compacted bulk, showing that nano Cu powders has a higher coherency than nano Ni powders. On the other hand, hardness results are dominated by volume fraction of the nano Ni powder. The crystalline size of the shock compacted bulk materials was greatly reduced from the initial powder crystalline size since the shock wave severely deformed the powders.

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

Wastewater containing heavy metals such as copper (Cu) and nickel (Ni) is harmful to humans and the environment due to its high toxicity. Crystallization in a fluidized bed reactor (FBR) has recently received significant attention for heavy metal removal and recovery. It is necessary to find optimum reaction conditions to enhance crystallization efficacy. In this study, the effects of crystallization reagent and pH were investigated to maximize crystallization efficacy of Cu-S and Ni-S in a FBR. CaS and Na2S·9H2O were used as crystallization reagent, and pH were varied in the range of 1 to 7. Additionally, each optimum crystallization condition for Cu and Ni were sequentially employed in two FBRs for their selective removal from the mixture of Cu and Ni. As major results, the crystallization of Cu was most effective in the range of pH 1-2 for both CaS and Na2S·9H2O reagents. At pH 1, Cu was completely removed within five minutes. Ni showed a superior reactivity with S in Na2S·9H2O compared to that in CaS at pH 7. When applying each optimum crystallization condition sequentially, only Cu was firstly crystallized at pH 1 with CaS, and then, in the second FBR, the residual Ni was completely removed at pH 7 with Na2S·9H2O. Each crystal recovered from two different FBRs was mainly composed of CuxSy and NiS, respectively. Our results revealed that Cu and Ni can be selectively recovered as reusable resources from the mixture by controlling pH and choosing crystallization reagent accordingly.

To realize high-performance thin film solar cells, we prepared CIGS by the co-evaporation technique on both sodalime and Corning glass substrates. The structural and efficient properties were investigated by varying the thickness of the Mo:Na layer, where the total thickness of the back contact was fixed at 1μm. As a result, when the Mo:Na thickness was 300 nm on soda-lime glass, the measured Na content was 0.28 %, the surface morphology was a plate-like compact structure, and the crystallinity by XRD showed a strong peak of (112) preferential orientation together with relatively intense (220) and (204) peaks as the secondary phases influenced crystal formation. In addition, the substrates on soda-lime glass effected the lowest surface roughness of 2.76 nm and the highest carrier density and short circuit current. Through the optimization of the Mo:Na layer, a solar conversion efficiency of 11.34% was achieved. When using the Corning glass, a rather low conversion efficiency of 9.59% was obtained. To determine the effects of the concentration of sodium and in order to develop a highefficiency solar cells, a very small amount of sodium was added to the soda lime glass substrate.

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.