Multi-walled carbon nanotube (MWCNT)–copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT–Cu composites. The electrical conductivities of MWCNT–Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT–Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.

The metal plating industry produces a large amount of wastewater generally containing heavy metals with various chemical compounds; as such, treating the wastewater is both an environmental and an economic challenge. A vacuum evaporation system has been developed to effectively reduce the volume of plating wastewater. However, the gas stream discharged from the distillation unit of the evaporator is often contaminated with high concentrations of odorous compounds such as ammonia and dimethyl disulfide (DMDS). In this study, a non-thermal plasma process operated in wet conditions was applied to remove the odorous compounds, and it showed high removal efficiencies of greater than 99% for ammonia and 95% for DMDS. However, the gas flowrate more substantially affected the efficiency of ammonia removal than the efficiency of DMDS removal, because the higher the gas flowrate, the shorter the contact time between the odorous compound and the mist particles in the wet plasma reactor. The analyses of the maximum removal capacity indicated that the wet non-thermal plasma system was effective for treating the odorous compounds at a loading rate of less than 20 mg/m3/min even though the lowest amount of electrical power was applied. Therefore, the wet-type non-thermal plasma system is expected alleviate to effectively abate the odor problem of the vacuum evaporator used in the treatment of plating wastewater.

Odor compounds and air-born microorganisms are simultaneously emitted from various aeration processes such as aerobic digestion, food-waste compositing, and carcass decomposition facilities that are biologically-treating wastes with high organic contents. The air streams emitted from these processes commonly contain sulfur-containing odorous compounds such as hydrogen sulfide(H2S) and bacterial bioaerosols. In this study, a wet-plasma method was applied to remove these air-born pollutants and to minimize safety issues. In addition, the effects of a gas retention time and a liquid-gas ratio were evaluated on removal efficiencies in the wet-plasma system. At the gas reaction time of 1.8 seconds and the liquid-gas ratio of 0.05 mLaq/Lg, the removal efficiency of bioaerosol was approximately 75 %, while the removal efficiency of H2S was lower than 20 %, indicating that the gaseous compound was not effectively oxidized by the plasma reaction at the low liquid addition. When the liquid-gas ratio was increased to 0.25 mLaq/Lg, the removal efficiencies of both H2S and bioaerosol increased to greater than 99 %. At the higher liquid-gas ratio, more ozone was generated by the wet-plasma reaction. The ozone generation was significantly affected by the input electrical energy, and it needed to be removed before discharged from the process.