Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m−1K−1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10−6 to 3.06 × 10−6 K−1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

SiHCl3를 제조하는 공정에서 배출되는 클로로실란 혼합가스 중 수소의 재이용을 위하여 분리공정이 필수적이며, Pd계 분리막이 사용될 수 있다. 일반적인 Pd분리막의 경우 300°C 이하에서 수소 흡착에 의한 취성문제와 공존하는 불순물가스에 의한 손상문제가 있을 수 있다. 따라서 본 연구에서는 이를 해결하고자 Pd layer 위에 Ru을 무전해 도금하여 Pd/Ru 복합 분리막을 제조하였고 저온에서 수소 투과도 및 안정성을 평가한 결과 180°C에서 50일 동안 수소에 의한 취성이 발생하지 않았으며 1.8 m3m-2h-1의 안정적인 투과량을 나타내었고. 또한 5% HCl, 0.5% SiHCl3가 포함된 가스를 225°C의 온도에서 2 bar로 주입하였을 때 9 hr 동안 Pd/Ru 복합 분리막이 손상되지 않고 수소의 투과량이 2.0 m3m-2h-1 이상으로 유지됨을 확인하였다.

Simultaneous Ni and C codeposition by electrolysis was investigated with the aim of obtaining better corrosionresistivity and surface conductivity of a metallic bipolar plate for application in fuel cells and redox flow batteries. The carboncontent in the Ni-C composite plate fell in a range of 9.2~26.2at.% as the amount of carbon in the Ni Watt bath and theroughness of the composite were increased. The Ni-C composite with more than 21.6at.% C content did not show uniformlydispersed carbon. It also displayed micro-sized defects such as cracks and crevices, which result in pitting or crevice corrosion.The corrosion resistance of the Ni-C composite in sulfuric acid is similar with that of pure Ni. Electrochemical test results suchas passivation were not satisfactory; however, the Ni-C composite still displayed less than 10−4A/cm2 passivation currentdensity. Passivation by an anodizing technique could yield better corrosion resistance in the Ni-C composite, approaching thatof pure Ni plating. Surface resistivity of pure Ni after passivation was increased by about 8% compared to pure Ni. On theother hand, the surface resistivity of the Ni-C composite with 13at.% C content was increased by only 1%. It can be confirmedthat the metal plate electrodeposited Ni-C composite can be applied as a bipolar plate for fuel cells and redox flow batteries.

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7 .

SiC 보강재 표면에 도금된 Cu금속층이 Al/SiC복합재료의 젖음성에 미치는 영향을 검토하였다. 보강재에 대한 금속층의 도금은 무전해도금법을 이용하였으며, Al/SiC 복합재료의 제조는 텅스텐 발열체 진공로의 670˚C~900˚C에서 제조하여 보강재와 기지간의 접촉부위를 촬영하여 젖음성을 측정하였다 젖음성 측정 결과 보강재에 도금된 Cu층은 젖음성을 향상시켰고, 젖음성의 개선은 보강재에 도금된 금속층과 기지간의 반응에 의해 계면에너지를 변화시킴으로서 나타난 결과이며. 반응을 통한 산화피막의 배제도 영향을 미친 것으로 판단된다

EMI 차폐재를 이용하여 전자파 장해를 극복하는 방법에는 금속판을 이용하는 방법과 플라스틱 표면에 전도층을 형성하는 방법, 전도성 충진제를 플라스틱에 혼입하는 방법이 대표적으로 사용되고 있으나 각각의 방법마다 장단점이 존재하기 때문에 많은 연구들의 목적은 전자 기기 본체의 무게를 증가시키지 않고 최대한 전자파 차폐 효율을 높이는 물질 개발에 목적을 두고 있다. 이러한 목적을 위하여 본 연구에서는 비중이 낮고 판상형인 운모 분체 펴면 위에 무전해 니켈 도금을 시행하므로써 전도성을 지니는 금속화운모를 제조하여, 이를 EMI차폐용 분체로서 사용하였다. 또한 이 EMI 차폐용 분체의 특성을 고찰 하였다. 미분체 운모 표면에 무전해 니켈막 금속화운모 미분체를 도료화하여 전자파 차폐 효과를 측정한 결과 최고 63dB를 나타내었다. 이 값은 구리 금속판을 이용한 전자파 차폐의 90dB에는 못 미치지만, 도포 횟수를 6회 이상 시행했을 경우 전자파 차폐 효과가 약 10dB 정도가 증가함을 알 수 있었고, 넓은 범위의 전자파 차폐 효과를 거둘 수 있는 특징이 있다.