We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of CuSO4·5H2O as the main metal source, NaH2PO2·H2O as the reducing agent, C6H5Na3O7·2H2O and NH4Cl as the complex agents, and NiSO4·6H2O as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using NH4OH. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at 70˚C. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

This research considers the problem of scheduling Jobs on unrelated parallel machines with a common due date The objective is to minimize the total absolute deviation of Job completion times about the common due date. This problem is motivated by the fact

인쇄회로기판 폐기물의 발생량은 꾸준히 증가하고 있으며, 구리 등 고가 금속을 함유하고 있어 적절한 재활용 방법의 적용이 시급한 상황이며, 그 대안으로서 열분해가 주목을 받고 있다. 본 연구에서는 페놀 인쇄회로기판(Phenol Printed Circuit Board, p-PCB) 폐기물의 열분해 특성을 규명하여 p-PCB 폐기물 열분해 공정 설계에 기초 자료를 제공하는데 그 목적을 두고 있다. 이를 위해 열중량분석기(Thermogravimetric analyzer; TGA)를 통한 동역학 분석과 더불어 부산물 특성 파악을 위해 Py-GC/MS(Pyrolyzer-Gas Chromatography/Mass Spectrometry, Py-GC/MS)를 적용하였다. 동역학분석과 휘발가스분석(Evolved Gas Analysis, EGA)을 통하여 p-PCB 열분해 반응은 크게 3 단계로 구분할 수 있다. 첫 번째 단계는, 280℃ 이하에서 반응이 일어나며, 초기질량의 10%로 감소하는 구간으로 미경화된 페놀 성분의 휘발과 열적으로 불안정한 물질들이 분해 배출된다고 여겨진다. 두 번째 단계는 280℃~380℃ 구간으로 초기 질량의 60%가 분해되는 구간으로서 주로 p-PCB를 구성하고 있는 종이와 경화된 브롬화(Brominated) 페놀수지의 분해로 판단된다. 마지막 분해구간인 380℃ 이상에서는 비브롬화(Non-Brominated) 페놀수지의 분해 및 촤(Char) 형성 단계로 판단된다. p-PCB의 열분해는 브롬화 페놀수지의 생성으로 특성지울 수 있으며, 열분해를 통해 페놀수지의 추출 재활용 가능성을 시사하고 있다.

본 연구과제에서는 인쇄회로기판 제조공정 폐수처리시스템에 동농축회수시설을 추가함으로 고함량 저수분슬러지를 생산하고, 폐액 내에 함유된 법정 수질오염물질인 동을 95% 이상 회수한 후 기존 폐수처리시스템에 유입시킴으로 폐수처리 시 중금속 처리 부담을 최소화 하고자 하였다. 이를 위해 충북 위치한 A사와 B사의 사업장 내 기존 폐수처리라인을 변경하여 고농도 동폐액을 별도로 집수한 후 여기에 동농축 회수시설을 설치하여 생산된 동농축 슬러지를 회수하여 제련용 원료로 중간가공한 후 수요자인 C사에 공급하여 최종생산물인 조동을 생산하는 자원순환 네트워크를 완성하였다. 본 연구과제를 통해 폐수처리오니 매립량 30%(840톤/년) 감소, 기존폐수처리 시설의 중금속 부하감소 등과, 100백만원/년의 폐기물처리비용 절감 및 528백만원/년의 고농축슬러지 매각 등의 환경적･경제적 기대효과와 동농축 슬러지 제조 원천기술 확보를 통한 국내/외 PCB 사업장 대상의 사업화가 가능하게 되었다.

Through industrial developing, electronic waste is occurred by short lifespan of electronic products. This study discusses an approach of the eco-efficiency for waste PCB (Printed Circuit Board) recycling process through environment and economic analysis. The recycling of waste PCB 1 kg has 1.89E + 00kg CO2 eq. of global warming potential and 2.84E −02 kg antimony eq. of abiotic resource depletion. In terms of economy, this process costs 6,601.91 KRW per 1kg waste PCB recycling. Use of economic and environmental result, when compare with same amounts of virgin metal, environmental-efficiency of GWP (Global Warming Potential) is at 4.16E + 00 and ARD(Abiotic Resource Depletion) is at 2.91E + 00. And compare with secondary metal, environmental-efficiency of GWP is at 2.11E + 00 and ARD is at 8.49E − 01. In addition economic-efficiency is at 1.19E + 00. The results of optimization of this process will be increased. This study will show the process economical and environmental decision making