We developed an Al sputtering process by varying the plasma power, process temperature, and film thickness. We observed an increase of hillock distribution and average diameter with increasing plasma power, process temperature, and film thickness. Since the roughness of a film increases with the increase of the distribution and average size of hillocks, the control of hillock formation is a key factor in the reduction of Al corrosion. We observed the lowest hillock formation at 30 W and 100 oC. This growth characteristic of sputtered Al thin films will be useful for the reduction of Al corrosion in the future of the electronic packaging field.

Changes in surface morphology and roughness of dc sputtered ZnO:Al/Ag back reflectors by varying the deposition temperature and their influence on the performance of flexible silicon thin film solar cells were systematically investigated. By increasing the deposition temperature from 25˚C to 500˚C, the grain size of Ag thin films increased from 100 nm to 1000 nm and the grain size distribution became irregular, which resulted in an increment of surface roughness from 6.6 nm to 46.6 nm. Even after the 100 nm thick ZnO:Al film deposition, the surface morphology and roughness of the ZnO:Al/Ag double structured back reflectors were the same as those of the Ag layers, meaning that the ZnO:Al films were deposited conformally on the Ag films without unnecessary changes in the surfacefeatures. The diffused reflectance of the back reflectors improved significantly with the increasing grain size and surface roughness of the Ag films, and in particular, an enhanced diffused reflectance in the long wavelength over 800 nm was observed in the Ag back reflectors deposited at 500˚C, which had an irregular grain size distribution of 200-1000 nm and large surface roughness. The improved light scattering properties on the rough ZnO:Al/Ag back reflector surfaces led to an increase of light trapping in the solar cells, and this resulted in a noticeable improvement in the Jsc values from 9.94 mA/cm2 for the flat Ag back reflector at 25˚C to 13.36 mA/cm2 for the rough one at 500˚C. A conversion efficiency of 7.60% (Voc = 0.93, Jsc = 13.36 mA/cm2, FF = 61%) was achieved in the flexible silicon thin film solar cells at this moment.

Changes in the surface morphology and light scattering of textured Al doped ZnO thin films on glasssubstrates prepared by rf magnetron sputtering were investigated. As-deposited ZnO:Al films show a hightransmittance of above 80% in the visible range and a low electrical resistivity of 4.5×10-4Ω·cm. The surfacemorphology of textured ZnO:Al films are closely dependent on the deposition parameters of heater temperature,working pressure, and etching time in the etching process. The optimized surface morphology with a cratershape is obtained at a heater temperature of 350oC, working pressure of 0.5 mtorr, and etching time of 45seconds. The optical properties of light transmittance, haze, and angular distribution function (ADF) aresignificantly affected by the resulting surface morphologies of textured films. The film surfaces, havinguniformly size-distributed craters, represent good light scattering properties of high haze and ADF values.Compared with commercial Asahi U (SnO2:F) substrates, the suitability of textured ZnO:Al films as frontelectrode material for amorphous silicon thin film solar cells is also estimated with respect to electrical andoptical properties.

고주파 스피터 방법으로 제조된 SnO2감지막 위에 에어로졸 화염 증착법으로 알루미나 표면 보호층을 증착하여 SnO2박막 가스 센서의 감지 특성에 미치는 영향에 대햐여 조사하였고, 표면 보호층에 귀금속 Pt를 도핑하여 Pt의 함량이 CO 및 CH(sub)4 가스들의 선택성에 미치는 영향에 대하여 조사하였다. SnO2박막은 R.F power 50 W, 공정 압력 4 mtorr, 기판온도 200˚C에서 30분간 0.3μm 두께로 Pt 전극 위에 제조하였고, 질산알루미늄(Al(NO3).9H2O) 용액을 희석하여 에어로졸 화염증착법으로 알루미나 표면 보호층을 만든후 600˚C에서 6시간동안 산소분위기에서 열처리하였다. 알루미나 표면 보호층이 증착된 SnO2가스 센서소자의 경우 보호층이 없는 가스 센서와 비교하여 CO 가스에 대한 감도는 매우 감소하였으나 CH4가스에 대한 감도 특성은 순수한 SnO2센서 소자와 비슷하였다. 결과적으로 보호층을 이용하여 CH4가스에 대한 상대적인 선택성 증가를 이룰 수 있었다. 특히 표면 보호층에 Pt가 첨가된 센서 소자의 경우 CO 가스에 대해서는 낮은 감도 특성을 나타내었으나 CH4에 대한 감도는 매우 증가하여 CH4가스의 선택성을 더욱 증대시킬 수 있었다. CH4가스 선택성 향상에 미치는 알루미나 표면 보호층과 Pt의 역할에 대하여 고찰해 보았다.

표면 탄성과 디바이스의 전극재료로 사용되는 Al-%Cu(4000Å)/tungsten nitride 박막을 magnetron sputtering 법으로 제조하고 전기저항을 평가한 비정질상의 tungsten nitride 박막을 제조할 수 있었고, 비정질 형성을 위해 질소비(R =N2/(Ar+N2)가 10~40% 정도 필요하다. Tungsten nitride 박막의 잔류응력은 비정질이 형성되면서 급격히 감소되었다. 이러한 비정질 박막위에 Al-1%Cu 합금막이 형성되었다. 다층막은 453K에서 4시간 동안 열처리함으로써 3.6μΩ-cm의 저항을 나타냈는데, 이는 박막내 결정립 성장과 결함의 감소에 기인하였다.