Effects of Sc addition on microstructure, electrical conductivity, thermal conductivity and mechanical properties of the as-cast and as-extruded Al-2Zn-1Cu-0.3Mg-xSc (x = 0, 0.25, 0.5 wt%) alloys are investigated. The average grain size of the as-cast Al-2Zn-1Cu-0.3Mg alloy is 2,334 μm; however, this value drops to 914 and 529 μm with addition of Sc element at 0.25 wt% and 0.5 wt%, respectively. This grain refinement is due to primary Al3Sc phase forming during solidification. The as-extruded Al-2Zn-1Cu-0.3Mg alloy has a recrystallization structure consisting of almost equiaxed grains. However, the asextruded Sc-containing alloys consist of grains that are extremely elongated in the extrusion direction. In addition, it is found that the proportion of low-angle grain boundaries below 15 degree is dominant. This is because the addition of Sc results in the formation of coherent and nano-scale Al3Sc phases during hot extrusion, inhibiting the process of recrystallization and improving the strength by pinning of dislocations and the formation of subgrain boundaries. The maximum values of the yield and tensile strength are 126 MPa and 215 MPa for the as-extruded Al-2Zn-1Cu-0.3Mg-0.25Sc alloy, respectively. The increase in strength is probably due to the existence of nano-scale Al3Sc precipitates and dense Al2Cu phases. Thermal conductivity of the as-cast Al-2Zn-1Cu-0.3Mg-xSc alloy is reduced to 204, 187 and 183 W/MK by additions of elemental Sc of 0, 0.25 and 0.5 wt%, respectively. On the other hand, the thermal conductivity of the as-extruded Al-2Zn-1Cu-0.3Mg-xSc alloy is about 200 W/Mk regardless of the content of Sc. This is because of the formation of coherent Al3Sc phase, which decreases Sc content and causes extremely high electrical resistivity.

Herein, we report significantly enhanced mechanical properties and thermal conductivity of polyimide (PI) by incorporating a small amount (0.01 wt %) of individualized boron-doped high-quality graphene as a filler. The boron-doped expandable graphite (B-EG) was synthesized by mixing boric acid ( H3BO4) with expandable graphite (EG) and thermally treating the mixture at 2450 °C for 30 min using a graphite furnace in an argon atmosphere. The boron-doped graphene (B-g) was prepared by the solution-phase exfoliation of B-EG with an ultrasonication process, which is a method to obtain individualized graphene as well as few-layer graphene. The PI nanocomposites were prepared using the obtained graphene. The PI nanocomposites synthesized with high-quality B-graphene (B-g) showed enhanced mechanical properties and thermal conductivity compared to those of pure PI due to the doping effects and strong interfacial interactions between graphene and the PI matrix.

Facile process for the fabrication of multi-layer graphene thin film (MLGF) is reported here. Multi-layer graphene dispersion prepared by liquid-phase exfoliation of graphite was sprayed on a glass substrate by spray pyrolysis method. The structural, optical and electrical properties of the deposited MLGF are investigated. The sheets of graphene are deposited uniformly on the substrate and distribution of small graphene sheets with size of 300–500 nm can be observed in SEM image. AFM and micro-Raman results ensured that the spray-coated graphene thin film is composed of multi-layer graphene sheets. Spray coated graphene thin film showed significant optical transparency of 57% in the visible region (400–550 nm). MLGF possessed the electrical conductivity in the order of 744 S/m with surface resistivity of 3.54 k Ω/sq. The prepared liquid-phase exfoliated graphene thin film showed superior photoelectric response. The results of this study provided a framework for fabricating an optimized MLGF using a spray pyrolysis route for optoelectronics devices.

Low thermal conductivity carbon fibers from polyacrylonitrile (PAN) are currently being explored as an alternative for traditional rayon-based carbon fibers with a thermal conductivity of 4 W/m K. Compared to multiple component electrospinning, this research demonstrated another feasible way to make low thermal conductivity carbon fibrous material by electrospinning PAN followed by carbonization and alkali activation. The effects of activation condition on microstructure, pore formation, and thermal conductivity of the resultant carbon nanofibrous material were investigated. The processing-structure-thermal conductivity relationship was revealed and mechanism of thermal conductivity reduction was discussed. The overall thermal conductivity of the prepared carbon nanofibrous material is a result of combined effects from factors of carbon structure and number of pores rather than volume of pores or specific surface area. The activated carbon nanofibrous materials showed thermal conductivity as low as 0.12 W/m K, which is a reduction of ~ 99% when compared to that of solid carbon film and a reduction of ~ 95% when compared to that of carbon nanofibrous material before activation.

고준위방사성폐기물의 처분은 고심도 암반내에 처분시스템을 구축하는 심층 처분방법이 고려된다. 심층 처분은 처분용기, 완충재, 뒷채움재, 근계암반의 설계 요소인 공학적방벽과 천연 방벽으로 구성된다. 공학적방벽 중에서 벤토나이트 완충재는 암반으로부터 유입되는 지하수 흐름을 최소화하고 핵종 유출을 저지하는 기능을 한다. 지하수 유입으로 인한 완충재의 수리전도도 특성 규명은 처분장 공학적방벽의 안정성 및 건전성에 대한 성능 평가에 있어 중요한 사안이다. 본 연구에서는 경주 벤토나이트를 이용하여 다양한 건조밀도와 온도 조건에 따라 포화 수리전도도 실험을 수행하였으며, 120개의 실험 결과 를 다중 회귀 분석을 통해 수리전도도 추정 모델을 제시하였다. 실험 결과에서는 건조밀도가 커질수록 수리전도도가 감소하는 경향이 나타났다. 또한, 온도가 증가할수록 수리전도도가 증가하였다. 이러한 실험 결과들을 종합한 다중 회귀 분석 결과에서는 수리전도도 추정식의 결정계수(R2)가 0.93으로 높게 나타났다. 본 연구에서 제시된 수리전도도 추정식은 벤토나이트 완충재의 성능과 연관된 건조밀도와 온도의 영향을 고려하여 처분시스템의 공학적방벽 설계에 활용 될 것으로 판단된다.

고준위폐기물을 심지층에 처분하기 위한 공학적방벽의 구성 요소로는 처분용기, 완충재, 뒷채움재 등이 있다. 이 중 완충재는 처분용기와 근계암반 사이의 빈 공간에 설치되는 물질로써, 주변 지하수로부터 처분용기를 보호하며 방사성 핵종의 유출을 저지하는 등의 역할을 한다. 또한 처분용기에서 발생하는 고온의 열량은 완충재로 직접 전파되기에 완충재의 열전도도는 처분시스템의 안전성 평가에 있어 매우 중요하다고 할 수 있다. 따라서 본 연구에서는 국내 경주산 압축 벤토나이트 완충재의 열전도도 특성을 규명하였으며 실제 처분용기에서 발생되는 고온의 특성을 반영하여 상온에서 80~90℃까지의 범위에서 압축 벤토나이트의 열전도도를 측정하였다. 온도증가에 따라 압축 벤토나이트의 열전도도는 5~20% 가량 증가하였으며 초기 포화도가 클수록 열전도도 증가는 더 크게 나타났다.

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

In this paper, an analytical model is developed for electrical conductivity of nanocomposites, particularly polymer/carbon nanotubes nanocomposites. This model considers the effects of aspect ratio, concentration, waviness, conductivity and percolation threshold of nanoparticles, interphase thickness, wettability between polymer and filler, tunneling distance between nanoparticles and network fraction on the conductivity. The developed model is confirmed by experimental results and parametric studies. The calculations show good agreement with the experimental data of different samples. The concentration and aspect ratio of nanoparticles directly control the conductivity. Moreover, a smaller distance between nanoparticles increases the conductivity based on the tunneling mechanism. A thick interphase also causes an increased conductivity, because the interphase regions participate in the networks and enhance the effectiveness of nanoparticles.

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance(Rth) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from 21.9 Ω/□ to 12.6 Ω/□. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.

Effects of multi-walled carbon nanotube (MWCNT) type and flow type (shear and elongational flow) on the electrical conductivity of polycarbonate (PC)/MWCNT nanocomposites were investigated. Two different MWCNTs produced a huge difference in electrical conductivity in an injection molded PC/MWCNT nanocomposite. It was observed that MWCNTs having a higher aspect ratio provide much lower electrical conductivity in injection molded PC/MWCNT nanocomposites while the conductivities of compression molded samples from two different MWCNTs were the same. We found that this is due to a difference in the deformability of the two MWCNTs. Nanocomposite samples prepared at a higher extensional rate and shear rate showed lower electrical conductivity. This is attributed to flow induced orientation of the MWCNTs. The experimental results were discussed in relation to variation in the tube–tube contact due to the change of the MWCNT orientation.