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      검색결과 10

      2.
      2016.03 KCI 등재 구독 인증기관 무료, 개인회원 유료
      Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.
      4,000원
      3.
      2011.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
      Monitoring autocorrelated processes is prevalent in recent manufacturing environments. As a proactive control for manufacturing processes is emphasized especially in the semiconductor industry, it is natural to monitor real-time status of equipment throug
      4,000원
      4.
      2008.06 KCI 등재후보 구독 인증기관 무료, 개인회원 유료
      In recent semiconductor manufacturing clean rooms, air washers are used to remove airborne gaseous contaminants such as NH3, SOx and organic gases from outdoor air introduced into clean room. In order to improve the gas removal performance of the air washers, a hot water contact heat exchanger can be installed upstream of an air washer, heating and humidifying the incoming outdoor air before entering the air washer. In the present study, an experiment was carried out to examine closely the improvement of gas removal efficiency by the insertion of the hot water contact heat exchanger. The experiment showed that the gas removal efficiency was increased by the water vapor condensation effect.
      4,000원
      5.
      2007.02 KCI 등재 구독 인증기관 무료, 개인회원 유료
      The power of semiconductor, Korea is continuously constructing semiconductor production line for keeping a front-runner status. however, studies and data about potential risks in semiconductor factory are still short. If fire does not initially suppressed, the fire causes a great damage. To decrease fire risk factors, in addition to fire fighting safety equipment, more important thing is how to design and construct fire protection system. The current fire protection codes about semiconductor factory come under functional law, and this law is short of consideration about particularity of factory. The existing prescriptive fire codes depending on experience compose without evident engineering verifications, thus equipments which is created by the current prescriptive fire code may bring about a variety of problems. For example, the design under the current regulation can not cope with the excessive investments, low efficiencies, and the diversifying construction designs and be applied to the quick changes of new technologies. Ergo, an optimal design for fire protection is to equip fire protection arrangements with condition and environment of production field. Manufacturing factory of semiconductors is a windowless airtight space. And for cleanliness, there exists strong flow of cooperation. Therefore, there is a need for fire safety design that meets the characteristic of a clean room. Accordingly, we are to derive smoke flow according to cooperation process within a clean room and construction plan of an optimal sensor system. In this study, in order to confirm the performance of proposed smoke-exhaust equipment and suggest efficient smoke exhaust device when there is a fire of 1MW of methane in the clean room of company H, we have implemented fire simulation using fluid dynamics computation.
      4,800원
      6.
      2005.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
      Overlay parameter control of the semiconductor photolithography process is researched in this paper. Overlay parameters denote the error in superposing the current pattern to the pattern previously created. The reduction of the overlay deviation is one of the key factors in improving the quality of the semiconductor products. The semiconductor process is affected by numerous environment and equipment factors. Through process condition prediction and control, the overlay inaccuracy can be reduced. Generally, three types of process condition change exist; uncontrollable white noise, slowly changing drift, and abrupt condition shift. To effectively control the aforementioned process changes, control scheme using adaptive deadband is proposed. The suggested approach and existing control method are cross evaluated through simulation.
      5,400원
      7.
      2005.05 구독 인증기관 무료, 개인회원 유료
      The need for accurate yield prediction is increasing for estimating productivity and production costs to secure high revenues in the semiconductor industry. Corresponding to this end, we introduce new spatial modeling approaches for spatially clustered defects on an integrated circuit (IC) wafer map. We use spatial location of an IC chip on the wafer as a covariate on corresponding defects count listed in a wafer map. Analysis results indicate that yield prediction can be greatly improved by capturing spatial features of defects. Tyagi and Bayoumi's (1994) wafer map data are used to illustrate the procedure.
      4,000원
      8.
      2003.09 KCI 등재 구독 인증기관 무료, 개인회원 유료
      Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been
      4,000원
      9.
      2003.05 구독 인증기관 무료, 개인회원 유료
      Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication that has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.
      3,000원
      10.
      2013.08 KCI 등재 서비스 종료(열람 제한)
      Sulfur hexa-fluoride has been used as a etching gas in semiconductor industry. From the globally environmental issues, it is urgent to control the emissions of this significant greenhouse gas. The main objective of this experimental investigation was to find the effective catalyst for SF6 decomposition. The precursor catalyst of hexa-aluminate was prepared to investigate the catalytic activity and stability. The precursor catalyst of hexa-aluminate was modified with Ni to enhance the catalytic activities and stability. The catalytic activity for SF6 decomposition increased by the addition of Ni and maximized at 6wt% addition of Ni. The addition of 6wt% Ni in precursor catalyst of hexa-aluminate improved the resistant to the HF and reduced the crystallization and phase transition of catalyst.