A series of experiments demonstrated that an addition of Ag into (Cu0.5Zr0.5)100-xAgx amorphous alloys alters the plasticity of the alloys in a systematic manner. Energy dispersive x-ray spectroscopy (EDS) conducted on the (Cu0.5Zr0.5)100-xAgx alloys exhibited the presence of compositional modulation, indicating that compositional separation had occurred. The presence of compositional modulation was also validated using a combined technique of molecular dynamics and Monte Carlo simulation. In this study, the effect of Ag on the compositional separation in (Cu0.5Zr0.5)100-xAgx bulk amorphous alloys was investigated to understand the role played by the phase-separating element on the plasticity of the amorphous alloys.

The Ni-based bulk metallic glass matrix composites were fabricated by spark plasma sintering of mixture of gas-atomized metallic glass powders and ductile brass powders. The successful consolidation of metallic glass matrix composite was achieved by strong bonding between metallic glass powders due to viscous flow deformation and lower stress of ductile brass powders in the supercooled liquid state during spark plasma sintering. The composite shows some macroscopic plasticity after yielding, which was obtained by introducing a ductile second brass phase in the Ni-based metallic glass matrix.

Fe based () amorphous powder were produced by a gas atomization process, and then ductile Cu powder fabricated by the electric explosion of wire(EEW) were mixed in the liquid (methanol) consecutively. The Fe-based amorphous - nanometallic Cu composite powders were compacted by a spark plasma sintering (SPS) processes. The nano-sized Cu powders of 200 produced by EEW in the methanol were mixed and well coated with the atomized Fe amorphous powders through the simple drying process on the hot plate. The relative density of the compacts obtained by the SPS showed over 98% and its hardness was also found to reach over 1100 Hv.

The structural and electrical properties of amorphous BaSm2Ti4O12 (BSmT) films on a TiN/SiO2/Si substrate deposited using a RF magnetron sputtering method were investigated. The deposition of BSmT films was carried out at 300˚C in a mixed oxygen and argon (O2 : Ar = 1 : 4) atmosphere with a total pressure of 8.0 mTorr. In particular, a 45 nm-thick amorphous BSmT film exhibited a high capacitance density and low dissipation factor of 7.60 fF/μm2 and 1.3%, respectively, with a dielectric constant of 38 at 100 kHz. Its capacitance showed very little change, even in GHz ranges from 1.0 GHz to 6.0 GHz. The quality factor of the BSmT film was as high as 67 at 6 GHz. The leakage current density of the BSmT film was also very low, at approximately 5.11 nA/cm2 at 2 V; its conduction mechanism was explained by the the Poole-Frenkel emission. The quadratic voltage coefficient of capacitance of the BSmT film was approximately 698 ppm/V2, which is higher than the required value (<100 ppm/V2) for RF application. This could be reduced by improving the process condition. The temperature coefficient of capacitance of the film was low at nearly 296 ppm/˚C at 100 kHz. Therefore, amorphous BSmT grown on a TiN substrate is a viable candidate material for a metal-insulator-metal capacitor.

The Cu-based bulk metallic glass (BMG) composites containing Zr-based metallic glass phase have been consolidated by spark plasma sintering using the mixture of Cu-based and Zr-based metallic glass powders in their overlapped supercooled liquid region. The Zr-based metallic glass phases are well distributed homogeneously in the Cu-based metallic glass matrix after consolidation process. The successful consolidation of BMG composites with dual amorphous phases was corresponding to the sound viscous flow of the two kinds of metallic glass powders in their overlapped supercooled liquid region.

The Cu-based bulk metallic glass (BMG) composite was fabricated by spark plasma sintering (SPS) using of gas-atomized metallic glass powders and ductile brass powders. No defect such as pores and cavities was observed at the interface between the brass powder and the metallic glass matrix, suggesting that the SPS process caused a severe viscous flow of the metallic glass and brass phases in the supercooled liquid region, resulting in a full densification. The BMG composites shows some macroscopic plasticity after yielding, although the levels of strength decreased.

In the present study, Zr-base metallic glass (MG) and Zr-base BMG/diamond composites were fabricated using a combination of gas atomization and spark plasma sintering (SPS). The microstructure, thermal stability and mechanical property of both the specimens as atomized and sintered were investigated. The experimental results showed that the SPSed specimens could be densified into nearly 100% and maintained the initial thermal stability at the sintering temperature of 630K. In addition, MG/diamond powder composites were successfully synthesised using SPS process. The composites, even a very low diamond volume fraction, generated a significant increase in compressive strength. With increasing the diamond volume fraction, the compressive strength was also increased due to the addition of hardest diamonds. It suggests that these composites would be potential candidates for a new cutting tool material.

Amorphous BaTi4O9 (BT4) film was deposited on Pt/Si substrate by RF magnetron sputter and their dielectric properties and electrical properties are investigated. A cross sectional SEM image and AFM image of the surface of the amorphous BT4 film deposited at room temperature showed the film was grown well on the substrate. The amorphous BT4 film had a large dielectric constant of 32, which is similar to that of the crystalline BT4 film. The leakage current density of the BT4 film was low and a Poole-Frenkel emission was suggested as the leakage current mechanism. A positive quadratic voltage coefficient of capacitance (VCC) was obtained for the BT4 film with a thickness of<70 nm and it could be due to the free carrier relaxation. However, a negative quadratic VCC was obtained for the films with a thickness ≥96nm, possibly due to the dipolar relaxation. The 55 nm-thick BT4 film had a high capacitance density of 5.1fF/μm2 with a low leakage current density of 11.6nA/cm2 at 2 V. Its quadratic and linear VCCs were 244ppm/V2 and -52 ppm/V, respectively, with a low temperature coefficient of capacitance of 961ppm/˚C at 100 kHz. These results confirmed the potential suitability of the amorphous BT4 film for use as a high performance metal-insulator-metal (MIM) capacitor.

Bulk metallic glass (BMG) composite was fabricated by consolidation of milled metallic glass composite powders. The metallic glass composite powder was synthesized by a controlled milling process using the Cu-based metallic glass powder blended with 30 vol% Zr-based metallic glass powders. The milled composite powders showed a layered structure with three metallic phases, which is formed as a result of mechanical milling. By spark plasma sintering of milled metallic glass powders in the supercooled liquid region, a fully dense BMG composite was successfully synthesized.

The hydrogen sorption speeds of amorphous alloy and its crystallized alloys were evaluated at room temperature. amorphous alloy was prepared by ball milling. The hydrogen sorption rate of the partially crystallized alloy was higher than that of amorphous. The enhanced sorption rate of partially crystallized alloy was explained in terms of grain refinement that has been known to promote the diffusion into metallic bulk of the gases. The grain refinement could be obtained by crystallization of amorphous phase resulting in the observed increase in sorption property.

Ni based() bulk metallic glass(BMG) powders were produced by a gas atomization process, and ductile Cu powders were mixed using a spray drying process. The Ni-based amorphous powder and Cu mixed Ni composite powders were compacted by a spark plasma sintering (SPS) processes into cylindrical shape. The relative density varied with the used SPS mold materials such as graphite, hardened steel and WC-Co hard metal. The relative density increased from 87% to 98% when the sintering temperature increased up to in the WC-Co hard metal mold.

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of (CuA) and (NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; (glass transition temperature) and (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.