The high temperature deformation behavior of the activated sintered W powder compacts was investigated. The W compact showed the relative density of 94% with the average W grain size of by activated sintering at for 1 hour. Compression tests were carried out in the temperature range of at the strain rate range of /sec - /sec. True stress-strain curve and microstructure exhibited the grain boundary brittleness which was dependent on the compression test temperature. The activated sintered W compact showed that the maximum stress as well as the strain at the maximum stress was abruptly decreased as the test temperature increase from to 1000 and regardless of the strain rate. The discrepancy of the microstructure in the specimen center was obviously observed with the increase of the test temperature. After compression test at the W grain was severely deformed normally against the compression axis. However, after compression test at and the W grain was not deformed, but the microcrack was formed in the W grain boundary. The Ni-rich second phase segregated along the W grain boundary could be partly unstable over and affect the poor mechanical property of the activated sintered W compact.

The microstructures and indentation fracture of pressureless-sintered crystalline were investigated as a basic study for the application of weak phase of fibrous monolithic composites. They were comprised with many lamella twins as well as micro-cracks at the grain boundaries. The hardness at room temperature was remarkably low value(575 Hv) due to the low relative density and existence of microcracks at grain boundaries. The main fracture mode was a typical intergranular fracture, and showed remarkable micro-cracking effect. The heavy plastic deformation was observed around the site of indentation. In addition, the was expected to apply as a weak phase in the fibrous monolithic composites because of the low hardness and easily plastic deformation that could be led the preferable pulled-out and microcracking toughening under the failure

In this work, the conventional transient liquid phase(TLP) bonding was modified. An attempt was made of using a liquid phase sintered alloy, which will be a liquid phase coexisting with a solid phase at the bonding temperature, as an interlayer for bonding metals. With an aim of revealing the fundamental features of this modified TLP bonding, the kinetics concerned with the growth of solid particles and the isothermal solidification process in Fe-1.16wt%B and Fe-4.5wt%P interlayers for the bonding pure iron, as well as the morphological change of the solid particle, were investigated.

수용성 매체에서 젤-케스팅 공정을 이용하여 용융실리카를 기본으로 하는 다성분계 세라믹 코어 (中子)를 제조하고, 소결조건에 따른 제반 기계적 물성과 알칼리 부식용액에 의한 용출특성을 고찰하였다. 1000cP (at 50sec-1 ) 이하의 낮은 점도를 갖는 50vol%의 고농도 다성분계 세라믹 슬림의 제조가 가능하였다. 성형체는 안정화시킨 슬림을 몰드에 부어 상온에서 겔화시킨 후 25˚C, 80% 상대습도 분위기 하에서 48시간동안 건조시켜 제조하였으며 건조된 성형체에는 균열이 발생하지 않았다. 세라믹 코어 성형체의 소결온도가 상승할 수록 상온강도, 겉보기 밀도, 수축률은 시편의 기공도와 역비례하여 증가하였다. 세라믹 코어 소결체의 용출속도는 동일한 온도에서 알칼리 부식용액의 농도에 의존하였으며, 소결체의 기공도가 클수록 증가하였다.

Abstract To investigate the effect of mechanical alloying process to thermoelectric properties of PbTe sintered body, Pb-Te mixed powder with Pb : Te : 1 : 1 composition was mechanically alloyed using tumbler-ball mill. Thermoelectric properties of the sintered body were evaluated by measuring of the Seebeck coefficient and specific electric resistivity from the room temperature to 50. Sintered body of only mechanically alloyed PbTe powder showed p-type behavior at the room temperature, and occurred type transition from p-type to n-type at about 30. PbTe sintered body which was fabricated using heat treated powder in atmosphere after mechanical alloying showed stable n-type behavior under 50. N-type PbTe sintered body fabricated by mechanical alloying process had 4 times higher power factor than that fabricated by the melt-crushing process. Application of a mechanical alloying process to fabricate of n-type PbTe thermoelectric material seemed to be useful to increase the power factor of PbTe sintered body.

It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.

In order to enhance sinterability of W-Cu composites used for heat sink materials, mechanical alloying process where both homogeneous mixing of component powders and fine dispersion of minor phase can be easily attained was employed. Nanostructured W-Cu powders prepared by mechanical alloying showed W grain size ranged of 20-50 nm and were able to be efficiently sintered owing to the fine particle size as well as uniform distribution of Cu phase. The thermal properties such as electrical resistivity, coefficient of thermal expansion and thermal conductivity were evaluated as functions of temperature and Cu content. It was found that the coefficient of thermal expansion could be controlled by changing Cu content. The measured electrical resistivities and thermal diffusivities were also varied with Cu content. The thermal conductivities calculated from the values of resistivities and diffusivities showed similar tendency as a function of temperatures. However, this is in contradiction with thermal conductivities of pure W and Cu which decrease with increasing temperature.