To reduce production cost and inhibit the aggregation of graphene, graphene oxide and copper nitrate solution were used as raw materials in the paper. Cu particles were introduced to the graphene nanosheets by in-situ chemical reduction method in the hydrazine hydrate and sodium hydroxide solution, and the copper matrix composite reinforced with Cu-doped graphene nanosheets were fabricated by powder metallurgy. The synthesized Cu-doped graphene was characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The relative density, hardness, electrical conductivity and tensile strength of the copper matrix composite reinforced with Cudoped graphene were measured as well. The results show that copper ions and graphene oxide can be effectively reduced by hydrazine hydrate simultaneously. Most of oxygen functional groups on the Cu-doped graphene sheets can be removed dramatically, and Cu-doped graphene inhibit the graphene aggregation effectively. Within the experimental range, the copper matrix composites have good comprehensive properties with 0.5 wt% Cu-doped graphene. The tensile strength and hardness are 221 MPa and 81.6 HV, respectively, corresponding to an increase of 23% and 59% compared to that of pure Cu, and the electrical conductivity reaches up to 93.96% IACS. However, excessive addition of Cu-doped graphene is not beneficial for the improvement on the hardness and electrical conductivity of copper matrix composite.

The flaw of low dispersibility in the metal matrix brought on by graphene's full crystal structure can be improved by the application of ion beam radiation to the surface of the material. Copper atoms are uniformly dispersed on the modified graphene oxide ( GOM) surface after being irradiated to a copper ion beam, and during the sputtering modification, the valence state of copper is changed, resulting in the formation of a new CuO phase on the graphene oxide (GO) surface. Therefore, after copper ion beam irradiation of graphene, the interfacial adhesion between GOM and copper matrix is enhanced, and the wear resistance is significantly improved. When the GOM content is low, it can withstand most of the load during the friction and wear test, which reduces the wear of the copper matrix and the occurrence of fatigue cracks at the interface of the composite material.

We studied formation of nanostructured -Cu composites under shock wave conditions. We investigated the influence of preliminary mechanical activation (MA) of Ti-B-Cu powder mixtures on the peculiarities of the reaction between Ti and B under shock wave. In the MA-ed mixture the reaction proceeded completely while in the non-activated mixture the reagents remained along with the product . titanium diboride. The size of titanium diboride particles in the central part of the compact was 100-300 nm.