When taking X-ray, Some of them are not only absorbed as they pass through the body, but some are scattered and blurred. To prevent this problem, 'X-Ray Grid' was placed between the body and the film. Conventionally, in order to manufacture an X-ray grid, a lead sheet and an aluminum sheet were adhered with epoxy or the like, cut to a predetermined thickness, and formed in a line at a predetermined angle. New grids are actively being developed to solve this problem. In this study, Laser beam was irradiated on a photosensitive glass having high X-ray transmittance to form an oblique lattice type channel. When the photosensitive glass is exposed to Laser beam, Previous studies have shown that laser exposure to photosensitive glass reacts with UV-Laserto form high-precision microstructures. The photosensitive glass exposed by the laser is heat-treated at a high temperature to crystallize the exposed part. When the crystallized patterns are etched with a hydrofluoric acid liquid solution, a structure having a depth is completed. The completed structure is filled with metals with X-ray shielding properties. The angle of incidence can be processed up to 18, which is the angle of incidence of ordinary X-ray, The upper surface line width of theetched pattern is 20um or less and The depth of processing after etching was found to be more than 100um, which means 'the filler can be deposited sufficiently'.

본 연구에서는 크기와 형상이 서로 다른 4가지 실버 파우더를 이용하여 감광성 실버 페이스트를 제조 하였다. 제조된 실버 페이스트의 레올로지 특성 및 터치패널용 전도성 미세패턴 구현을 검토하였다. 그리고 건조방식에 따른 전도성도 평가하였다. 그 결과 실버 파우더의 평균입자 크기는 D50=0.8∼1.0㎛이 가장 낮은 저항치를 얻을 수 있었고, 또한 패턴의 Sharpness도 가장 우수함을 알 수 있었다. 건조방식은 예비건조 및 후 건조를 IR/IR방식으로 진행한 것이 가장 낮은 저항치를 얻을수있었다.

본 연구에서는 베젤 전극의 최소화 방안으로서 감광성 실버 페이스트법을 적용하여 전도성 패턴을 구현하였다. 이러한 감광성 실버 페이스트를 이용하여 패턴을 구현하는데 가장 중요한 공정은 예비건조(pre-heating) 공정과 UV노광(UV-exposure)공정이다. 따라서 본 연구에서는 이러한 2가지 핵심공정에 대해서 연구한 결과, 예비건조 온도는 90℃ 10분, UV노광량은 300mJ/㎠이 최적 조건임을 알 수 있었다. 이와같은 조건으로 20/20㎛(Line/Space)패턴까지 구현할 수 있었다.

Cinnamate를 곁사슬로 포함하는 감광성 고분자를 poly(2-hydroxyethyl methacrylate) (PHEMA)로부터 합성하였다. Cinnamate 기가 25에서 97mol%까지 치환된 감광성 고분자를 PHEMA와 cinnamoyl chloride의 반응을 통해 합성하였으며, 반응 조건에 따른 치환율의 변화를 조사하였다. 합성된 고분자는 H-NMR과 FT-IR을 이용하여 구조 확인하였으며, DSC와 TGA를 이용한 열분석을 행하였다. 얻어진 고분자의 광 반응성은 UV/VIS spectrophotometer를 이용하여 확인하였고, 편광 자외선 조사를 이용한 액정의 광배향 특성에 대해서 연구하였다.

Organic-based electroluminescent devices have attracted lots of interests because of their possible application as a large-area flat panel display. Polyimides have been used for photo-alignment in LCD(Liquid Crystal Display). However, the devices used in this study were fabricated with polyimide doped with N,N'-Diphenyl-N,N'-di(m-tolyl)-benzidine(TPD) (3, 10, 30wt%) for electroluminescent hole tranforting layer(EHTL). The photochemical and physical properties of EHTL was studied. The film thicknesses were reduced under illumination with UV light. Polyimide films doped with TPD(3wt%) was irradiated and the electrical properties of the films were studied.

Naphthoquinone-1,2-diazide-5-sulfonyl [NDS]derivatives members of Quinone diazide compound that are utilizable as photoresist for printing plate were synthesized, and photoresist were prepared by mixing these derivatives with a matrix resin(PF, CF) at various weight ratios. Photosensitive characteristics of photoresist were studied by Gray scale method, and SEM to analyze if they can be used as photosensitive material in a printing plate. Experimental results showed using IR, UV, NDS derivatives were photoconverted and developer-soluble photoresist were produced. Photoresist in the mixing ratio of 1:4 of NDS[II] and CF resin gave rise to the highest dissolution rate. In addition, photoresist obtained at this condition resulted in the most superior sensitivity.

Naphthoquinone-1,2-diazide-5-sulfonyl[NDAS] derivatives members of quinone diazide compound that are utilizable as photosensitive polymer material were synthesized, and photoresist were prepared by mixing these derivatives with m-cresol novolak(a matrix resin) at various weight ratios. Photosensitive characteristics of photoresist were studied by examining UV and IR, relative sensitivity using a Gray scale method, and SEM to analyze if they can be used as photosensitive material in printing process. Experimental results showed that, by UV, NDAS derivatives were photoconverted and developer-soluble photoresist were produced. The mixing ratio of 1:4(by mass) of NDAS+p-ydroxybenzophenone+sensitizer and m-cresol novolak gave rise to the highest dissolution rate. In addition, photoresist obtained at this condition resulted in the most superior sensitivity and contrast.