본 연구에서는 실버 파우더의 입자 크기, 즉 평균 입자 크기가 2㎛과 7㎛, 이렇게 2가지 실버 페이스트를 개발하였다. 이렇게 개 발된 실버 페이스트에 대해서 점도 및 점탄성, 경화후에 잔류용제 유무 확인을 위한 TGA측정, Strain에 따른 저항 변화 및 전극 표면 구조 변화에 대해서 검토하였다. 이러한 결과를 정리하면 Strain에 따른 저항 변화를 최소화하기 위해서는 실버 파우더의 입 자를 2㎛정도인 것이 가장 바람직함을 알 수 있었다.

The main objective of the research was to deposit thin films of silver on a graphite carbon paste in a phosphate buffer medium using an electrochemical method. To construct a nitrofurazone detection sensor that is highly sensitive. Different manufacturing parameters, such as electrodeposition potential, pH effect, potential scan rate effect, and number of scan cycles, were examined in this section. The parameters were optimized to improve the deposited silver layers various electrocatalytic characteristics. The Nitrofurazone reduction process is diffusion controlled, as seen by the linear variation of Epc with log(v). The constructed Ag-NPs@CPE electrod has excellent electrical characteristics a large active surface area and low background with extremely high electrical conductivity, according to structural and electrochemical characterizations such as Scanning electron microscopy, X-ray diffraction (XRD) and cyclic voltammetry. The constructed sensor has a very remarkable analytical performance for nitrofurazone molecule identification, with a very low detection limit of about 10– 8 M. The detection of nitrofurazone using our Ag-NPs@CPE sensors in real samples contaminated with the antibiotic nitrofurazone, such as tap water and urine. In the selected sample, the electroanalytical findings reveal a very satisfactory recovery rate of more than 94 percent.

Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at 200oC shows a highly dense and well-sintered microstructure and has a resistivity of 7.60 μΩ·cm. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.

This study focuses on fabricating silver flake powder by a mechanical milling process and investigating the formation of flake-shaped particles during milling. The silver flake powder is fabricated by varying the mechanical milling parameters such as the amount of powder, ball size, impeller rotation speed, and milling time of the attrition ballmill. The particle size of the silver flake powder decreases with increasing amount of powder; however, it increases with increasing impeller rotation speed. The change in the particle size of the silver flake powder is analyzed based on elastic collision between the balls, taking energy loss of the balls due to the powder into consideration. The change in the particle size of the silver flake powder with mechanical milling parameters is consistent with the change in the diameter of the elastic deformation contact area of the ball, due to the collision between the balls, with milling parameters. The flake-shaped silver particles are formed at the elastic deformation contact area of the ball due to the collision. Keywords: Flake powder, Milling, Ball collision, Elastic deformation

본 연구에서는 크기와 형상이 서로 다른 4가지 실버 파우더를 이용하여 감광성 실버 페이스트를 제조 하였다. 제조된 실버 페이스트의 레올로지 특성 및 터치패널용 전도성 미세패턴 구현을 검토하였다. 그리고 건조방식에 따른 전도성도 평가하였다. 그 결과 실버 파우더의 평균입자 크기는 D50=0.8∼1.0㎛이 가장 낮은 저항치를 얻을 수 있었고, 또한 패턴의 Sharpness도 가장 우수함을 알 수 있었다. 건조방식은 예비건조 및 후 건조를 IR/IR방식으로 진행한 것이 가장 낮은 저항치를 얻을수있었다.

Particles of high strength material when coated with silver offer a means of obtaining desirable electrical properties and high strength. The coating process employed aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives were also applied. The reduction and subsequent deposition of silver occurred selectively on the surface of the tungsten particles. The morphologies of the coated particles were assessed by SEM imaging. The silver was uniformed coated on tungsten powder and its thickness was estimated to be approximately 100nm on the basis of a mass account.

The several functions of manufactured the gypsum incorporating oyster shell powder coated by submicro-silver solutionand carrried out the tests for the adsorption of formaldehyde and antibiotic actions. Several environmentally- friendlyarchitectural materials, clay and flyash were tested for the comparison of the adsorption efficiency. The mortar by solidifiedand dried was exposed in the small chamber for the 180min with 4000µg/m3 of the initial concentration of formaldehydeand observed high removal efficiency which result was not any difference in adsorption performance of other tested materials.The microbial flora analysis of oyster mortar coated by submicro-silver solution and the similarity test were performed andobserved that the densities of Aeromonas sp. Enterococcus sp., and Micrococcus sp. were decreased and the densities ofStaphylococcus sp., Escherichia sp., Bacillus sp., were taphylococcus sp, Escherichia sp., and Bacillus sp. were increased.