The quantification of ammonia concentrations has received a lot of scientific attention. Numerous devices for the quantification of NH3 in the ambient air have been developed to provide more technical possibilities for research in abating NH3 emission from various source processes. For the proper quantification of NH3, a number of sampling methods have been discussed by grouping them into different categories based on the principle of functioning. In general, active samplers employ pumps to draw air in, while passive samplers are exposed to air over a certain period of time to obtain integrated signature of NH3. In case of the former, impingers and absorption flasks can be employed simultaneously with suitable absorbents to capture NH3 passing through them. The methods of analysis include both in-situ and laboratory determination. In the laboratory, colorimetric or ion chromatographic methods are generally used for its quantification. In the field, a number of real time analyzers have been proven to be useful. These real time analyzers can be grouped according to their principle of operation. These analyzers may use the principle of spectroscopy (e.g. DOAS), photoacousticics (e.g. photoacoustic monitor) or Chemiluminescence (NOx analyzer). The automated annular denuder sampling system with on-line analyzer is also suitable for continuous monitoring of ammonia in air.

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

alloy powders were prepared using an industrial scale gas atomizer, followed by warm extrusion. The powders were almost spherical in shape. The microstructure of powders as atomized and bars as extruded was examined as a function of initial powder size distribution using Scanning Electron Microscope (SEM), Energy Dispersive X-ray Spectroscope (EDS) and X-ray Diffractometer (XRD). The grain sizes were decreased with extruding as well as decreasing the initial powder sizes. Both the ultimate strength and elongation were enhanced as the initial powder sizes were decreased.

Fe-doped TiO2 nanopowders were prepared by mechanical alloying (MA) varying Fe contents up to 8.0 wt.%. The UV-vis absorption showed that the UV absorption for the Fe-doped powder shifted to a longer wavelength (red shift). The absorption threshold depends on the concentration of nano-size Fe dopant. As the Fe concentration increased up to 4 wt.%, the UV-vis absorption and the magnetization were increased. The benefical effect of Fe doping for photocatalysis and ferromagnetism had the critical dopant concentration of 4 wt.%. Based on the UV absorption and magnetization, the dopant level is localized to the valence band of TiO2.

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.