This study investigates the influence of sintering temperature on the magnetic properties and frequency dispersion of the complex permeability of Ni–Zn–Cu ferrites used for magnetic shielding in near-field communication (NFC) systems. Sintered specimens of (Ni0.7Zn0.3)0.96Cu0.04Fe2O4 are prepared by conventional ceramic processing. The complex permeability is measured by an RF impedance analyzer in the range of 1 MHz to 1.8 GHz. The real and imaginary parts of the complex permeability depend sensitively on the sintering temperature, which is closely related to the microstructure, including grain size and pore distribution. In particular, internal pores within grains produced by rapid grain growth decrease the permeability and increase the magnetic loss at the operating frequency of NFC (13.56 MHz). At the optimized sintering temperature (1225-1250°C), the highest permeability and lowest magnetic loss can be obtained.

The morphology, crystal structure and size of aerosol nanoparticles generated by erosion of electrodes made of different materials (titanium, copper and aluminum) in a multi-spark discharge generator were investigated. The aerosol nanoparticle synthesis was carried out in air atmosphere at a capacitor stored energy of 6 J, a repetition rate of discharge of 0.5 Hz and a gas flow velocity of 5.4 m/s. The aerosol nanoparticles were generated in the form of oxides and had various morphologies: agglomerates of primary particles of TiO2 and Al2O3 or aggregates of primary particles of Cu2O. The average size of the primary nanoparticles ranged between 6.3 and 7.4 nm for the three substances studied. The average size of the agglomerates and aggregates varied in a wide interval from 24.6 nm for Cu2O to 46.1 nm for Al2O3.

To achieve the fabrication of high-quality Ag-coated Cu particles through a wet chemical process, we reported herein pretreatment conditions using an ammonium-based mixed solvent for the removal of a Cu2O layer on Cu particles that were oxidized in air for 1 hr at 200 oC or for 3 days at room temperature. Furthermore, we discussed the results of post-Ag plating with respect to removal level of the oxide layer. X-ray diffraction results revealed that the removal rate of the oxide layer is directly proportional to the concentration of the pretreatment solvent. With the results of Auger electron spectroscopy using oxidized Cu plates, the concentrations required to completely remove 50-nm-thick and 2-nm-thick oxides within 5 min were determined to be X2.5 and X0.13. However, the optimal concentrations in an actual Ag plating process using Cu powder increased to X0.4 and X0.5, respectively, because the oxidation in powder may be accelerated and the complete removal of oxide should be tuned to the thickest oxide layer among all the particles. Back-scattered electron images showed the formation of pure fine Ag particles instead of a uniform and smooth Ag coating in the Ag plating performed after incomplete removal of the oxide layer, indicating that the remaining oxide layer obstructs heterogeneous nucleation and plating by reduced Ag atoms.

The present study demonstrates the effect of freezing conditions on the pore structure of porous Cu-10 wt.% Sn prepared by freeze drying of CuO-SnO2/camphene slurry. Mixtures of CuO and SnO2 powders are prepared by ball milling for 10 h. Camphene slurries with 10 vol.% of CuO-SnO2 are unidirectionally frozen in a mold maintained at a temperature of -30oC for 1 and 24 h, respectively. Pores are generated by the sublimation of camphene at room temperature. After hydrogen reduction and sintering at 650oC for 2 h, the green body of the CuO-SnO2 is completely converted into porous Cu-Sn alloy. Microstructural observation reveals that the sintered samples have large pores which are aligned parallel to the camphene growth direction. The size of the large pores increases from 150 to 300 μm with an increase in the holding time. Also, the internal walls of the large pores contain relatively small pores whose size increases with the holding time. The change in pore structure is explained by the growth behavior of the camphene crystals and rearrangement of the solid particles during the freezing process.

The microstructural properties and electrical characteristics of sputtering films deposited with a Cu-Ga target are analyzed. The Cu-Ga target is prepared using the cold spray process and shows generally uniform composition distributions, as suggested by secondary ion mass spectrometer (SIMS) data. Characteristics of the sputtered Cu-Ga films are investigated at three positions (top, center and bottom) of the Cu-Ga target by X-ray diffraction (XRD), SIMS, 4-point probe and transmission electron microscopy (TEM) analysis methods. The results show that the Cu-Ga films are composed of hexagonal and unknown phases, and they have similar distributions of composition and resistivity at the top, center, and bottom regions of the Cu-Ga target. It demonstrates that these films have uniform properties regardless of the position on the Cu-Ga target. In conclusion, the cold spray process is expected to be a useful method for preparing sputter targets.

Cu-Mn compacts are fabricated by the pulsed current activated sintering method (PCAS) for sputtering target application. For fabricating the compacts, optimized sintering conditions such as the temperature, pulse ratio, pressure, and heating rate are controlled during the sintering process. The final sintering temperature and heating rate required to fabricate the target materials having high density are 700oC and 80oC/min, respectively. The heating directly progresses up to 700oC with a 3 min holding time. The sputtering target materials having high relative density of 100% are fabricated by employing a uniaxial pressure of 60 MPa and a sintering temperature of 700oC without any significant change in the grain size. Also, the shrinkage displacement of the Cu-Mn target materials considerably increases with an increase in the pressure at sintering temperatures up to 700oC.

Pt@Cu/C core-shell catalysts were successfully prepared by impregnation of a carbon support with copper precursor, followed by transmetallation between platinum and copper. The Pt@Cu/C core-shell catalysts retained a core of copper with a platinum surface. The prepared catalysts were used for hydrogen production through catalytic dehydrogenation of decalin for eventual application to an onboard hydrogen supply system. Pt@Cu/C core-shell catalysts were more efficient at producing hydrogen via decalin dehydrogenation than Pt/C catalysts containing the same amount of platinum. Supported coreshell catalysts utilized platinum highly efficiently, and accordingly, are lower-cost than existing platinum catalysts. The combination of impregnation and transmetallation is a promising approach for preparation of Pt@Cu/C core-shell catalysts.

Effects of conventional rolling(CR) and differential speed rolling(DSR) on the microstructure and mechanical properties of Cu-Ni-Si alloy were investigated in detail. The copper alloy with thickness of 3 mm was rolled to 50 % reduction at ambient temperature without lubricant with a differential speed ratio of 2:1. The conventional rolling in which the rolling speed of upper and lower rolls is identical was performed under identical rolling conditions. The shear strain introduced by the CR showed positive values at positions of upper roll side and negative values at positions of lower roll side. However, it showed zero or positive values at all positions for the samples rolled by the DSR. The microstrucure and texture development of the as-rolled copper alloy did not show any significant difference between CR and DSR. The tensile strength of the DSR processed specimen was larger than that of the CR processed specimen. The effects of rolling methods on the microstructure and mechanical properties of the as-rolled copper alloy are discussed in terms of the shear strain.

For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the “Newtonian flow” and has a low viscosity under 10 mPa·S, which is applicable to inkjet printing. The Cu patterns with a linewidth of 50~60 μm are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-comaleic acid)-free inks. The resistivities of Cu films are measured to be 10~15 μΩ·cm at annealing temperature of 300 ˚C.

This study reports the effects of H2S gas concentration on the properties of Cu2ZnSnS4(CZTS) thin films. Specifically, sulfurization process with low H2S concentrations of 0.05% and 0.1%, along with 5% H2S gas, was studied. CZTS films were directly synthesized on Mo/Si substrates by chemical bath deposition method using copper sulfate, zinc sulfate heptahydrate, tin chloride dihydrate, and sodium thiosulfate pentahydrate. Smooth CZTS films were grown on substrates at optimized chemical bath deposition condition. The CZTS films sulfurized at low H2S concentrations of 0.05 % and 0.1% showed very rough and porous film morphology, whereas the film sulfurized at 5% H2S yielded a very smooth and dense film morphology. The CZTS films were fully crystallized in kesterite crystal form when they were sulfurized at 500 oC for 1 h. The kesterite CZTS film showed a reasonably good room-temperature photoluminescence spectrum that peaked in a range of 1.4 eV to 1.5 eV, consistent with the optimal bandgap for CZTS solar cell applications.

Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and SiOx-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

The effect of sublimable vehicle composition in the camphor-naphthalene system on the pore structure ofporous Cu-Ni alloy is investigated. The CuO-NiO mixed slurries with hypoeutectic, eutectic and hypereutectic compo-sitions are frozen into a mold at -25oC. Pores are generated by sublimation of the vehicles at room temperature. Afterhydrogen reduction at 300oC and sintering at 850oC for 1 h, the green body of CuO-NiO is completely converted toporous Cu-Ni alloy with various pore structures. The sintered samples show large pores which are aligned parallel to thesublimable vehicle growth direction. The pore size and porosity decrease with increase in powder content due to thedegree of powder rearrangement in slurry. In the hypoeutectic composition slurry, small pores with dendritic morphologyare observed in the sintered Cu-Ni, whereas the specimen of hypereutectic composition shows pore structure of plateshape. The change of pore structure is explained by growth behavior of primary camphor and naphthalene crystals dur-ing solidification of camphor-naphthalene alloys.

Evaluations of the microstructure and mechanical properties of age hardenable Cu-2.0wt%Be alloy are performed in order to determine whether it can be used as a welding electrode for projection welding. The microstructure examinations, hardness measurements, and tensile tests of selective aging conditions are conducted. The results indicate that the aging treatment with the fine-grained microstructure exhibits better hardness and high tensile properties than those of the coarsegrained microstructure. The highest hardness value and high tensile strength are obtained from the aged condition of 300 oC for 360 min due to the presence of the metastable γ. precipitates on the grain boundaries. The values of the highest hardness and tensile strength are measured as 374 Hv and 1236.2 MPa, respectively. The metastable γ. precipitates are transferred to the equilibrium γ precipitates due to the over-aged treatment. The presence of the γ precipitates appears as nodule-like precipitates decorated around the grain boundaries. The welding electrode with the best aging treated condition exhibits better welding performance for electrodes than those of electrodes used previously.

Bi2Te3 related compounds show the best thermoelectric properties at room temperature. However, n-type Bi2Te2.7Se0.3 showed no improvement on ZT values. To improve the thermolectric propterties of n-type Bi2Te2.7Se0.3, this research has Cu-doped n-type powder. This study focused on effects of Cu-doping method on the thermoelectric properties of n-type materials, and evaluated the comparison between the Cu chemical and mechanical doping. The synthesized powder was manufactured by the spark plasma sintering(SPS). The thermoelectric properties of the sintered body were evaluated by measuring their Seebeck coefficient, electrical resistivity, thermal conductivity, and hall coefficient. An introduction of a small amount of Cu reduced the thermal conductivity and improved the electrical properties with Seebeck coefficient. The authors provided the optimal concentration of Cu0.1Bi1.99Se0.3Te2.7. A figure of merit (ZT) value of 1.22 was obtained for Cu0.1Bi1.9Se0.3Te2.7 at 373K by Cu chemical doping, which was obviously higher than those of Cu0.1Bi1.9Se0.3Te2.7 at 373K by Cu mechanical doping (ZT=0.56) and Cu-free Bi2Se0.3Te2.7 (ZT=0.51).

In this study, the effect of the friction stir welding (FSW) was compared with that of the gas tungsten arc welding (GTAW) on the microstructure and microhardness of Cu-Ni alloy weldment. The weldment of 10 mm thickness was fabricated by FSW and GTAW, respectively. Both weldments were compared with each other by optical microstructure, microhardness test and grain size measurement. Results of this study suggest that the microhardness decreased from the base metal (BM) to the heat affected zone (HAZ) and increased at fusion zone (FZ) of GTAW and stir zone (SZ) of FSW. the minimum Hv value of both weldment was obtained at HAZ, respectively, which represents the softening zone, whereas Hv value of FSW weldment was little higher than that of GTAW weldment. These phenomena can be explained by the grain size difference between HAZs of each weldment. Grain size was increased at the HAZ during FSW and GTAW. Because FSW is a solid-state joining process obtaining the lower heat-input generated by rotating shoulder than heat generated in the arc of GTAW.

The optical film for light luminance improvement of back light unit that is used in light emitting diode/liquid crystal display and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimized as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Variation of Burr and chip shape were discussed by material properties and machining method.

Metallic porous materials have many interesting combinations of physical and geometrical properties with very low specific weight or high gas permeability. In this study, highly porous Cu foam is successfully fabricated by a slurry coating process. The Cu foam is fabricated specifically by changing the coating amount and the type of polyurethane foam used as a template. The processing parameters and pore characteristics are observed to identify the key parameters of the slurry coating process and the optimized morphological properties of the Cu foam. The pore characteristics of Cu foam are investigated by scanning electron micrographs and micro-CT analyzer, and air permeability of the Cu foam is measured by capillary flow porometer. We confirmed that the characteristics of Cu foam can be easily controlled in the slurry coating process by changing the microstructure, porosity, pore size, strut thickness, and the cell size. It can be considered that the fabricated Cu foams show tremendous promise for industrial application.

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150oC in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.