본 논문에서는 15차 bézier 곡선을 사용하여 기존의 연구보다 더 유연한 빔 형상을 설계하고, 더 넓은 설계 공간에서 최적 설계를 수 행하여 최적의 열전도도를 갖는 빔 형상을 설계한다. 설계 공간이 넓어지면 그 만큼 계산양이 증가하게 되는데, 고차원 변수 공간에서 효율적으로 작동하는 인공신경망을 사용하여 최적 설계를 가속화하여 계산 한계를 극복하였다. 더 나아가 최적의 탄성계수를 갖는 빔의 형상과 비교하였으며 열전도와 탄성학 사이의 수학적 유사성을 이용하여 빔 형상을 설명한다. 본 연구에서는 인공지능을 활용 한 형상 최적설계를 통해 기존의 한계를 뛰어넘는 격자구조의 빔 형상을 제안한다. 먼저, SC(Simple Cubic), BC(Body Centered Cubic) 격자 구조 빔 형상을 bézier 곡선으로 모델링하고 bézier 곡선의 제어점 좌표를 무작위로 설정하여 학습데이터를 확보하였다. NN(Neural Network) 및 GA(Genetic Algorithm)를 통해 우수한 유효 열전도도를 가진 빔 형상을 생성하여 최적의 빔 형상을 설계하였 다. 본 연구를 통해 추후 다양한 열 조건에서 격자구조의 적절한 구조적 해답을 제시할 수 있을 것으로 기대된다.

Efforts have been extensively undertaken to tackle overheating problems in advanced electronic devices characterized by high performance and integration levels. Thermal interface materials (TIMs) play a crucial role in connecting heat sources to heat sinks, facilitating efficient heat dissipation and thermal management. On the other hand, increasing the content of TIMs for high thermal conductivity often poses challenges such as poor dispersion and undesired heat flow pathways. This study aims to enhance the through-plane heat dissipation via the magnetic alignment of a hybrid filler system consisting of exfoliated graphite (EG) and boron nitride (BN). The EG acts as a distributed scaffold in the polymer matrix, while the BN component of the hybrid offers high thermal conductivity. Moreover, the magnetic alignment technique promotes unidirectional heat transfer pathways. The hybrid exhibited an impressive thermal conductivity of 1.44 W m− 1 K− 1 at filler contents of 30 wt. %, offering improved thermal management for advanced electronic devices.

The thermal conductivity (TC) of graphene-based/metal composites is currently not satisfactory because of the existence of large interfacial thermal resistance between graphene and metal originating from the strong scattering of phonons. In this work, 6063Al-alloy-based reduced graphene oxide (rGO) composite with strong covalent bonds interface was prepared via self-assembly, reduction, and electrophoresis-deposition processes by using 3-aminopropyl triethoxysilane (APTS) as a link agent. Structural characterizations confirmed the successful construction of strong Al-O-Si-O-C covalent bonds in the as-prepared 6063Al-Ag-APTS-rGO composite, which can promote the transfer of phonons in the interface. Benefiting from the unique structure, 6063Al-Ag-APTS-rGO (214.1 W/mK) showed obviously higher cross-plane TC than 6063Al (195.6 W/mK). Comparative experiments showed that 6063Al-Ag-APTS-rGO has better cross-plane TC than 6063Al/Ag/ APTS/rGO (196.6 W/mK) prepared via physical mixing of stirring process, evidencing the significance of electrophoresisdeposition (EPD) process on constructing strong covalent bonds for improving the heat dissipation performance. Besides, the effects of different rGO contents and test temperature on the TC of the composites and their corrosion resistance were also discussed. This work demonstrated a feasible strategy for the construction of metal–carbon interface composite with improved thermal performance.

This study aimed to fabricate composites with high thermal conductivity using diglycidyl ether of bisphenol-A (DGEBA), incorporating carbon fiber cloth (CFC) and graphene as reinforcing agents. Notably, the dispersion of graphene within the DGEBA matrix was enhanced through surface modification via a silane coupling agent. The effects of CFC and graphene addition on the impact strength, thermal conductivity, and morphology of the composites were examined. The experimental results showed that the incorporation of 6 wt% CFC resulted in a substantial (16-fold) increase in impact strength. Furthermore, the introduction of 6 wt% CFCs along with 20 wt% graphene led to a remarkable enhancement in thermal conductivity to 5.7 W/(m K), which was approximately 22 and 4 times higher than the intrinsic thermal conductivities of pristine DGEBA and the CFC/DGEBA composite, respectively. The increased impact strength is ascribed to the incorporation of CFC and silane-modified graphene. Additionally, the gradual increase in thermal conductivity can be attributed to the enhanced interaction between the acidic silane-modified graphene and the basic epoxy–amine hardener within the system studied.

A thorough knowledge and understanding of the structure–property relationship between thermal conductivity and C-fiber morphology is important to estimate the behavior of carbon fiber components, especially under thermal loading. In this paper, the thermal conductivities of different carbon fibers with varying tensile modulus were analyzed perpendicular and parallel to the fiber direction. Besides the measurement of carbon fiber reinforced polymers, we also measured the thermal conductivity of single carbon fibers directly. The measurements clearly proved that the thermal conductivity increased with the tensile modulus both in fiber and perpendicular direction. The increase is most pronounced in fiber direction. We ascribed the increase in tensile modules and thermal conductivity to increasing anisotropy resulting from the orientation of graphitic domains and microvoids.

Dimethyl silicone oil is widely used due to its excellent thermal stability and good wetting properties. In this study, a series of thermal conductive materials was prepared by physically blending and chemically loading graphene as a thermal conductive filler into dimethyl silicone oil, and their thermal conductivity and tribological properties were investigated. The thermal conductivity of the composites was tested by a thermal conductivity meter and a thermal imaging camera, while the tribological properties of the composites were evaluated using a CSM friction and wear tester. The results showed that both thermal conductivity and tribological properties were improved to a certain extent. The particle size and amount of graphene had a significant influence on the thermal conductivity. For graphene with a single particle size, the thermal conductivity increased with increasing graphene content. The friction coefficient under dry friction conditions was significantly reduced by adding graphene to the silicone oil, as revealed by the friction and wear test.

This comprehensive study delves into the intricate process of exfoliating and functionalizing boron nitride nanosheets (BNNSs) extracted from hexagonal boron nitride (h-BN), and meticulously explores their potential application within epoxy composites. The extensive research methodology encompasses a sequence of treatments involving hydrothermal and sonication processes aimed at augmenting the dispersion of BNNSs in solvents. Leveraging advanced analytical techniques such as Raman spectroscopy, X-ray diffraction, and FTIR spectroscopy, the study rigorously analyzes a spectrum of changes in the BNNS’s properties, including layer count variations, interlayer interactions, crystal structure modifications, and the introduction of functional groups. The research also rigorously evaluates the impact of integrating BNNSs, specifically glycidyl methacrylate (GMA)-functionalized BNNSs, on the thermal conductivity of epoxy composites. The conclusive findings exhibit notable enhancements in thermal properties, predominantly attributed to the enhanced dispersion of fillers and enhanced interactions within the epoxy matrix. This pioneering work illuminates the wide potential of functionalized BNNSs for significantly enhancing the thermal conductivity of epoxy composites, paving the way for advanced materials engineering and practical applications.

High-temperature and high-pressure post-processing applied to sintered thermoelectric materials can create nanoscale defects, thereby enhancing their thermoelectric performance. Here, we investigate the effect of hot isostatic pressing (HIP) as a post-processing treatment on the thermoelectric properties of p-type Bi0.5Sb1.5Te3.0 compounds sintered via spark plasma sintering. The sample post-processed via HIP maintains its electronic transport properties despite the reduced microstructural texturing. Moreover, lattice thermal conductivity is significantly reduced owing to activated phonon scattering, which can be attributed to the nanoscale defects created during HIP, resulting in an ~18% increase in peak zT value, which reaches ~1.43 at 100oC. This study validates that HIP enhances the thermoelectric performance by controlling the thermal transport without having any detrimental effects on the electronic transport properties of thermoelectric materials.

Thermal management is significant to maintain the reliability and durability of electronic devices. Heat can be dissipated using thermal interface materials (TIMs) comprised of thermally conductive polymers and fillers. Furthermore, it is important to enhance the thermal conductivity of TIMs through the formation of a heat transfer pathway. This paper reports a polymer composite containing vertically aligned electrochemically exfoliated graphite (EEG). We modify the EEG via edge selective oxidation to decorate the surface with iron oxides and enhance the dispersibility of EEG in polymer resin. During the heat treatment and curing process, a magnetic field is applied to the polymer composites to align the iron oxide decorated EEG. The resulting polymer composite containing 25 wt% of filler has a remarkable thermal conductivity of 1.10 W m− 1 K− 1 after magnetic orientation. These results demonstrate that TIM can be designed with a small amount of filler by magnetic alignment to form an efficient heat transfer pathway.

Graphene nanoplatelets (GNPs) have garnered significant attention in the field of thermal management materials due to their unique morphology and remarkable thermal conductive properties. Their impressive thermal properties make them an interesting choice of nanofillers with which to produce multifunctional composite materials and a host of other applications whilst their structural and thermal properties significantly improve their target materials or composites. Therefore, this present study reviewed recent advances in the use of GNPs as nanofillers to enhance the thermal conductivity of various materials or composites. The improved thermal conductivity that GNPs impart in composites is also comprehensively compared and discussed. Therefore, this review may reveal hitherto unknown opportunities and pave the way for the production of materials with enhanced thermal applications including electronics, aerospace devices, batteries, and structural reinforcement.

This research investigated the effect of Si addition on the microstructure, mechanical properties, electric and thermal conductivity of as-extruded Al 6013 alloys. As the content of Si increased, the area fraction of the second phase increased. As the Si content increased, the average grain size decreased remarkably, from 182 (no Si addition) to 142 (1.5Si), 78 (3.0Si) and 77 μm (4.5Si) due to dynamic recrystallization by the dispersed second particles in the aluminum matrix during the hot extrusion. As the Si content increased, the yield strength and ultimate tensile strength increased. The maximum values of yield strength and ultimate tensile strength were 224 MPa and 103 MPa for the 6013-4.5Si alloy. As the amount of Si added increased, the electrical and thermal conductivity decreased. The electrical and thermal conductivity of the Al6013-4.5Si alloy were 44.0% IACS and 165.0 W/mK, respectively. The addition of Si to Al 6013 alloy had a significant effect on its thermal conductivity and mechanical properties.

A 1.8 μm thick polycrystalline diamond (PCD) thin film layer is prepared on a Si(100) substrate using hot-filament chemical vapor deposition. Thereafter, its thermal conductivity is measured using the conventional laser flash analysis (LFA) method, a LaserPIT-M2 instrument, and the newly proposed light source thermal analysis (LSTA) method. The LSTA method measures the thermal conductivity of the prepared PCD thin film layer using an ultraviolet (UV) lamp with a wavelength of 395 nm as the heat source and a thermocouple installed at a specific distance. In addition, the microstructure and quality of the prepared PCD thin films are evaluated using an optical microscope, a field emission scanning electron microscope, and a micro-Raman spectroscope. The LFA, LaserPIT-M2, and LSTA determine the thermal conductivities of the PCD thin films, which are 1.7, 1430, and 213.43 W/(m·K), respectively, indicating that the LFA method and LaserPIT-M2 are prone to errors. Considering the grain size of PCD, we conclude that the LSTA method is the most reliable one for determining the thermal conductivity of the fabricated PCD thin film layers. Therefore, the proposed LSTA method presents significant potential for the accurate and reliable measurement of the thermal conductivity of PCD thin films.

본 논문은 에너지를 실시간으로 저장할 수 있는 저장장치 중 열에너지 저장 콘크리트를 대상으로 재료의 미세구조와 물성(열전도 도)의 상관관계를 분석하는 연구를 수행하였다. 에너지 저장 콘크리트의 열전도 성능을 증가시키기 위해 혼화재인 그라파이트 (graphite)를 사용하였다. 그라파이트가 시멘트 질량의 10%와 15%를 치환한 시편과 일반 콘크리트(OPC) 시편을 제작하여 그라파이 트의 혼입에 따른 미세구조 변화 및 열전도도의 영향을 마이크로 스케일에서 분석하였다. 마이크로-CT를 활용하여 OPC와 그라파이 트를 사용한 콘크리트의 공극률을 비교하였으며, 확률함수를 사용하여 미세구조 특성을 정량화하였다. 미세구조 특성 차이가 열전도 도에 미치는 영향을 확인하기 위해 3차원 가상 시편을 제작하여 열해석을 수행하였으며, 이를 열평판법을 사용하여 측정한 열전도도 실험 결과와 비교하였다. 열해석 수행 시 그라파이트 재료가 지닌 열전도도 성능을 반영하기 위하여 해석 결과와 실험 결과를 기반으 로 고체상의 열전도도를 역해석을 통해 계산하였으며, 그라파이트가 시편의 열전도도에 미치는 영향에 대해 분석하였다.

In order to improve the thermal shock and ablation resistance of high thermal conductivity carbon/carbon composites, carbon nanotubes (CNTs) were introduced by electrophoretic deposition. After modification, the flexural strength of the composites increases by 53.0% due to the greatly strengthened interfaces. During thermal shock between 1100 °C and room temperature for 30 times, the strength continues to increase, attributed to the weakened interfaces in favor of fiber and CNT pull-out. By introducing CNTs at interfaces, thermal conductivity of the composites along the fiber axial direction decreases and that along the fiber radial direction increases. As the thermal shock process prolongs, since the carbon structure integrity of CNT and matrix in the modified composites is improved, the conductivity increases whatever the orientation is, until the thermal stress causes too many defects. As for the anti-ablation performance, the mass ablation rates of the CNT-modified composites with fibers parallel to and vertical to the flame decrease by 69.6% and 43.9% respectively, and the difference in the mass ablation rate related with fiber orientations becomes much less. Such performance improvement could be ascribed to the reduced oxidative damage and the enhanced interfaces.

Effects of Sc addition on microstructure, electrical conductivity, thermal conductivity and mechanical properties of the as-cast and as-extruded Al-2Zn-1Cu-0.3Mg-xSc (x = 0, 0.25, 0.5 wt%) alloys are investigated. The average grain size of the as-cast Al-2Zn-1Cu-0.3Mg alloy is 2,334 μm; however, this value drops to 914 and 529 μm with addition of Sc element at 0.25 wt% and 0.5 wt%, respectively. This grain refinement is due to primary Al3Sc phase forming during solidification. The as-extruded Al-2Zn-1Cu-0.3Mg alloy has a recrystallization structure consisting of almost equiaxed grains. However, the asextruded Sc-containing alloys consist of grains that are extremely elongated in the extrusion direction. In addition, it is found that the proportion of low-angle grain boundaries below 15 degree is dominant. This is because the addition of Sc results in the formation of coherent and nano-scale Al3Sc phases during hot extrusion, inhibiting the process of recrystallization and improving the strength by pinning of dislocations and the formation of subgrain boundaries. The maximum values of the yield and tensile strength are 126 MPa and 215 MPa for the as-extruded Al-2Zn-1Cu-0.3Mg-0.25Sc alloy, respectively. The increase in strength is probably due to the existence of nano-scale Al3Sc precipitates and dense Al2Cu phases. Thermal conductivity of the as-cast Al-2Zn-1Cu-0.3Mg-xSc alloy is reduced to 204, 187 and 183 W/MK by additions of elemental Sc of 0, 0.25 and 0.5 wt%, respectively. On the other hand, the thermal conductivity of the as-extruded Al-2Zn-1Cu-0.3Mg-xSc alloy is about 200 W/Mk regardless of the content of Sc. This is because of the formation of coherent Al3Sc phase, which decreases Sc content and causes extremely high electrical resistivity.

Herein, we report significantly enhanced mechanical properties and thermal conductivity of polyimide (PI) by incorporating a small amount (0.01 wt %) of individualized boron-doped high-quality graphene as a filler. The boron-doped expandable graphite (B-EG) was synthesized by mixing boric acid ( H3BO4) with expandable graphite (EG) and thermally treating the mixture at 2450 °C for 30 min using a graphite furnace in an argon atmosphere. The boron-doped graphene (B-g) was prepared by the solution-phase exfoliation of B-EG with an ultrasonication process, which is a method to obtain individualized graphene as well as few-layer graphene. The PI nanocomposites were prepared using the obtained graphene. The PI nanocomposites synthesized with high-quality B-graphene (B-g) showed enhanced mechanical properties and thermal conductivity compared to those of pure PI due to the doping effects and strong interfacial interactions between graphene and the PI matrix.

Low thermal conductivity carbon fibers from polyacrylonitrile (PAN) are currently being explored as an alternative for traditional rayon-based carbon fibers with a thermal conductivity of 4 W/m K. Compared to multiple component electrospinning, this research demonstrated another feasible way to make low thermal conductivity carbon fibrous material by electrospinning PAN followed by carbonization and alkali activation. The effects of activation condition on microstructure, pore formation, and thermal conductivity of the resultant carbon nanofibrous material were investigated. The processing-structure-thermal conductivity relationship was revealed and mechanism of thermal conductivity reduction was discussed. The overall thermal conductivity of the prepared carbon nanofibrous material is a result of combined effects from factors of carbon structure and number of pores rather than volume of pores or specific surface area. The activated carbon nanofibrous materials showed thermal conductivity as low as 0.12 W/m K, which is a reduction of ~ 99% when compared to that of solid carbon film and a reduction of ~ 95% when compared to that of carbon nanofibrous material before activation.

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance(Rth) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.