스트레스 음파(5,000 Hz, 95 dB)는 아메리카잎굴파리(Liriomyza trifolii) 번데기의 성충 발육을 억제시켰다. 이러한 발육 교란에 대한 생리적 원인을 규명하고자 이 곤충의 스트레스 음파에 대한 발현 유전체를 무처리 곤충과 비교 분석하였다. 발현유전체는 전사체를 대상으로 하였으며, 이는 전체 RNA를 Illumina HiSeq2000을 이용한 차세대우전체 염기서열 분석 기술을 이용하였다. 처리구와 무처리구에서 전체 전사체의 분석염기수는 약 16 Gb였고, 이를 토대로 77,553개의 contig가 규명되었다. 이 contig들을 대상으로 스트레스 음파 처리에 따라 발현량 차이를 보인 비율은 약 62.8%를 차지하였다. 이 가운데 대조구에 비해 10배 이상 발현량이 감소한 contig 숫자는 3,994개이고, 증가한 contig 숫자는 1,120개를 나타냈다. 특별히 성장과 변태와 관련된 insulin 및 ecdysone 신호 유전자의 발현이 영향을 받았다. 또한 일반 물질대사와 관련된 유전자들의 발현이 스트레스 음파 처리에 따라 감소를 보였다. 그러나 스트레스 관련 유전자인 지질동원호르몬 신호전달과정 유전자들은 발현량이 증가하였다. 이상의 스트레스 음파에 따라 아메리카잎굴파리의 유전체 발현량 변화는 이 곤충의 정상적 성충 발육에 교란을 주었을 것으로 추정된다. 향후 스트레스 음파에 처리에 따라 발현에 교란을 받은 유전자들의 성충 발육 연관성에 대한 기능 분석이 필요하다.

With the advent of the genomics era powered by DNA sequencing technologies, life science is being transformed significantly and biological research and development have been accelerated. Environmental biology concerns the relationships among living organisms and their natural environment, which constitute the global biogeochemical cycle. As sustainability of the ecosystems depends on biodiversity, examining the structure and dynamics of the biotic constituents and fully grasping their genetic and metabolic capabilities are pivotal. The high-speed highthroughput next-generation sequencing can be applied to barcoding organisms either thriving or endangered and to decoding the whole genome information. Furthermore, diversity and the full gene complement of a microbial community can be elucidated and monitored through metagenomic approaches. With regard to human welfare, microbiomes of various human habitats such as gut, skin, mouth, stomach, and vagina, have been and are being scrutinized. To keep pace with the rapid increase of the sequencing capacity, various bioinformatic algorithms and software tools that even utilize supercomputers and cloud computing are being developed for processing and storage of massive data sets. Environmental genomics will be the major force in understanding the structure and function of ecosystems in nature as well as preserving, remediating, and bioprospecting them.

To maximize effectiveness of standardization activities, it is essential to set priorities for determined standardization work items in the next generation internet protocol television (NG-IPTV) technologies. In this study, the analytic hierarchy process(

In the environment of 450mm wafers production known as the next-generation semiconductor production process, one of the most significant features is the full automation over the whole manufacturing processes involved. The full automation system for 450mm

There has been a huge progress in semiconductor manufacturing processes such as reduction of the design rule(DR) and development of multi-processes. And, semiconductor industries have steadily extended its business and market share by reducing the design rule(DR) and enlarging the wafer size as well as by resolving many difficult technical problems through various noble approaches in order to reduce the production cost and to improve the yield. In semiconductor manufacturing, there is a significant difference in the number of memory chips produced according to the wafer size, wafer yield, and the level of the design rule even though the same number of wafers were put to the manufacturing process. So, almost all semiconductor manufacturing companies reach the conclusion that the enlarged size of wafer should be adopted in order to enhance the productivity and reduce the production cost. Thus, in this study, we investigate the specifications of the key functions and capabilities of the necessary modules in the yield analysis and improvement system required to acquire the stationary wafer yield with considering the 450mm wafer manufacturing system. Then the results of this research will be helpful for constructing the advanced yield analysis and improvement system called Real-Time Fault Monitoring and Detection (RTFMD) system.

In 450mm wafers production environment for next generation Fab, one of the most significant features is the adoption of full automation to the whole manufacturing processes involved. The full automation system will prevent the workers from intervening the manufacturing processes as much as possible and increase the importance of each individual wafer noticeably, and thus require a more robust scheduling system for entire semiconductor manufacturing processes. The scheduling system for 450mm wafers production also should be capable of monitoring the status of each individual wafer and collecting useful Fab data in real time. In this study, we first analysis of cluster tool in 450mm wafers production environment, and then propose a real-time scheduling algorithm based on timetabling algorithm.