검색결과

검색조건
좁혀보기
검색필터
결과 내 재검색

간행물

    분야

      발행연도

      -

        검색결과 103

        21.
        2015.04 KCI 등재 구독 인증기관 무료, 개인회원 유료
        In this paper, the design of hydraulic actuating circuit of doing over-running load was performed. Generally, the counter balance valve has been used to protect over-run or free falling of acuating system. But sometimes, it makes some undesirable problems such as pressure surge or vibration. To overcome such problems and satisfy the system requirements, we suggest the hydraulic circuit actuated by servo valve. In order to verify the properness of suggested hydraulic circuit, hydraulic actuator with servo valve was modeled using ADAMS/Hydraulic which is a commercial dynamic analysis software for multi-body system. Also, the effectiveness of hydraulic actuating circuit was verified via test bed and real plant.
        4,000원
        22.
        2014.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
        The steam table in saturated and superheated region was modeled simultaneously using the neural networks. A variable was introduced to distinguish between the saturation and the superheat. The relative errors were compared with the quadratic spline interpolation method. The relative errors by the neural networks were superior to those by the quadratic spline interpolation method over almost all ranges of temperatures and properties. The overall errors in the saturated region were better than those in the superheated region. From the analysis, it was confirmed that the neural networks could be a very powerful tool for simultaneous modeling of superheated and saturated steam table
        4,000원
        23.
        2014.11 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at 50˚C. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with< 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of 50˚C.
        4,000원
        24.
        2014.02 KCI 등재 구독 인증기관 무료, 개인회원 유료
        The thermodynamic state variables in superheated region of steam table are not wholy obtained by measurements. This means that steam table contains a little error. In this study small error was artificially added to superheated variables and modeled using neural networks. The results were compared with the analysis using quadratic spline interpolation method. By and large the relative errors of variables by neural networks were sufficiently small and similar to or less than those by quadratic spline interpolation method. It was concluded that neural networks could be one good way of modeling for superheated steam table.
        4,000원
        25.
        2013.11 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of CuSO4·5H2O as the main metal source, NaH2PO2·H2O as the reducing agent, C6H5Na3O7·2H2O and NH4Cl as the complex agents, and NiSO4·6H2O as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using NH4OH. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at 70˚C. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.
        4,000원
        26.
        2013.06 KCI 등재 구독 인증기관 무료, 개인회원 유료
        In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.
        4,000원
        28.
        2012.06 KCI 등재 구독 인증기관 무료, 개인회원 유료
        Generally it is needed to have a multi stage drawing operation to increase a drawing ratio. So, this study is about the hydraulic circuit design of the 3 stage deep drawing machine. As the drawing ratio is large or deep, the quality of deep drawing products are affected more by the force and velocity of the press cylinder. Therefore using the computer simulation, the pressure reponses which are related to the force and velocity of press cylinder are analysed, and the design of the hydraulic circuit are proposed. The results of simulation shows that it correspond to experiments and have good feasibility. Proposed hydraulic circuit can be used to improve the quality of a deep drawing products.
        4,000원
        30.
        2011.12 KCI 등재 구독 인증기관 무료, 개인회원 유료
        정확한 오이의 형상 및 위치를 인식하기 위하여 형상인식 알고리즘에 대한 연구를 수행하였다. 실제 영상에서 오이의 형상과 위치를 판정할 수 있도록 알고리즘을 개발한 결과, 다음과 같은 결론을 얻었다. 오이의 특징형상 검출은 15×15 간격으로 자동검출 되도록 처리하였다. 오이로 인식된 출력패턴 중에서 오검출된 출력패턴의 비율은 0.1~4.2%로 나타났다. 오류역전파 알고리즘은 영상크기를 445×363, 501×391, 300×421, 450×271, 297×421의 크기에 따라 출력패턴을 얻은 결과 영상의 크기에 따른 검출 값의 변화는 없는 것으로 나타났다. 학습패턴 수가 25개로 증가하면 영상에서 다른 패턴을 검출하는 비율이 16.02%로 나타났다. 또한 학습패턴이 2개인 경우 40개의 영상에서 8개의 오이를 검출하지 못하였다. 학습패턴의 수가 7~9개인 경우 오이의 검출이 가장 좋은 것으로 나타났다.
        4,000원
        33.
        2011.04 KCI 등재 구독 인증기관 무료, 개인회원 유료
        석탄회는 독특한 화학조성과 광물학적 특징을 가지고 있다. 본 연구는 해안가에 위치한 영동화력발전소의 매립 호수에서 배출되는 석탄회와 주변 해수와의 반응에서 토착 미생물이 중금속 용출에 어떤 영향을 미치는지를 알아보았다. 매립 호수의 pH는 6.3-8.5로 나타났다. 본 연구를 위해 매립 호수의 세 지점을 선정하여 각 지점에서 석탄회(0.4 L)와 해수(1.6 L)가 혼합된 세 개의 시료를 채취하였다. 채취한 시료는 각각 120˚C, 2.5기압 환경하에서 멸균 처리하고, 미생물의 활동을 촉진하기 위해 글루코스를 첨가하여 배양하였으며, 나머지 하나는 자연 상태로 60일 동안 보관하면서 박테리아의 활동에 따른 지화학적 변화과정을 살펴보았다. 다른 시료와 비교하여 글루코스를 첨가한 시료에서 15일 후에 알카리도가 크게 증가하였으며, Mg, Ca, K와 같은 양이온은 글루코스를 넣은 시료에서 초기에 증가하다가 15일 이후 감소하였다. SO42-는 글루코스를 첨가한 시료에서 크게 감소하였다. 이러한 지화학적 결과는 매립 호수에 서식하는 박테리아의 활동성과 관련이 있다. 이러한 결과는 석탄회 내에 서식하는 박테리아의 특성을 이해하기 위한 기초자료로서 활용될 수 있을 것으로 판단된다.
        4,000원
        35.
        2010.01 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).
        4,000원
        37.
        2008.09 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        Electrical properties of multi-channel metal-induced unilaterally precrystallized polycrystalline silicon thin-film transistor (MIUP poly-Si TFT) devices and circuits were investigated. Although their structure was integrated into small area, reducing annealing process time for fuller crystallization than that of conventional crystal filtered MIUP poly-Si TFTs, the multi-channel MIUP poly-Si TFTs showed the effect of crystal filtering. The multi-channel MIUP poly-Si TFTs showed a higher carrier mobility of more than 1.5 times that of the conventional MIUP poly-Si TFTs. Moreover, PMOS inverters consisting of the multi-channel MIUP poly-Si TFTs showed high dynamic performance compared with inverters consisting of the conventional MIUP poly-Si TFTs.
        3,000원
        38.
        2007.12 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.
        4,000원
        39.
        2007.06 KCI 등재 구독 인증기관 무료, 개인회원 유료
        본 연구는 우리나라 서해안에서 월동하는 수조류 군집의 특성 및 환경요인에 따른 분포 특성을 밝히고자 수행되었다. 수조류 군집조사는 10개 지역에서 실시되었으며, 환경요인으로 토지피복도 비율을 측정하였다. 전체 조사지역에서 종 구성은 수면성 오리류가 84%로 가장 높은 비율을 나타냈고, 그 외 잠수성 오리류, 섭금류, 기러기류, 갈매기류 등이 많이 관찰되었다. 가장 높은 우점도를 나타낸 종은 청둥오리(Anas platyrhynchos)였으며 다음으로 가창
        4,000원
        1 2 3 4 5