In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 °C, die bonding and isothermal heat treatment at 330 °C for 5 min and wire bonding at 260 °C, respectively. At the interface between the chip and lead frame, Ni3Sn4 and Ag3Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni3Sn4 and Ag3Sn IMCs. After the wire bonding process, the interface is composed of Ni3Sn4, Ag3Sn and (Ag,Cu)3Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520oC. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515oC following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn–Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

Extensive research is being carried out on Ni-rich Li(NixCoyMn1-x-y)O2 (NCM) due to the growing demand for electric vehicles and reduced cost. In particular, Ni-rich Li(NixCoyMn1-x-y-zAlz)O2 (NCMA) is attracting great attention as a promising candidate for the rapid development of Co-free but electrochemically more stable cathodes. Al, an inactive element in the structure, helps to improve structural stability and is also used as a doping element to improve cycle capability in Ni-rich NCM. In this study, NCMA was successfully synthesized with the desired composition by direct coprecipitation. Boron and tin were also used as dopants to improve the battery performance. Macro- and microstructures in the cathodes were examined by microscopy and X-ray diffraction. While Sn was not successfully doped into NCMA, boron could be doped into NCMA, leading to changes in its physicochemical properties. NCMA doped with boron revealed substantially improved electrochemical properties in terms of capacity retention and rate capability compared to the undoped NCMA.

Zintl phase Mg3Sb2 is a promising thermoelectric material in medium to high temperature range due to its low band gap energy and characteristic electron-crystal phonon-glass behavior. P-type Mg3Sb2 has conventionally exhibited lower thermoelectric properties compared to its n-type counterparts, which have poor electrical conductivity. To address these problems, a small amount of Sn doping was considered in this alloy system. P-type Mg3Sb2 was synthesized by controlled melting, pulverizing, and subsequent vacuum hot pressing (VHP) method. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to investigate phases and microstructure development during the process. Single phase Mg3Sb2 was successfully formed when 16 at.% of Mg was excessively added to the system. Nominal compositions of Mg3.8Sb2-xSnx (0 ≤ x ≤ 0.008) were considered in this study. Thermoelectric properties were evaluated in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity. A peak ZT value ≈ 0.32 was found for the specimen Mg3.8Sb1.994Sn0.006 at 873 K, showing an improved ZT value compared to intrinsic one. Transport properties were also evaluated and discussed.

The purpose of this study is to develop a zirconium-based alloy with low modulus and magnetic susceptibility to prevent the stress-shielding effect and the generation of artifacts. Zr-7Cu-xSn (x = 1, 5, 10, 15 mass%) alloys are prepared by an arc melting process. Microstructure characterization is performed by microscopy and X-ray diffraction. Mechanical properties are evaluated using micro Vickers hardness and compression test. The magnetic susceptibility is evaluated using a SQUIDVSM. The average magnetic susceptibility value of the Zr-7Cu-xSn alloy is 1.176 × 108 cm3g1. Corrosion tests of zirconiumbased alloys are conducted through polarization test. The average Icorr value of the Zr-7Cu-xSn alloy is 0.1912 A/cm2. The elastic modulus value of 14 ~ 18 GPa of the zirconium-based alloy is very similar to the elastic modulus value of 15 ~ 30 GPa of the human bone. Consequently, the Sn added zirconium alloy, Zr-7Cu-xSn, is very interesting and attractive as a biomaterial that reduces the stress-shielding effect caused by differences of elastic modulus between human bone and metallic implants. In addition, this material has the potential to be used in metallic dental implants to effectively eliminate artifacts in MRI images due to low magnetic susceptibility.

The powder manufacturing process using the gas atomizer process is easy for mass production, has a fine powder particle size, and has excellent mechanical properties compared to the existing casting process, so it can be applied to various industries such as automobiles, electronic devices, aviation, and 3D printers. In this study, a modified A4032-xSn (x = 0, 1, 3, 5, and 10 wt.%) alloy with low melting point properties is investigated. After maintaining an argon (Ar) gas atmosphere, the main crucible is tilted; containing molten metal at 1,000℃ by melting the master alloy at a high frequency, and Ar gas is sprayed at 10 bar gas pressure after the molten metal inflow to the tundish crucible, which is maintained at 800℃. The manufactured powder is measured using a particle size analyzer, and FESEM is used to observe the shape and surface of the alloy powder. DSC is performed to investigate the change in shape, according to the melting point and temperature change. The microstructure of added tin (Sn) was observed by heat treatment at 575℃ for 10 min. As the content of Sn increased, the volume fraction increased to 1.1, 3.1, 6.4, and 10.9%.

고온에서 진행되는 프로판 탈수소 반응에서 촉매의 불활성화의 주된 원인은 코크 침적, 소결현상이 있다. 이러한 불활성화를 줄이는 촉매를 연구하기 위해, 본 연구에서는 열적 안정성이 높은 MgAl2O4를 담체로 적용하여 프로판 탈수소 반응용 촉매로의 활용성을 확인하고자 하였다. Alcohthermal method로 MgAl2O4를 소성온도 800, 900, 1000℃로 달리하여 제조하였고, Pt와 Sn을 공동함침법으로 담지하여 Pt-Sn/MgAl2O4촉매를 제조하였다. 열적안정성의 확인을 위해 반응온도를 고온의 650, 600℃에서 진행하였다. 반응실험 결과 반응온도에 상관없이 담체의 소성온도가 800℃인 담체적용 촉매일 때 프로판 탈수소 반응 실험의 전환율과 수율이 담체소성온도가 900,1000℃인 담체적용 촉매보다 높은 것을 확인하였고, 반응온도가 고온인 650℃일 때는 Pt-Sn/θ-Al2O3보다도 더 높은 수율을 가지는 것을 볼 수 있었다. 특성분석으로는 TGA, BET, XRD, CO-화학흡착, SEM-EDS 분석을 실시하였다. MgAl2O4-800oC가 좋은 수율과 Pt분산도 및 적은 불활성화 정도의 관계를 서로 연관 지어 확인하였다.