고준위폐기물을 심지층에 처분하기 위한 공학적방벽의 구성 요소로는 처분용기, 완충재, 뒷채움재 등이 있다. 이 중 완충재는 처분용기와 근계암반 사이의 빈 공간에 설치되는 물질로써, 주변 지하수로부터 처분용기를 보호하며 방사성 핵종의 유출을 저지하는 등의 역할을 한다. 또한 처분용기에서 발생하는 고온의 열량은 완충재로 직접 전파되기에 완충재의 열전도도는 처분시스템의 안전성 평가에 있어 매우 중요하다고 할 수 있다. 따라서 본 연구에서는 국내 경주산 압축 벤토나이트 완충재의 열전도도 특성을 규명하였으며 실제 처분용기에서 발생되는 고온의 특성을 반영하여 상온에서 80~90℃까지의 범위에서 압축 벤토나이트의 열전도도를 측정하였다. 온도증가에 따라 압축 벤토나이트의 열전도도는 5~20% 가량 증가하였으며 초기 포화도가 클수록 열전도도 증가는 더 크게 나타났다.

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance(Rth) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

In this study, MgO–CaO–Al2O3–SiO2 (MCAS) nanocomposite glass powder having a mean particle size of 50 nm and a specific surface area of 40 m2/g is used as a sintering additive for AlN ceramics. Densification behaviors and thermal properties of AlN with 5 wt% MCAS nano-glass additive are investigated. Dilatometric analysis and isothermal sintering of AlN-5wt% MCAS compact demonstrates that the shrinkage of the AlN specimen increases significantly above 1,300oC via liquid phase sintering of MCAS additive, and complete densification could be achieved after sintering at 1,600oC, which is a reduction in sintering temperature by 200oC compared to conventional AlN-Y2O3 systems. The MCAS glass phase is satisfactorily distributed between AlN particles after sintering at 1,600oC, existing as an amorphous secondary phase. The AlN specimen attained a thermal conductivity of 82.6 W/m·K at 1,600oC.

Al/expanded graphite was successfully synthesized through a facile method including ultrasonic and heat treatment. In the well-designed three dimensional structure, expanded graphite(EG) works as a conductive matrix to support coated Al particles. The effects of the fabrication parameters on the microstructures and thermal conductivities of these composites were investigated. As a result, it was found that composites with graphite volume fraction of 17.4-69.4% sintered at 600 oC/45 MPa exhibit in-plane thermal conductivities of 380-940 W/mK, over 90 % of the predictions by rule of mixture. According to the non-destructive analysis results, the synergistic enhancement was caused by the formation of efficient thermally conductive pathways due to the hybrid of the differently sized EG. The structure integrates the advantages of expanded graphite as a conductive support, preserving the electrode activity and integrity and improving the electrochemical performance.

In this study, cladding materials were prepared by explosion pressure welding of materials with different thermal conductivity to fabricate heating block for 3D printing. The following conclusions were obtained as a result of measuring the thermal conductivity of the clad material. Experimental results show that the lowest thermal conductivity of aluminum and titanium is 116.3 ± 0.4 W / mK.

The effect of CNT diameters on properties of CNT-polyamide composites was investigated such as electrical conductivity, tensile strength and thermal conductivity. To get different diameter distributions of CNTs, several portions of Mo and Fe in Mo-Fe/MgO catalysts were synthesized by a combustion method at 600℃. And all CNTs growed at 900℃ with 3 SLM methane and 1 SLM hydrogen for 40min. Four kinds of CNTs with different diameter distributions, such as 1~3nm, 3~7nm, 7~13nm, and 10~30nm, were selected to make CNT-polyamide composites. Each composite was manufactured by a solution mixing using bar-type ultra-sonicator in the CNT portions from 1phr to 50phr. And electrical conductivity, tensile strength, and thermal conductivity were measured. Three properties of CNT-polyamide composite, manufactured with 10nm diameter, were more excellent compared to other composites, with electrical conductivity  Ω at 7phr, thermal conductivity 2.4.W/mK at 40phr, tensile strength 60MPa at 30phr. CNTs with a diameter of 10nm were superior to other diameters for the multi-functional composite such as CNT-polyamide composites.

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and 50 μm are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to 150oC in all diamond size conditions. When the diamond particle size is increased from 15 μm to 50 μm (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

현재 고준위 방사성 폐기물 심층 처분 시스템에서 기본 완충재 물질로서 건조밀도 1.6 g/cm3의 경주산 칼슘 벤토나이트 를 사용하고 있으나, 열전도도가 낮은 단점이 있다. 따라서 본 연구에서는 기준 완충재의 열전도율을 0.8 W/mK에서 1.0 W/mK로 향상시키기 위한 목적으로 다양한 첨가제를 다양한 혼합 방법을 통해 배합하고 열전도도를 측정하였다. 첨가제는 CNT(Cabon Nano Tube), Graphite, Alumina, CuO 및 Fe2O3 등을 사용하였다. 혼합 방법의 경우, 핸드 믹서기를 통한 건식 혼합, 습식 Milling 혼합, 건식 Ball Mill 혼합 등을 실시하였다. Ball Mill 혼합의 경우가 가장 균일하게 혼합되었기 때문에, 값 의 편차가 가장 적었고 열전도도 증가율이 가장 좋았다. 지금까지 수행된 시험에서 소량의 고열전도 물질의 첨가로 경주산 칼슘 벤토나이트의 열전도도를 1.0 W/mK 수준으로 용 이하게 증가시킬 수 있음을 실험적으로 확인할 수 있었다. 결론적으로, 본 연구에서 제시된 열전도 향상 방법은, 첨가제 혼합 이 벤토나이트의 기본 성질인 팽윤압과 수리전도도에 미치는 영향까지 제시된다면, 국내 고준위폐기물 처분장의 개념 설계에 유용하게 활용될 수 있을 것으로 기대된다.

본 연구에서는 분자동역학 전산모사와 유한요소해석 기반의 균질화 기법을 통해 나노복합재의 열전도 특성을 정확하고 효율적으로 예측할 수 있는 순차적 멀티스케일 균질화 해석기법을 제안하였다. 나노입자의 크기효과가 나노복합재의 유효 열전도 특성에 미치는 영향을 조사하기 위해 크기가 다른 구형 나노입자가 첨가된 나노복합재의 열전도 계수를 분자동역 학 전산모사를 통해 예측했고, 그 결과 나노입자의 크기가 작아질수록 계면에서의 Kapitza열저항에 의해 나노복합재의 열 전도 계수가 점차 감소하는 것으로 나타났다. 이러한 나노입자의 크기효과를 균질화 해석모델을 통해 정확하게 묘사하기 위해 Kapitza 열저항에 의한 계면에서의 온도 불연속 구간과 고분자 기지가 높은 밀도를 가지며 흡착되는 유효계면을 추가 적인 상으로 도입하여 나노복합재를 입자, Kapitza 계면, 유효계면, 기지로 구성된 4상의 연속체 구조로 모델링하였다. 이 후 순차적 멀티스케일 균질화 해석기법을 통해 유효계면의 열전도 계수를 나노복합재의 열전도 계수로부터 역으로 예측 했으며, 이를 입자의 반경에 대한 함수로 근사하였다. 근사 함수를 토대로 다양한 입자 체적분율과 반경에 대한 나노복합 재의 유효 열전도 특성을 예측하였으며, 유효계면에 대한 매개변수 연구를 수행하였다.

The thermal conductivity for the ground heat exchanger installed in the local facilities of greenhouse area at JangSu-Gun in Jeollabuk-Do was analyzed experimentally. For measuring the thermal conductivity of the ground heat exchanger, a bore hole was punched at the size of diameter 150mm, depth 160m. And a closed-type heat exchanger of high density polyethylene at the size of diameter 40mm was installed vertically. The heated water by an electric heater was circulated through the ground heat exchanger with a pump. The inlet/outlet temperatures and the flow rates of this water are measured and the thermal conductivity was calculated. The experimental results were as follows. The inlet/outlet temperatures of the ground heat exchanger were increased rapidly until 7 hours, then they were increased gently and the difference of inlet/outlet temperature was maintained at about 4.5℃. The thermal conductivity calculated by the line source theory was 2.207W/mK.

An experimental study was performed to determine the thermal conductivities of polymer aqueous solutions under static condition. Pseudoplastic fluids were considered as test fluids. A coaxial cylinder apparatus with a rotating outer cylinder and a stationary inner cylinder was installed to measure the thermal conductivities of the test fluid. First, the thermal conductivity of distilled water was measured to validate the instrument. The experimental water data agreed within 1% of literature values and there was no effect of outer cylinder rotation (shear field). In addition, for polymer aqueous solutions such as aqueous Carboxy-methyl Cellulose solutions, thermal conductivities were also in agreement within 5% of literature values for Carboxy-methyl Cellulose solutions depending on the polymer concentration and temperature.