Cu-Ni alloys with unidirectionally aligned pores were prepared by freeze-drying process of CuO-NiO/cam-phene slurry. Camphene slurries with dispersion stability by the addition of oligomeric polyester were frozen at -25˚C,and pores in the frozen specimens were generated by sublimation of the camphene during drying in air. The green bod-ies were hydrogen-reduced at 300˚C and sintered at 850˚C for 1h. X-ray diffraction analysis revealed that CuO-NiOcomposite powders were completely converted to Cu-Ni alloy without any reaction phases by hydrogen reduction. Thesintered samples showed large and aligned parallel pores to the camphene growth direction, and small pores in the inter-nal wall of large pores. The pore size and porosity decreased with increase in CuO-NiO content from 5 to 10 vol%.The change of pore characteristics was explained by the degree of powder rearrangement in slurry and the accumulationbehavior of powders in the interdendritic spaces of solidified camphene.

In order to fabricate the porous Al₂O₃ with dispersion of nano-sized Cu particles, freeze-drying of cam-phene/Al₂O₃ slurry and solution chemistry process using Cu-nitrate are introduced. Camphene slurries with 10vol% Al₂O₃ was frozen at -25˚C. Pores were generated by sublimation of the camphene during drying in air. The sinteredsamples at 1400 and 1500oC showed the same size of large pores which were aligned parallel to the sublimable vehiclesgrowth direction. However, the size of fine pores in the internal walls of large pores decreased with increase in sinteringtemperature. It was shown that Cu particles with the size of 100 nm were homogeneously dispersed on the surfaces ofthe large pores. Antibacterial test using fungus revealed that the porous Al₂O₃/1vol% Cu composite showed antifungalproperty due to the dispersion of Cu particles. The results are suggested that the porous composites with required porecharacteristics and functional property can be fabricated by freeze-drying process and addition of functional nano par-ticles by chemical method.

Freeze drying of a porous Cu-Sn alloy with unidirectionally aligned pore channels was accomplished by using a composite powder of CuO-SnO2 and camphene. Camphene slurries with CuO-SnO2 content of 3, 5 and 10 vol% were prepared by mixing with a small amount of dispersant at 50˚C. Freezing of a slurry was done at -25˚C while the growth direction of the camphene was unidirectionally controlled. Pores were generated subsequently by sublimation of the camphene during drying in air for 48 h. The green bodies were hydrogen-reduced at 650˚C and then were sintered at 650˚C and 750˚C for 1 h. XRD analysis revealed that the CuO-SnO2 powder was completely converted to Cu-Sn alloy without any reaction phases. The sintered samples showed large pores with an average size of above 100μm which were aligned parallel to the camphene growth direction. Also, the internal walls of the large pores had relatively small pores. The size of the large pores decreased with increasing CuO-SnO2 content due to the change of the degree of powder rearrangement in the slurry. The size of the small pores decreased with increase of the sintering temperature from 650˚C to 750˚C, while that of the large pores was unchanged. These results suggest that a porous alloy body with aligned large pores can be fabricated by a freeze-drying and hydrogen reduction process using oxide powders.

Cu2ZnSn(Sx,Se1-x)4 (CZTSSe) thin films were prepared by sulfurization of evaporated precursor thin films. Precursor was prepared using evaporation method at room temperature. The sulfurization was carried out in a graphite box with S powder at different temperatures. The temperatures were varied in a four step process from 520˚C to 580˚C. The effects of the sulfurization temperature on the micro-structural, morphological, and compositional properties of the CZTSSe thin films were investigated using X-ray diffraction (XRD), Raman spectra, field emission scanning electron microscopy (FE-SEM), and transmission electron microscopy (TEM). The XRD and Raman results showed that the sulfurized thin films had a single kesterite crystal CZTSSe. From the FE-SEM and TEM results, the Mo(Sx,Se1-x)2 (MoSSe) interfacial layers of the sulfurized CZTS thin films were observed and their thickness was seen to increase with increasing sulfurization temperature. The microstructures of the CZTSSe thin films were strongly related to the sulfurization temperatures. The voids in the CZTSSe thin films increased with the increasing sulfurization temperature.

본 연구에서는 내식성이 우수한 동합금에 대하여 내구성 향상을 위해 쇼트피닝 시간을 변수로 표면 개질하여 전기화학적 특성과 조직 변화를 관찰하였다. 그 결과 쇼트피닝 후 표면에 전체적으로 요철이 발생하였으며, 시간이 증가할수록 커버리지 향상에 따른 균질화 현상이 관찰되었다. 또한 쇼트피닝된 모든 시험편에서 경도가 향상되었으며, 쇼트피닝 시간이 3.5분일 때 52 %의 경도향상을 나타냈다. 그리고 이때 전기화학적 특성은 쇼트피닝을 실시하지 않은 경우와 유사하였다

This study investigated the continuous cooling transformation, microstructure, and mechanical properties of highstrength low-alloy steels containing B and Cu. Continuous cooling transformation diagrams under non-deformed and deformed conditions were constructed by means of dilatometry, metallographic methods, and hardness data. Based on the continuous cooling transformation behaviors, six kinds of steel specimens with different B and Cu contents were fabricated by a thermomechanical control process comprising controlled rolling and accelerated cooling. Then, tensile and Charpy impact tests were conducted to examine the correlation of the microstructure with mechanical properties. Deformation in the austenite region promoted the formation of quasi-polygonal ferrite and granular bainite with a significant increase in transformation start temperatures. The mechanical test results indicate that the B-added steel specimens had higher strength and lower upper-shelf energy than the B-free steel specimens without deterioration in low-temperature toughness because their microstructures were mostly composed of lower bainite and lath martensite with a small amount of degenerate upper bainite. On the other hand, the increase of Cu content from 0.5 wt.% to 1.5 wt.% noticeably increased yield and tensile strengths by 100 MPa without loss of ductility, which may be attributed to the enhanced solid solution hardening and precipitation hardening resulting from veryfine Cu precipitates formed during accelerated cooling.

In this paper, we describe experiment results using a vibration assisted hybrid femtosecond laser (λ:795 nm) ultra- precision machining system. The hybrid system we have developed is possible that optical focal point of the femtosec- ond laser constantly and frequently within the range of PZT(piezoactuator) vibrator working distance. Using the hybrid system, We have experimented on brass and studied about differences of result of hole aspect ratio compare to general experiment setup of femtosecond laser system. Aspect ratio of a micro hole on brass is increased as 54% with 100 Hz vibration frequency and surface roughness of the side wall also improved compare to non-vibration.

This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and prop- erties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the α-Cu and Cu3Ga were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu- Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently, this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.

The influence of Cu and Ni on the ductile-brittle transition behavior of metastable austenitic Fe-18Cr-10Mn-N alloys with N contents below 0.5 wt.% was investigated in terms of austenite stability and microstructure. All the metastable austenitic Fe-18Cr-10Mn-N alloys exhibited a ductile-brittle transition behavior by unusual low-temperature brittle fracture, irrespective of Cu and/or Ni addition, and deformation-induced martensitic transformation occasionally occurred during Charpy impact testing at lower temperatures due to reduced austenite stability resulting from insufficient N content. The formation of deformation-induced martensite substantially increased the ductile-brittle transition temperature(DBTT) by deteriorating low-temperature toughness because the martensite was more brittle than the parent austenite phase beyond the energy absorbed during transformation, and its volume fraction was too small. On the other hand, the Cu addition to the metastable austenitic Fe-18Cr-10Mn-N alloy increased DBTT because the presence of δ-ferrite had a negative effect on low-temperature toughness. However, the combined addition of Cu and Ni to the metastable austenitic Fe-18Cr-10Mn-N alloy decreased DBTT, compared to the sole addtion of Ni or Cu. This could be explained by the fact that the combined addition of Cu and Ni largely enhanced austenite stability, and suppressed the formation of deformation-induced martensite and δ-ferrite in conjunction with the beneficial effect of Cu which may increase stacking fault energy, so that it allows cross-slip to occur and thus reduces the planarity of the deformation mechanism.

GdBa2Cu3O7-y(Gd123) powders were synthesized by the solid-state reaction method using Gd2O3 (99.9% purity), BaCO3 (99.75%) and CuO (99.9%) powders. The synthesized Gd123 powder and the Gd123 powder with Gd2O3 addition (Gd1.5Ba2Cu3O7-y(Gd1.5)) were used as raw powders for the fabrication of Gd123 bulk superconductors. The Gd123 and Gd1.5 bulk superconductors were fabricated by sintering or a top-seeded melt growth (TSMG) process. The superconducting transition temperature (Tc,onset) of the sintered Gd123 was 93 K and the transition width was as large as 20 K. The Tc,onset of the TSMG processed Gd123 was 82 K and the transition width was also as large as 12 K. The critical current density (Jc) at 77 K and 0 T of the sintered Gd123 and TSMG processed Gd123 were as low as a few hundreds A/cm2. The addition of 0.25 mole Gd2O3 and 1 wt.% CeO2 to Gd123 enhanced the Tc, Jc and magnetic flux density (H) of the TSMG processed Gd123 sample owing to the formation of the superconducting phase with high flux pinning capability. The Tc of the TSMG processed Gd1.5 was 92 K and the transition width was 1 K. The Jcs at 77 K (0 T and 2 T) were 3.2×104 A/cm2 and 2.5×104 A/cm2, respectively. The H at 77 K of the TSMG-processed Gd1.5 was 1.96 kG, which is 54% of the applied magnetic field (3.45 kG).

The effect of a sputter deposition sequence of Cu, Zn, and Sn metal layers on the properties of Cu2ZnSnS4 (CZTS) was systematically studied for solar cell applications. The set of Cu/Sn/Zn/Cu multi metal films was deposited on a Mo/SiO2/Si wafer using dc sputtering. CZTS films were prepared through a sulfurization process of the Cu/Sn/Zn/Cu metal layers at 500˚C in a H2S gas environment. H2S (0.1%) gas of 200 standard cubic centimeters per minute was supplied in the cold-wall sulfurization reactor. The metal film prepared by one-cycle deposition of Cu(360 nm)/Sn(400 nm)/Zn(400 nm)/Cu(440 nm) had a relatively rough surface due to a well-developed columnar structure growth. A dense and smooth metal surface was achieved for two- or three-cycle deposition of Cu/Sn/Zn/Cu, in which each metal layer thickness was decreased to 200 nm. Moreover, the three-cycle deposition sample showed the best CZTS kesterite structures after 5 hr sulfurization treatment. The two- and three-cycle Cu/Sn/Zn/Cu samples showed high-efficient photoluminescence (PL) spectra after a 3 hr sulfurization treatment, wheres the one-cycle sample yielded poor PL efficiency. The PL spectra of the three-cycle sample showed a broad peak in the range of 700-1000 nm, peaked at 870 nm (1.425 eV). This result is in good agreement with the reported bandgap energy of CZTS.

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous Al88Cu6Si6 eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous Al88Cu6Si6 eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The Al88Cu6Si6 eutectic alloy is composed of an α-Al dendrite phase and a single eutectic phase of Al2Cu and α-Al. We intended to remove only the α-Al phase and then the Al2Cu phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a H2SO4 solution. Only the α-Al phase was successfully leached while the morphology of the Al2Cu phase was maintained. The pore size was in a range of 1~5μm and the dealloying depth was nearly 3μm. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the Al2Cu phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as α-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the Al2Cu phase and sample statement.

(Y123) powders for the fabrication of bulk superconductors were synthesized by the powder reaction method using (99.9% purity), (99.75%) and CuO (99.9%) powders. The raw powders were weighed to the cation ratio of Y:Ba:Cu=1:2:3, mixed and calcined at in air with intermediate repeated crushing steps. It was found that the formation of Y123 powder was more sensitive to reaction temperature than reaction time. The calcined Y123 powder and a mixture of (Y123 + 0.25 mole + 1 wt.% , (Y1.5)) were used as raw powders for the fabrication of poly-grain or single grain superconductors. The superconducting transition temperature () of the sintered Y123 sample was 91 K and the transition width was as large as 11 K, whereas the of the melt-grown Y1.5 sample was 90.5 K and the transition width was 3.5 K. The critical current density () at 77 K and 0 T of the sintered Y123 was 700 , whereas the of the top-seeded melt growth (TSMG) processed Y1.5 sample was . The magnetic flux density (H) at 77 K of the TSMG-processed Y123 and Y1.5 sample showed the 0.53 kG and 2.45 kG, respectively, which are 15% and 71% of the applied magnetic field of 3.5 kG. The high H value of the TSMG-processed Y1.5 sample is attributed to the formation of the larger superconducting grain with fine Y211 dispersion.

The microstructure evolution during sintering of the W-5 wt.%Cu nanocomposite powders was investigated for the purpose of developing a high density W-Cu alloy. The W-5 wt.%Cu nanopowder compact, fully-densified during sintering at 1623 K, revealed a homogeneous microstructure that consists of high contiguity structures of W-W grains and an interconnected Cu phase located along the edges of the W grains. The Vickers hardness of the sintered W-5 wt.%Cu specimen was Hv much higher than that ( Hv) of the conventional heavy alloy. This result is mostly due to the higher contiguity microstructure of the W grains compared to the conventional W heavy alloy.

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of + 1/2 by placing powder bed of CuO or around the Cu/AlN bonding pair at . The adhesion strength was relatively better in case of using CuO powder than when powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of , Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and .

Cu2ZnSn(S,Se)4 material is receiving an increased amount of attention for solar cell applications as an absorber layer because it consists of inexpensive and abundant materials (Zn and Sn) instead of the expensive and rare materials (In and Ga) in Cu(In,Ga)Se2 solar cells. We were able to achieve a cell conversion efficiency to 4.7% by the selenization of a stacked metal precursor with the Cu/(Zn + Sn)/Mo/glass structure. However, the selenization of the metal precursor results in large voids at the absorber/Mo interface because metals diffuse out through the top CZTSe layer. To avoid the voids at the absorber/Mo interface, binary selenide compounds of ZnSe and SnSe2 were employed as a precursor instead of Zn and Sn metals. It was found that the precursor with Cu/SnSe2/ZnSe stack provided a uniform film with larger grains compared to that with Cu2Se/SnSe2/ZnSe stack. Also, voids were not observed at the Cu2ZnSnSe4/Mo interface. A severe loss of Sn was observed after a high-temperature annealing process, suggesting that selenization in this case should be performed in a closed system with a uniform temperature in a SnSe2 environment. However, in the experiments, Cu top-layer stack had more of an effect on reducing Sn loss compared to Cu2Se top-layer stack.