To improve coating ability and the life of the coating, Ti based composite materials with hydroxyapatite(HA) should be developed. The raw materials of Ti-26wt%, Nb-1wt%, and Si with 10wt% HA were mixed for 24 h by a mixing machine and milled for 1 h to 6 h by planetary mechanical ball milling. Ti-26%Nb-1%Si-(10%HA) composites, composed of nontoxic elements, were fabricated successfully by spark plasma sintering(SPS) at 1000˚C under 70MPa. The relative density of the sintered Ti-Nb-Si-HA composites using the 24 h mixed powder, and the 6 h milled powder, was 91% and 97 %, respectively. The effects of HA contents and milling time on microstructure and mechanical properties were investigated by SEM and hardness tester, respectively. The Vickers hardness of the composites increased with increasing milling time and higher HA content. The Young's modulus of the sintered Ti-26%Nb-1%Si-10%HA composite using the 6 h-milled powder was 55.6 GPa, as obtained by compression test. Corrosion resistance of the Ti-26wt%Nb-1wt%Si composite was increased by milling and by the addition of 10wt%HA. Wear resistance was improved with increasing milling time. Biocompatibility of the Ti-Nb-Si alloys was improved by the addition of HA.
We investigated the nanostructural, chemical and optical properties of nc-Si:H films according to deposition conditions. Plasma enhanced chemical vapor deposition(PECVD) techniques were used to produce nc-Si:H thin films. The hydrogen dilution ratio in the precursors, [SiH4/H2], was fixed at 0.03; the substrate temperature was varied from room temperature to 600˚C. By raising the substrates temperature up to 400˚C, the nanocrystalite size was increased from ~2 to ~7 nm and the Si crystal volume fraction was varied from ~9 to ~45% to reach their maximum values. In high-resolution transmission electron microscopy(HRTEM) images, Si nanocrystallites were observed and the crystallite size appeared to correspond to the crystal size values obtained by X-ray diffraction(XRD) and Raman Spectroscopy. The intensity of high-resolution electron energy loss spectroscopy(EELS) peaks at ~99.9 eV(Si L2,3 edge) was sensitively varied depending on the formation of Si nanocrystallites in the films. With increasing substrate temperatures, from room temperature to 600˚C, the optical band gap of the nc-Si:H films was decreased from 2.4 to 1.9 eV, and the relative fraction of Si-H bonds in the films was increased from 19.9 to 32.9%. The variation in the nanostructural as well as chemical features of the films with substrate temperature appears to be well related to the results of the differential scanning calorimeter measurements, in which heat-absorption started at a substrate temperature of 180˚C and the maximum peak was observed at ~370˚C.
Flexible polyurethane/clay porous nanocomposite foams were synthesized using natural and organically modified montmorillonite clays such as bentonite, closite 10A and closite 30B. The content of nanoclays was varied from 1 to 5 wt% of polyol. Dispersion of clay in Polyurethane(PU) matrix was investigated by X-ray diffraction(Cu-Kα rays of wavelength 1.54Å) using an X-ray diffractometer. Also, we determined that the thermal resistance of PU foam increased with added clay, compared to that of pure PU foam. The cell size and the fraction of open cells of the precursor foam were controlled by the addition of clay to the polyurethane foam. Modified clays were found to be more efficient cell openers than the unmodified clay. In addition, the tensile strength and elongation of the polyurethane/clay porous nanocomposites were examined. Increasing clay content increased the mechanical properties of the composites, such as tensile strength, and elongation at break. However, increasing the content over 5 wt% deteriorated the properties of the composites. We found that the nanofillers(bentonite, closite 10A and closite 30B) improved the thermal stability of the nanocomposite foam. The nanocomposite foam containing 3 wt% of closite 30B exhibited the best tensile strength and thermal stability.
In order to clarify the effect of C/Ti atom ratios(χ) on the deformation behavior of TiCχ at high temperature, singlecrystals having a wide range of χ, from 0.56 to 0.96, were deformed by compression test in a temperature range of 1183~2273Kand in a strain rate range of 1.9×10−4~5.9×10−3s−1. Before testing, TiCχ single crystals were grown by the FZ method ina He atmosphere of 0.3MPa. The concentrations of combined carbon were determined by chemical analysis and the latticeparameters by the X-ray powder diffraction technique. It was found that the high temperature deformation behavior observedis the χ-less dependent type, including the work softening phenomenon, the critical resolved shear stress, the transitiontemperature where the deformation mechanism changes, the stress exponent of strain rate and activation energy for deformation.The shape of stress-strain curves of TiC0.96, TiC0.85 and TiC0.56 is seen to be less dependent on χ, the work hardening rate afterthe softening is slightly higher in TiC0.96 than in TiC0.85 and TiC0.56. As χ decreases the work softening becomes less evidentand the transition temperature where the work softening disappears, shifts to a lower temperature. The τc decreasesmonotonously with decreasing χ in a range of χ from 0.86 to 0.96. The transition temperature where the deformationmechanism changes shifts to a lower temperature as χ decreases. The activation energy for deformation in the low temperatureregion also decreased monotonously as χ decreased. The deformation in this temperature region is thought to be governed bythe Peierls mechanism.
In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or H2 ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under H2 gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and H2. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % H2O2 was cooled down to -20˚C to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient H2 had low surface energy as the surface of the Si substrate reacted with H2. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.
The influence of Cu and Ni on the ductile-brittle transition behavior of metastable austenitic Fe-18Cr-10Mn-N alloys with N contents below 0.5 wt.% was investigated in terms of austenite stability and microstructure. All the metastable austenitic Fe-18Cr-10Mn-N alloys exhibited a ductile-brittle transition behavior by unusual low-temperature brittle fracture, irrespective of Cu and/or Ni addition, and deformation-induced martensitic transformation occasionally occurred during Charpy impact testing at lower temperatures due to reduced austenite stability resulting from insufficient N content. The formation of deformation-induced martensite substantially increased the ductile-brittle transition temperature(DBTT) by deteriorating low-temperature toughness because the martensite was more brittle than the parent austenite phase beyond the energy absorbed during transformation, and its volume fraction was too small. On the other hand, the Cu addition to the metastable austenitic Fe-18Cr-10Mn-N alloy increased DBTT because the presence of δ-ferrite had a negative effect on low-temperature toughness. However, the combined addition of Cu and Ni to the metastable austenitic Fe-18Cr-10Mn-N alloy decreased DBTT, compared to the sole addtion of Ni or Cu. This could be explained by the fact that the combined addition of Cu and Ni largely enhanced austenite stability, and suppressed the formation of deformation-induced martensite and δ-ferrite in conjunction with the beneficial effect of Cu which may increase stacking fault energy, so that it allows cross-slip to occur and thus reduces the planarity of the deformation mechanism.
A two-pass differential speed rolling(DSR) was applied to a deoxidized low-phosphorous copper alloy sheet in order to form a homogeneous microstructure. Copper alloy with a thickness of 3 mm was rolled to 75 % reduction by two-pass rolling at 150˚C without lubrication at a differential speed ratio of 2.0:1. In order to introduce uniform shear strain into the copper alloy sheet, the second rolling was performed after turning the sample by 180˚ on the transverse direction axis. Conventional rolling(CR), in which the rotating speeds of the upper roll and lower roll are identical to each other, was also performed by two-pass rolling under a total rolling reduction of 75 %, for comparison. The shear strain introduced by the conventional rolling showed positive values at positions of the upper roll side and negative values at positions of the lower roll side. However, samples processed by the DSR showed zero or positive values at all positions. 100//ND texture was primarily developed near the surface and center of thickness for the CR, while 110//ND texture was primarily developed for the DSR. The difference in misorientation distribution of grain boundary between the upper roll side surface and center regions was very small in the CR, while it was large in the DSR. The grain size was smallest in the upper roll side region for both the CR and the DSR. The hardness showed homogeneous distribution in the thickness direction in both CR and DSR. The average hardness was larger in CR than in DSR.
The purpose of this study is to investigate the coloration characteristics by identifying the factor affecting redcoloration of copper red glaze in traditional Korean ceramics. This study analyzed the characteristics of the reduction-firedcopper red glaze by using XRD, Raman spectroscopy, EDX and UV-vis spectroscopy. As a result of XRD analysis, the glazecompletely melted and amorphous glass appeared overall, and the characteristic peak of metal Cu was shown together. Inaddition, as a result of Raman analysis, the characteristic bands of CuO and Cu2O were shown together. The distribution ofcomponent elements was observed by EDX. As a result, copper(Cu) were distributed throughout the glaze. Thus, it was shownthat copper red glaze appeared the best red coloration because metal Cu, CuO and Cu2O evenly existed throughout glaze inparticle colloidal state. The chroma value of the copper red glaze was CIE L* 30.07, a* 13.65, b* 3.72. Wine-Red Solutionwas shown by Dark Graish Red coloration.