MnO2 can be potentially utilized as an electrode material for redox capacitors. The deposition of MnO2 with poor electrical conductivity onto porous carbons supplies them with additional conductive paths; as a result, the capacitance of the electrical double layer formed on the porous carbon surface can be utilized together with the redox capacitance of MnO2. However, the obtained composites are not generally suitable for industrial production because they require the use of expensive porous carbons and/or inefficient fabrication methods. Thus, to develop an effective preparation procedure of the composite, a suitable structure of porous carbons must be determined. In this study, MnO2/C composites have been prepared from activated carbon gels with various pore sizes, and their electrical properties are investigated via cyclic voltammetry. In particular, mesoporous carbons with a pore size of around 20 nm form a composite with a relatively low capacitance (98 F/g-composite) and poor rate performance despite the moderate redox capacitance obtained for MnO2 (313 F/g-MnO2). On the other hand, using macro-porous carbons with a pore size of around 60 nm increases the MnO2 redox capacitance (399 F/g-MnO2) as well as the capacitance and rate performance of the entire material (203 F/g-composite). The obtained results can be used in the industrial manufacturing of MnO2/C composites for supercapacitor electrodes from the commercially available porous carbons.
In the fabrication of joined materials between anodized aluminum alloy and polymer, the performance of the metalpolymer joining is greatly influenced by the chemical properties of the oxide film. In a previous study, the dependence of physical joining strength on the thickness, structure, pore formation, and surface roughness of films formed on aluminum alloys is investigated. In this study, we investigated the effect of silane coupling treatment on the joining strength and sealing performance between aluminum alloy and polymer. After a two-step anodization process with additional treatment by silane, the oxide film with chemically modified nanostructure is strongly bonded to the polymer through physical and chemical reactions. More specifically, after the two-step anodization with silane treatment, the oxide film has a three-dimensional (3D) nanostructure and the silane components are present in combination with hydroxyl groups up to a depth of 150 nm. Accordingly, the joining strength between the polymer and aluminum alloy increases from 29 to 35 MPa, and the helium leak performance increases from 10−2-10−4 to 10−8-10−9 Pa m3 s−1.
Electrochromic devices (ECDs) have been drawing great attention due to their high color contrast, low power consumption, and memory effect, and can be used in smart windows, automatic dimming mirrors, and information display devices. As with other electronic devices such as LEDs (light emitting diodes), solar cells, and transistors, the mechanical flexibility of ECDs is one of the most important issue for their potential applications. In this paper, we report on flexible ECDs (f-ECDs) fabricated using an all-in-one EC gel, which is a mixture of electrolyte and EC material. The f-ECDs are compared with rigid ECDs (r-ECDs) on ITO glass substrate in terms of color contrast, coloration efficiency, and switching speed. It is confirmed that the f-ECDs embedding all-in-one gel show strong blue absorption and have competitive EC performance. Repetitive bending tests show a degradation of electrochromic performance, which must be improved using an optimized device fabrication process.
In this study, three kinds of bainitic steels are fabricated by controlling the contents of vanadium and boron. High vanadium steel has a lot of carbides and nitrides, and so, during the cooling process, acicular ferrite is well formed. Carbides and nitrides develop fine grains by inhibiting grain growth. As a result, the low temperature Charpy absorbed energy of high vanadium steel is higher than that of low vanadium steel. In boron added steel, boron segregates at the prior austenite grain boundary, so that acicular ferrite formation occurs well during the cooling process. However, the granular bainite packet size of the boron added steel is larger than that of high vanadium steel because boron cannot effectively suppress grain growth. Therefore, the low temperature Charpy absorbed energy of the boron added steel is lower than that of the low vanadium steel. HAZ (heat affected zone) microstructure formation affects not only vanadium and boron but also the prior austenite grain size. In the HAZ specimen having large prior austenite grain size, acicular ferrite is formed inside the austenite, and granular bainite, bainitic ferrite, and martensite are also formed in a complex, resulting in a mixed acicular ferrite region with a high volume fraction. On the other hand, in the HAZ specimen having small prior austenite grain size, the volume fraction of the mixed acicular ferrite region is low because granular bainite and bainitic ferrite are coarse due to the large number of prior austenite grain boundaries.
Zinc oxide (ZnO) based transparent conducting oxides (TCO) thin films, are used in many applications such as solar cells, flat panel displays, and LEDs due to their wide bandgap nature and excellent electrical properties. In the present work, fluorine and aluminium-doped ZnO targets are prepared and thin films are deposited on soda-lime glass substrate using a RF magnetron sputtering unit. The aluminium concentration is fixed at 2 wt%, and the fluorine concentration is adjusted between 0 to 2.0 wt% with five different concentrations, namely, Al2ZnO98(AZO), F0.5AZO97.5(FAZO1), F1AZO97(FAZO2), F1.5AZO96.5(FAZO3), and F2AZO96(FAZO4). Thin films are deposited with an RF power of 40 W and working pressure of 5 m Torr at 270 oC. The morphological analysis performed for the thin film reveals that surface roughness decreases in FAZO1 and FAZO2 samples when doped with a small amount of fluorine. Further, optical and electrical properties measured for FAZO1 sample show average optical transmissions of over 89 % in the visible region and 82.5 % in the infrared region, followed by low resistivity and sheet resistance of 3.59 × 10−4 Ωcm and 5.52 Ω/sq, respectively. In future, these thin films with excellent optoelectronic properties can be used for thin-film solar cell and other optoelectronics applications.
Cr-Si based alloys are not only excellent in corrosion resistance at high temperatures, but also have good wear resistance due to the formation of Cr3Si phase, therefore they are promising as metallic coating materials. Aluminum is often added to Cr-Si alloys to improve the oxidation resistance through which stable alumina surface film is formed. On the other hand, due to the addition of aluminum, various Al-containing phases may be formed and may negatively affect the heat resistance of the Cr-Si-Al alloys, so detailed investigation is required. In this study, two Cr-Si-Al alloys (high-Si & high-Al) were prepared in the form of cast ingots through a vacuum arc melting process and the microstructural changes after high temperature heating process were investigated. In the case of the cast high-Si alloy, a considerable amount of Cr3Si phase was formed, and its hardness was significantly higher than that of the cast high-Al alloy. Also, Al-rich phases (with the high Al/ Cr ratio) were not found much compared to the high-Al alloy. Meanwhile, it was observed that the amount of the Al-rich phases reduced by the annealing heat treatment for both alloys. In the case of the high temperature heating at 1,400 oC, no significant microstructural change was observed in the high Si alloy, but a little more coarse and segregated AlCr phases were found in the high Al alloy compared to the cast state.
Dry etching of copper thin films is performed using high density plasma of ethylenediamine (EDA)/ hexafluoroisopropanol (HFIP)/Ar gas mixture. The etch rates, etch selectivities and etch profiles of the copper thin films are improved by adding HFIP to EDA/Ar gas. As the EDA/HFIP concentration in EDA/HFIP/Ar increases, the etch rate of copper thin films decreases, whereas the etch profile is improved. In the EDA/HFIP/Ar gas mixture, the optimal ratio of EDA to HFIP is investigated. In addition, the etch parameters including ICP source power, dc-bias voltage, process pressure are varied to examine the etch characteristics. Optical emission spectroscopy results show that among all species, [CH], [CN] and [H] are the main species in the EDA/HFIP/Ar plasma. The X-ray photoelectron spectroscopy results indicate the formation of CuCN compound and C-N-H-containing polymers during the etching process, leading to a good etch profile. Finally, anisotropic etch profiles of the copper thin films patterned with 150 nm scale are obtained in EDA/HFIP/Ar gas mixture.
In this study, using the plasma spray method, tensile and compression fatigue tests are performed in saline solution to examine the effect of Ti undercoat on corrosion fatigue behavior of alumina-coated specimens. The alumina-coated material using Ti in the undercoat shows better corrosion fatigue strength than the base material in the entire stress amplitude range. Fatigue cracking of UT specimens occurs in the recess formed by grit-blasting treatment and progresses toward the base metal. Subsequently, the undercoat is destroyed at a stage where the deformation of the undercoat cannot follow the crack opening displacement. The residual stress of the UT specimen has a tensile residual stress up to about 100 μm below the surface of the base material; however, when the depth exceeds 100 μm, the residual stress becomes a compressive residual stress. In addition, the inside of the spray coating film is compressive residual stress, which contributes to improving the fatigue strength characteristics. A hardened layer due to grit-blasting treatment is formed near the surface of the UT specimen, contributing to the improvement of the fatigue strength characteristics. Since the natural potential of Ti spray coating film is slightly higher than that of the base material, it exhibits excellent corrosion resistance; however, when physiological saline intrudes, a galvanic battery is formed and the base material corrodes preferentially.