이순신대교 포장을 시작으로 본격적으로 상용화된 에폭시 아스팔트는 현재 국내에 정확한 규정이 마련 되어 있지 않아 입도 및 최적아스팔트첨가량, 에폭시와 경화제의 첨가량 선정에 어려움을 겪고 있다. 일 본의 경우,에폭시 아스팔트를 위한 별도 규정이 마련되어있어 설계 및 제작주문 뿐 아니라 시공시 매우 유용하게 쓰이고 있다. 일본 에폭시 아스팔트 규정을 살펴보면, 표층용 국내 개질아스팔트 규정과는 달리 10mm의 밀입도 골재가 사용되지 않는다. 따라서 본 연구에서는 입도 차이가 에폭시 아스팔트에 주는 영 향을 파악하기 위하여 국내 표층용 WC-1 입도와 일본규정의 입도를 사용하여 공시체를 혼합 및 제작하 고, 이를 실내시험을 통해 물성치를 파악, 실제 일본에서 제작한 에폭시 아스팔트 공시체와 성능을 비교 하였다. 또한, 한국형 에폭시 아스팔트 규정 마련을 위하여 에폭시와 경화제 모두 국내제품을 사용하였으 며, 고형 에폭시에 백색과 흑색의 액상형 경화제 2종류를 준비하여 본 연구에 사용하였다. 본 연구에 사 용된 입도는 그림 1.과 같다. 시험에 사용된 아스팔트 바인더는 PG 64-22 등급의 제품이며, 150℃에서 2시간 보온을 통해 양면 75회 마샬다짐을 실시하여 혼합물을 제작, 실내연평균온도인 25℃와 실내연평균 습도인 60%에서 24시간 양생을 실시

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

It was researched to be alternative of TGIC type hardener with human hazard element as PT 910 mix powder paint with hardener. Generally PT 910 was compared with TGIC & Epoxy resin of hardener to be used at thermosetting powder paint. We inquired a property of matter for paint through Gel time, glass transition temperature, melting point and a property of matter for film through a property of adhesion, a property of tolerance, softness, gloss, acid-resistant, alkali-resistant, salt water spray-resistant, facilitation climatic. When PT 910 is used of hardener, it was shown the excellent results in gel time, softness, salt water spray-resistant, fracilitation climatic and the similar results in melting point, a property of tolerance, a property of adhesion, gloss, acid-resistant, alkali-resistant, as compared with the powder paint used by TGIC hardener. The glass transition temperature was little low. But there was slightly different results. After the study results, we reached the conclusion that thermosetting powder used by PT 910 is alterative to by TGIC hardener.

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

We investigated heat stability of epoxy resin products and epoxy resin according to the influence hardener. The heat flow which shows the degree of thermal decomposition of the epoxy resin product and epoxy resin measured by using the differential scanning calorimeter (DSC). As a result, we found that in the case of heat stability for epoxy resin as hardener was added, the ratio of one to one (epoxy resin : hardener) was the most suitable in air condition and nitrogen atmosphere.

PU type flame-retardant coatings (TBAO/L-75, TBAOL ; TBAO/N-100, TBAON) were prepared by blending bromine-containing modified polyester (TBAO) which was synthesized in our earlier work. with two kinds of isocyanate curing agents, Desmodur L-75 and Desmodur N-100. Physical properties of the prepared flame-retardant coatings were tested. TBAOL shows better hardness than TBAON, while TBAON shows better viscosity, accelerated weathering resistance, yellowness index and lightness index difference than TBAOL. There were no remarkable differences in fineness of grind, 60˚ specular gloss, cross-hatch adhesion, and abrasion resistance of TBAOL and TBAON. There was no discernable difference in flame-retardancy between the two flame-retardant coatings, TBAOL and TBAON. When the content of tribromo acetic acid, which is flame-retarding component, was 30wt% the LOI value was in a range of 29~30%, which indicates that the two coatings are good flame-retardant coatings.

본 연구는 고성능 폴리머 시멘트계 프리캐스트 제품의 개발 및 미세균열 발생 시 자기치유기능을 확보할 목적으로 경화제 무첨가 EMM의 물리적 성질을 검토하고, 그 물성에 영향을 끼치는 시멘트 매트릭스 내의 에폭시수지 경화도와 현미경을 통한 조직구조의 관찰과 함께 자기치유효과를 검토하였다. 그 결과, 경화제 무첨가 EMM의 폴리머 혼입에 의한 강도 개선 효과는 인장강도, 휨강도, 압축강도의 순으로 나타났다. 접착성은 콘크리트 피착체의 모세관 공극에 폴리머 필름의 형성에 기인한 투묘효과에 기인하여 크게 향상되었다. 투수저항성은 폴리머 결합재비 20% 및 고로슬래그 미분말 치환율 30%를 병용한 EMM에서 보통시멘트 모르타르 대비 97%의 감소율을 나타내 매우 우수하였 다. 고로슬래그미분말, 팽창재 및 황산나트륨을 병용한 EMM의 균열 폭은 고로슬래그 치환율이 증가함에 따라 미미하게 감소하였으나, 고로 슬래그미분말 치환율 20%에서 수중침지기간의 증가와 함께 서서히 균열부 자기폐색 효과를 관찰할 수 있었다.

This study was conducted to improve the economy, quality, and load of Soil paving concrete by using waste materials such as Oystery and Dolomitic to solve strength reduction and durability reduction caused by hardening agents in Korea. According to the results of the study, for the curing expenses, the Fine part agreement (FC) and the Furnace slag power lower (BS) are 5:5, It was possible to verify that the best results were obtained in terms of the quality of cement mortar when the natural organic lime and dolomitic lime were mixed at a ratio of 5:5.