The recirculating electrochemical flow reactor developed at UCLA has been employed to fabricate nanostructured GMR multilayers. For comparison, Ni/Cu multilayers have been electrodeposited from a single bath, from dual baths and from the recirculating electrochemical flow reactor. For a magnetic field of 1.5 kOe, higher GMR (Max. -5%) Ni/Cu multilayers with low electrical resistivity (< 10 μΩ·cm) were achieved by the electrochemical flow reactor system than by the dual bath (Max. GMR = -4.2% and< 20 μΩ·cm) or the single bath (Max. GMR = -2.1% and< 90 μΩ·cm) techniques. Higher GMR effects have been obtained by producing smoother, contiguous layers at lower current densities and by the elimination of oxide film formation by conducting deposition under an inert gas environment. Our preliminary GMR measurements of Ni/Cu multilayers from the electrochemical flow reactor obtained at low magnetic field of 0.15 T, which may approach or exceed the highest reported results (-7% GMR) at magnetic fields > 5 kOe.

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at 70˚C with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm Mg3P2 precipitation phase was observed having lattice parameter a:12.01Å such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.

This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a Cr3Si precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

The electrocatalytic characteristics of oxygen reduction reaction of the PtxM(1-x) (M = Co, Cu, Ni) supported on multi-walled carbon nanotubes (MWNTs) have been evaluated in a Polymer Electrolyte Membrane Fuel Cell (PEMFC). The PtxM(1-x)/MWNTs catalysts with a Pt : M atomic ratio of about 3 : 1 were synthesized and applied to the cathode of PEMFC. The crystalline structure and morphology images of the PtxM(1-x) particles were characterized by X-ray diffraction and transmission electron microscopy, respectively. The results showed that the crystalline structure of the Pt alloy particles in Pt/MWNTs and PtxM(1-x)/MWNTs catalysts are seen as FCC, and synthesized PtxM(1-x) crystals have lattice parameters smaller than the pure Pt crystal. According to the electrochemical surface area (ESA) calculated with cyclic voltammetry analysis, Pt0.77Co0.23/MWNTs catalyst has higher ESA than the other catalysts. The evaluation of a unit cell test using Pt/MWNTs or PtxM(1-x)/MWNTs as the cathode catalysts demonstrated higher cell performance than did a commercial Pt/C catalyst. Among the MWNTs-supported Pt and PtxM(1-x) (M = Co, Cu, Ni) catalysts, the Pt0.77Co0.23/MWNTs shows the highest performance with the cathode catalyst of PEMFC because they had the largest ESA.

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

The amorphization process and the thermal properties of amorphous TiCuNiAl powder during milling by mechanical alloying were examined by X-ray diffractometry (XRD), differential scanning calorimetry (DSC), and transmission electron microscopy (TEM). The chemical composition of the samples was examined by an energy dispersive X-ray spectrometry (EDX) facility attached to the scanning electron microscope (SEM). The as-milled powders showed a broad peak (2 = 42.4) with crystalline size of about 5.0 nm in the XRD patterns. The entire milling process could be divided into three different stages: agglomeration (0 < t 3 h), disintegration (3 h < t 20 h), and homogenization (20 h < t 40 h) (t: milling time). In the DSC experiment, the peak temperature T and crystallization temperature T were 466.9 and 444.3, respectively, and the values of T, and T increased with a heating rate (HR). The activation energies of crystallization for the as-milled powder was 291.5 kJ/mol for T.

TiCuNiAl quaternary amorphous alloy was prepared by high-energy ball milling process. A complete amorphization was confirmed for the composition of TiCuNiAl after milling for 30hrs. Differential scanning calorimetry showed a large super-cooled liquid region (T = T T, T and T: glass transition and crystallization onset temperatures, respectively) of 80 K. Prepared amorphous powders of TiCuNiAl were consolidated by spark-plasma sintering. Densification behavior and microstructure changes were investigated. Samples sintered at higher temperature of 713 K had a nearly full density. With increasing the sintering temperature, the compressive strength increased to fracture strength of 756 MPa in the case of sintering at 733 K, which showed a 'transparticle' fracture. The samples sintered at above 693 K showed the elongation maximum above 2%.

Fe based (FeCSiBPCrMoAl) amorphous powder, which is a composition of iron blast cast slag, were produced by a gas atomization process, and sequently mixed with ductile Cu powder by a mechanical ball milling process. The Fe-based amorphous powders and the Fe-Cu composite powders were compacted by a spark plasma sintering (SPS) process. Densification of the Fe amorphous-Cu composited powders by spark plasma sintering of was occurred through a plastic deformation of the each amorphous powder and Cu phase. The SPS samples milled by AGO-2 under 500 rpm had the best homogeneity of Cu phase and showed the smallest Cu pool size. Micro-Vickers hardness of the as-SPSed specimens was changed with the milling processes.

Fe based (FeCSiBPCrMoAl) amorphous powder, which is a composition of iron blast cast slag, were produced by a gas atomization process, and sequently mixed with ductile Cu powder by a mechanical ball milling process. The experiment results show that the as-prepared Fe amorphous powders less than 90 m in size has a fully amorphous phase and its weight fraction was about 73.7%. The as-atomized amorphous Fe powders had a complete spherical shape with very clean surface. Differential scanning calorimetric results of the as-atomized Fe powders less than 90 m showed that the glass transition, T, onset crystallization, T, and super-cooled liquid range T=T-T were 512, 548 and 36, respectively. Fe amorphous powders were mixed and deformed well with 10 wt.% Cu by using AGO-2 high energy ball mill under 500 rpm.

In high-efficiency Cu(In,Ga)Se2 solar cells, Na is doped into a Cu(In,Ga)Se2 light-absorbing layer from sodalime-glass substrate through Mo back-contact layer, resulting in an increase of device performance. However, this supply of sodium is limited when the process temperature is too low or when a substrate does not supply Na. This limitation can be overcome by supplying Na through external doping. For Na doping, an NaF interlayer was deposited on Mo/glass substrate. A Cu(In,Ga)Se2 absorber layer was deposited on the NaF interlayer by a three-stage co-evaporation process As the thickness of NaF interlayer increased, smaller grain sizes were obtained. The resistivity of the NaF-doped CIGS film was of the order of 103Ω·cm indicating that doping was not very effective. However, highest conversion efficiency of 14.2% was obtained when the NaF thickness was 25 nm, suggesting that Na doping using an NaF interlayer is one of the possible methods for external doping.

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

The electromagnetic wave absorption sheets were fabricated by mixing of nanocrystalline soft magnetic powder, charcoal powder and polymer based binder. The complex permittivity, complex permeability, and scattering parameter have been measured using a network analyzer in the frequency range of 10 MHz10 GHz. The results showed that complex permittivity of sheets was largely dependent on the frequency and the amount of charcoal powder : The permittivity was improved up to 100 MHz, however the value was decreased above 1 GHz. The power loss of electromagnetic wave absorption data showed almost the same tendency as the results of complex permittivity. However, the complex permeability was not largely affected by the frequency, and the values were decreased with the addition of charcoal powder. Based on the results, it can be summarized that the addition of charcoal powder was very effective to improve the EM wave absorption in the frequency range of 10 MHz1 GHz.

The pressureless sintering behavior of /Cu powder mixtures, prepared from /CuO and /Cu-nitrate, has been investigated. Microstructural observation revealed that powders with nano-sized Cu particles could be synthesized by hydrogen reduction method. The specimens, pressureless-sintered at for 4 min using infrared heating furnace with the heating rate of /min, showed the relative density of above 90%. Maximum hardness of 16.1 GPa was obtained in /MgO/Cu nanocomposites. The nanocomposites exhibited the enhanced fracture toughness of 4.3-5.7 , compared with monolithic . The mechanical properties were discussed in terms of microstructural characteristics

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between and for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

Carbon-coated Cu nanopowders with core/shell structure have been successfully fabricated by pulsed wire evaporation (PWE) method, in which a mixed gas of Ar/ (10 vol.%) was used as an ambient gas. The characterization of the samples was carried out using x-ray diffraction (XRD), scanning electron microscope (SEM), and high resolution transmission electron microscope (HRTEM). It was found that the nanoparticles show a spherical morphology with the size ranging of 10-40 nm and are covered with graphite layers of 2-4 nm. When oxygen-passivated Cu nanopowders were annealed under flowing argon gas (600 and 800), the crystallinity of phase and the particle size gradually increased. On the other hand, carbon-coated Cu nanopowders remained similar to as-prepared case with no additional oxide or carbide phases even after the annealing, indicating that the metal nanoparticles are well protected by the carbon-coating layers.

Crushed, depitted peach stones were impregnated activated with 50% H3PO4 followed by pyrolysis at 500℃. Two activated carbons were produced, one under its own evolved gases during pyrolysis, and the second conducted with air flow throughout the carbonization stage. Physicochemical properties were investigated by several procedures; carbon yield, ash content, elemental chemical analysis, TG/DTG and FTIR spectra. Porosity characteristics were determined by the conventional N2 adsorption at 77 K, and data analyzed to get the major texture parameters of surface area and pore volume. Highly developed activated carbons were obtained, essentially microporous, with slight effect of air on the porous structure. Oxygen was observed to be markedly incorporated in the carbon matrix during the air treatment process. Cation exchange capacity towards Cu (II) and Cd (II) was tested in batch single ion experimental mode, which proved to be slow and a function of carbon dose, time and initial ion concentration. Copper was up taken more favorably than cadmium, under same conditions, and adsorption of both cations was remarkably enhanced as a consequence of the air treatment procedure. Sequestration of the metal ions was explained on basis of the combined effect of the oxygen functional groups and the phosphorous-containing compounds; both contributing to the total surface acidity character.

[ Cf/C-Cu ]composites were fabricated by infiltrating molten Cu into different Cf/C preforms prepared by chemical vapor infiltration, resin impregnation and carbonization. The microstructure and properties of the composites were investigated. The results show that Cu in the composites filled the pores and showed network-like distribution. Compared with homemade J204 brush material and certain grade pantograph slider from abroad, the composites have higher flexural strength and better electrical conductivity. The friction and wear properties of the composites are better than that of J204, and closed to that of the abroad material.

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of CuSO4, H2SO4 and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

The effects of post-CMP cleaning on the chemical and galvanic corrosion of copper (Cu) and titanium(Ti) were studied in patterned silicon (Si) wafers. First, variation of the corrosion rate was investigated as afunction of the concentration of citric acid that was included in both the CMP slurry and the post-CMP solution.The open circuit potential (OCP) of Cu decreased as the citric acid concentration increased. In contrast withCu, the OCP of titanium (Ti) increased as this concentration increased. The gap in the OCP between Cu andTi increased as citric acid concentration increased, which increased the galvanic corrosion rate between Cu andTi. The corrosion rates of Cu showed a linear relationship with the concentrations of citric acid. Second, theeffect of Triton X-100®, a nonionic surfactant, in a post-CMP solution on the electrochemical characteristics ofthe specimens was also investigated. The OCP of Cu decreased as the surfactant concentration increased. Incontrast with Cu, the OCP of Ti increased greatly as this concentration increased. Given that Triton X-100®changes its micelle structure according to its concentration in the solution, the corrosion rate of eachconcentration was tested.