The ecosystem provides a diverse array of environmental conditions for organisms, and only those that are capable of successfully adapting to these conditions within their habitats can endure, thrive, and proliferate. Further, the environmental conditions within these habitats can significantly affect the bioavailability of chemicals that are introduced therein, thus resulting in varied adverse impacts on the organisms. The present study aims to evaluate the sensitivity of Yuukianura szeptyckii - a species adapted to riparian - to heavy metals following ISO guideline 11276, with the objective of assessing its potential as an indicator species for ecotoxicological evaluations in riparian habitats. The findings revealed that cadmium and copper both had significant toxic effects depending on their concentrations. For cadmium, the LC50 was 280 mg kg-1, EC50 was 66 mg kg-1, and NOEC and LOEC were 25 and 50 mg kg-1, respectively. For copper, the LC50 was 911 mg kg-1, EC50 was 151 mg kg-1, and LOEC was 50 mg kg-1. Comparative analysis with previous results for the international standard species Folsomia candida and the domestic standard species Allonychiurus kimi indicated that Y. szeptyckii exhibited even greater sensitivity to toxicity values. The adverse effects on survival and reproduction were closely associated with the influx concentration of heavy metals in their bodies. Altogether, the results suggest that Y. szeptyckii is a sensitive species for ecotoxicological assessments in riparian habitats, thus making it suitable as an indicator species, particularly in riparian ecosystems that are characterized by relatively high humidity conditions.

This research studied the electrical characteristics, IR transmission characteristics, stealth functions, and thermal characteristics of infrared thermal-imaging cameras of copper-sputtered samples. Nylon samples were prepared for each density as a base material for copper-sputtering treatment. Copper-sputtered NFi, NM1, NM2, NM3, NM4, and NM5, showed electrical resistance of 0.8, 445.7, 80.7, 29.7, 0.3, and 2.2 Ω, respectively, all of which are very low values; for the mesh sample, the lower the density, the lower the electrical resistance. Measuring the IR transmittance showed that the infrared transmittance of the copper-sputtered samples was significantly reduced compared to the untreated sample. Compared to the untreated samples, the transmittance went from 92.0–64.1%. When copper sputtered surface was directed to the IR irradiator, the IR transmittance went from 73.5 to 43.8%. As the density of the sample increased, the transmittance tended to decreased. After the infrared thermal imaging, the absolute values of △R, △G, and △B of the copper phase increased from 2 to 167, 98 to 192, and 7 to 118, respectively, and the closer the density of the sample (NM5→NFi), the larger the absolute value. This proves that the dense copper phase-up sample has a stealth effect on the infrared thermal imaging camera. It is believed that the copper-sputtered nylon samples produced in this study have applications in multifunctional uniforms, bio-signal detection sensors, stage costumes, etc.

본 연구는 전기투석과 용매추출을 융합한 희유금속 회수 공정에서 분리막과 음이온교환막의 개질을 통해 유기상 과 수상에 대한 분리막의 낮은 젖음성 및 AEM을 통한 수소이온 투과로 인한 금속이온의 회수 효율 감소를 개선하였다. 구체 적으로, 분리막 표면 중 한면은 polydopamine (PDA) 통한 친수성 개질, 다른 면은 SiO2 또는 graphene oxide를 통한 친유성 개질을 함으로써 분리막의 젖음성을 개선하였다. 또한, 음이온교환막의 표면을 polyethyleneimine, PDA, poly(vinylidene fluoride) 등을 이용, 개질해 수분 흡수(Water uptake) 감소 및 기공구조 변화를 통해 수소이온 수송을 억제해 수소이온 투과를 억 제할 수 있다. 개질된 막 표면 형상과 화학적 특성 및 조성은 주사전자현미경과 푸리에변환 적외선 분광법을 통해 확인되었 고, 이를 구리 이온 회수 시스템에 적용해 향상된 추출 및 탈거 효율과 수소이온 수송 억제능을 확인하였다.

본 연구는 구리화합물계 목재방부제로 가압방부처리된 난주입수종이 국내 지상부 목재사용환경에서 방부성능을 유지할 수 있는 조건을 파악하기 위하여 수행되었다. 장기간(12년)의 지상부 야외노출시험을 통하여 방부성능이 입증된 방부처리 목재를 대상으로 목재 내부에 존재하는 주요 방부성 분인 구리의 분포 상태를 조사하였다. 구리 정색반응 결과를 살펴보면 변재는 대부분 균일하게 처리되었지만, 심재에서 구리의 침투는 목재 표면에 국한되어 있는 것으로 나타났다. 심재에서 구리의 침투는 국내 방부목 표준규격에서 요구하는 심재의 최소 침윤깊이(8 mm)를 만족하지 못하였다. 그러나 기준을 만족하지 못한 방부처리 시편들도 우수한 방부효능을 가지고 있다는 것을 알 수 있는데 이러한 결과는 난주입수종의 적절한 활용을 위해 국내 규격의 보완이 필요하다는 것을 의미한다.

범밀도이론함수(Density Functional Theory, DFT) 기반의 제일원리전산모사는 기저상태의 DFT 에너지를 구하는데 많은 시간소요 및 전산자원을 소모하였다. 이러한 막대한 전산자원의 소모는 DFT 계산에서 고려할 원자수를 수 백개 이 하로 제한되게 되었으며, 이를 해결하기 위해서는 전자구조 계산이 아닌 원자의 환경 내에 원자간 상호작용을 정의 (Force Field, 힘장)하고 이를 통해 주어진 조성 혹은 구조에 따른 에너지를 빠르게 예측 할 수 있어야 한다. 본 논문에서 는 Behler-Parrinello가 제시한 인공신경망 모델을 활용해 인공지능 다원계 힘장을 개발하고 코발트-구리 산화물의 조성에 따른 에너지를 예측하고 안정한 구조를 탐색하는 연구를 수행하였다. 인공신경망 기술로 부터 구리-코발트 산화물에 대 해 15.7 meV/atom의 에너지 오차와 단위거리당 힘 103.6 meV/Å의 정확도를 가지는 인공신경망 포텐셜을 개발하였다. 이 방법으로 빠르고 정확하게 CuCoO 표면구조의 산소 결함률에 따른 생성에너지를 계산할 수 있었고, 에너지 컨벡스 홀을 도시 조성에 따른 안정한 구조를 예측하였다.

The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

Dry etching of copper thin films is performed using high density plasma of ethylenediamine (EDA)/ hexafluoroisopropanol (HFIP)/Ar gas mixture. The etch rates, etch selectivities and etch profiles of the copper thin films are improved by adding HFIP to EDA/Ar gas. As the EDA/HFIP concentration in EDA/HFIP/Ar increases, the etch rate of copper thin films decreases, whereas the etch profile is improved. In the EDA/HFIP/Ar gas mixture, the optimal ratio of EDA to HFIP is investigated. In addition, the etch parameters including ICP source power, dc-bias voltage, process pressure are varied to examine the etch characteristics. Optical emission spectroscopy results show that among all species, [CH], [CN] and [H] are the main species in the EDA/HFIP/Ar plasma. The X-ray photoelectron spectroscopy results indicate the formation of CuCN compound and C-N-H-containing polymers during the etching process, leading to a good etch profile. Finally, anisotropic etch profiles of the copper thin films patterned with 150 nm scale are obtained in EDA/HFIP/Ar gas mixture.

2 (Langmuir, Freundlich, Elovich, Temkin, and Dubinin-Radushkevich) and 3 (Sips and Redlich-Peterson)-parameter isotherm models were applied to evaluated for the applicability of adsorption of Cu(II) and/or phosphate isotherm using chitosan bead. Non-linear and linear isotherm adsorption were also compared on each parameter with coefficient of determination (R2). Among 2-parameter isotherms, non-linear Langmuir and Freundlich isotherm showed relatively higher R2 and appropriate maximum uptake (qm) than other isotherm equation although linear Dubinin-Radushkevich obtained highest R2. 3-parameter isotherm model demonstrated more reasonable and accuracy results than 2-parmeter isotherm in both non-linear and linear due to the addition of one parameter. The linearization for all of isotherm equation did not increase the applicability of adsorption models when error experiment data was included.

본 연구에서는 건조 고춧가루의 가공 및 저장라인에서 구리의 이용가능성을 조사하였다. 구리와 스테인리스강 표면과의 접촉을 통한 고춧가루의 색도 변화를 평가한 결과, 55oC에서 2시간 구리 판에 처리한 시료의 명도가 다소 증가하였다. 구리와 스테인리스강 접촉에 의한 고춧가루 내 미생물 저해는 중온성의 호기성 세균보다 곰팡이 및 효모의 저해에 더 효과적이었고, 55oC에서 2시간 구리 접촉에 의해 곰팡이와 효모의 수는 0.64 log 감소하여 유의적인 효과를 나타내었다. 산화방지 활성은 구리와 스테인리스 강 접촉 고춧가루의 DPPH 라디칼 소거활성은 감소한 반면 ABTS 라디칼 소거활성은 증가하였다. 본 연구는 구리 또는 구리와 스테인리스강 등의 합금을 이용하여 고춧가 루를 포함한 다양한 분말 식품의 가공 및 저장 과정에 활용할 수 있는 가능성을 제시하고 있다.

The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 μm. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m−1K−1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10−6 to 3.06 × 10−6 K−1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

The effect of intercritical annealing temperature on the microstructure and mechanical properties of Fe-9Mn-0.2C- 3Al-0.5Si medium manganese steels containing Cu and Ni is investigated in this study. Six kinds of medium manganese steels are fabricated by varying the chemical composition and intercritical annealing temperature. Hardness and tensile tests are performed to examine the correlation of microstructure and mechanical properties for the intercritical annealed medium manganese steels containing Cu and Ni. The microstructures of all the steels are composed mostly of lath ferrite, reverted austenite and cementite, regardless of annealing temperature. The room-temperature tensile test results show that the yield and tensile strengths decrease with increasing intercritical annealing temperature due to higher volume fraction and larger thickness of reverted austenite. On the other hand, total and uniform elongations, and strain hardening exponent increase due to higher dislocation density because transformation-induced plasticity is promoted with increasing annealing temperature by reduction in reverted austenite stability.

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from 21.9 Ω/□ to 12.6 Ω/□. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of Cu2SO4 and H2SO4 at a current density of 10 mA/cm2. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about 80 μm. The contact resistance of the copper electrode is 0.89 mΩ·cm2, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are 1 Ω/□ and 40 Ω/□, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

This study used a packed column reactor and a horizontal flow mesh reactor to examine the removal of copper ions from aqueous solutions using pine bark, a natural adsorbent prepared from Korean red pine (Pinus densiflora). Both equilibrium and nonequilibrium adsorption experiments were conducted on copper ion concentrations of 10mg/L, and the removals of copper ions at equilibrium were close to 95%. Adsorption of copper ions could be well described by both the Langmuir and Freundlich adsorption isotherms. The bark was treated with nitric acid to enhance efficiency of copper removal, and sorption capacity was improved by about 48% at equilibrium; mechanisms such as ion exchange and chelation may have been involved in the sorption process. A pseudo second-order kinetic model described the kinetic behavior of the copper ion adsorption onto the bark. Regeneration with nitric acid resulted in extended use of spent bark in the packed column. The horizontal flow mesh reactor allowed approximately 80% removal efficiency, demonstrating its operational flexibility and the potential for its practical use as a bark filter reactor.

We report on the fabrication and characterization of an oxide photoanode with a zinc oxide (ZnO) nanorod array embedded in cuprous oxide (Cu2O) thin film, namely a ZnO/Cu2O oxide p-n heterostructure photoanode, for enhanced efficiency of visible light driven photoelectrochemical (PEC) water splitting. A vertically oriented n-type ZnO nanorod array is first prepared on an indium-tin-oxide-coated glass substrate via a seed-mediated hydrothermal synthesis method and then a p-type Cu2O thin film is directly electrodeposited onto the vertically oriented ZnO nanorod array to form an oxide p-n heterostructure. The introduction of Cu2O layer produces a noticeable enhancement in the visible light absorption. From the observed PEC current density versus voltage (J-V) behavior under visible light illumination, the photoconversion efficiency of this ZnO/Cu2O p-n heterostructure photoanode is found to reach 0.39 %, which is seven times that of a pristine ZnO nanorod photoanode. In particular, a significant PEC performance is observed even at an applied bias of 0 V vs Hg/Hg2Cl2, which makes the device self-powered. The observed improvement in the PEC performance is attributed to some synergistic effect of the pn bilayer heterostructure on the formation of a built-in potential including the light absorption and separation processes of photoinduced charge carriers, which provides a new avenue for preparing efficient photoanodes for PEC water splitting.

Heavy metals resulted from the increase of human industrial activity are introduced into the environment through rainfall and wastewater, and have harmful effects on inhabitants. In this study, we investigated biological responses such as survival rate, growth rate, emergence rate and sex ratio, and morphological effects of mentum deformity in Chironomus plumosus, an indicator organism to evaluate pollutions on aquatic ecosystem. The survival rate of C. plumosus showed time- and dose-dependent decrease after chromium and copper exposures. Growth rate decreased at 4th day after chromium exposure and significantly reduced at exposure to relatively high concentration (copper 1000 mg L-1) for all exposure times. In addition, we observed that the emergence rate by exposure to copper 1000 mg L-1 was significantly lower than that of the control group. The imbalance of sex ratios showed at relatively low concentrations (chromium 10 and 50 mg L-1) with the high proportion of female and at the relative high concentration (copper 1000 mg L-1) with the high proportion of male. Furthermore, the morphological mentum deformities of C. plumosus observed in the exposed group according to chromium and copper exposure. These results suggest that the heavy metal exposure in environment may influence biosynthetic and morphological stresses of benthic invertebrate C. plumosus, and aquatic midge C. plumosus are potential indicators for toxicity assessment of heavy metals such as chromium and copper.

Recently, copper alloy netting has been proposed as a material for aquaculture facilities that can be set in harsh offshore environments. To design a cage made of copper alloy netting, it is necessary to calculate the flow of water through the netting and force of external sources on the netting. Therefore, this study measured and analyzed the current velocity reduction after passing through the netting and the hydrodynamic forces acting on the netting using copper alloy netting with nine solidity ratios. As a result of the reduction rate of the flow velocity through the netting, the flow reduction rate was increased as the solidity ratio of netting was increased. The flow reduction rate was also increased as the attack angle on the netting was decreased. In analyzing the resistance on the netting, we also discovered that resistance was increased with increase in the flow velocity and solidity ratio. An analysis of the hydrodynamic coefficient acting on the netting is shown that the drag coefficient tends to increase as the attack angle increases. We also analyzed the hydrodynamic coefficient according to the variation of the Reynolds number. When the drag coefficients acting on the netting were analyzed with the different Reynolds numbers, the Reynolds number increased from over 0.3 m/s to a relative constant. Finally, the copper alloy nettings had a smaller velocity reduction rate when comparing the flow velocity reduction rate between copper alloy nettings and nylon nettings.