In order to apply to high-nickel cathodes for high-capacity and stability enhancement of lithium-ion batteries, the characteristics of the coating film were reviewed using the conventional nickel plating method. The surface morphology of the plating layer and the measurement of the surface roughness were analyzed according to scan size and rate using the contact mode of Atomic Force Microscopy. The hydrogen ion concentration (pH) of the electrolyte played an important role in shaping the metal ion plating. As the overpotential of the surface increased during plating, the crystals grew in a direction other than the main crystal growth direction. The increase in on-time during pulse plating appears to result in coarse particles as much of the applied current is consumed by the reduction of hydrogen ions, resulting in lower current efficiency. From the AFM image, it was confirmed that the blackening of the plated film was due to a partial overvoltage phenomenon during electrolytic degreasing. In order to be used as a high-nickel cathode, it seems that the current must be uniformly distributed on the surface of the substrate during plating.

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn–Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

본 실험에서는 무전해 도금을 통하여 Pd 및 Pd-Cu 분리막을 제조하여 수소 투과 성능을 분석하였다. 분리막의 지 지체는 α-Al2O3 세라믹 중공사를 사용하였다. Pd-Cu 분리막은 무전해 도금을 실시하였고 Pd-Cu 합금을 만들기 위하여 수소 분위기에서 500°C, 18 h 동안의 열처리 과정을 거쳤다. 그 후, Pd-Cu 분리막은 EDS (Energy Dispersive X-ray Spectroscopy), XRD (X-ray Diffraction) 분석을 통해 합금이 형성된 것을 확인하였다. Pd 및 Pd-Cu 도금층의 두께는 SEM (Scanning Electron Microscope) 분석을 통해 각각 약 3.21, 3.72 μm으로 측정되었다. 수소 투과 성능은 수소 단일 가스, 혼합가스(H2, N2)에서 350~450°C, 1~4 bar의 범위에서 수소 투과 실험을 진행하였다. 수소 단일 가스에서 Pd 및 Pd-Cu 분리막은 450°C, 4 bar에서 최대 54.42, 67.17 ml/cm2⋅min의 flux를 가지며, 혼합가스에서는 450°C, 4 bar의 조건일 때, 각각 1308, 453의 separation factor가 나오는 것을 확인하였다.

The existing production and manufacturing process was manually operated and the cleaning process was not constant due to poor environmental conditions for several hours, so the production efficiency was significantly lowered and manufacturing cost was increased. In this R&D, productivity improved by doubling the production of 300 units per hour to 700 units, and in this development, manufacturing costs were lowered through this process improvement project based on automotive shoba automation technology.

The overall process, from the pre-treatment of aluminum substrates to the eco-friendly neutral electroless Ni-P plating process, was observed, compared, and analysed. To remove the surface oxide layer on the aluminum substrate and aid Ni-P plating, a zincation process was carried out. After the second zincation treatment, it was confirmed that a mostly uniform Zn layer was formed and the surface oxide of aluminum was also removed. The Ni-P electroless plating films were formed on the secondary zincated aluminum substrate using electroless plating solutions of pH 4.5 and neutral pH 7.0, respectively, while changing the plating bath temperature. When a neutral pH7.0 electroless solution was used, the Ni-P plating layer was uniformly formed even at the plating bath temperature of 50 oC, and the plating speed was remarkably increased as the bath temperature was increased. On the other hand, when a pH 4.5 Ni-P electroless solution was used, a Ni-P plating film was not formed at a plating bath temperature of 50 oC, and the plating speed was very slow compared to pH 7.0, although plating speed increased with increasing bath temperature. In the P contents, the P concentration of the neutral pH 7.0 Ni-P electroless plating layer was reduced by ~ 42.3 % compared to pH 4.5. Structurally, all of the Ni-P electroless plating layers formed in the pH 4.5 solution and the neutral (pH 7.0) solution had an amorphous crystal structure, as a Ni-P compound, regardless of the plating bath temperature.

In the flux used in the batch galvanizing process, the effect of the component ratio of NH₄Cl to ZnCl₂ on the microstructure, coating adhesion, and corrosion resistance of Zn-Mg-Al ternary alloy-coated steel is evaluated. Many defects such as cracks and bare spots are formed inside the Zn-Mg-Al coating layer during treatment with the flux composition generally used for Zn coating. Deterioration of the coating property is due to the formation of AlClx mixture generated by the reaction of Al element and chloride in the flux. The coatability of the Zn-Mg-Al alloy coating is improved by increasing the content of ZnCl2 in the flux to reduce the amount of chlorine reacting with Al while maintaining the flux effect and the coating adhesion is improved as the component ratio of NH4Cl to ZnCl2 decreases. Zn-Mg-Al alloy-coated steel products treated with the optimized flux composition of NH₄Cl•3ZnCl₂ show superior corrosion resistance compared to Zn-coated steel products, even with a coating weight of 60 %.

The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 μm. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m−1K−1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10−6 to 3.06 × 10−6 K−1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

Transparent conducting electrodes are essential components in various optoelectrical devices. Although indium tin oxide thin films have been widely used for transparent conducting electrodes, silver nanowire network is a promising alternative to indium tin oxide thin films owing to its lower processing cost and greater suitability for flexible device application. In order to widen the application of silver nanowire network, the electrical conductance has to be improved while maintaining high optical transparency. In this study, we report the enhancement of the electrical conductance of silver nanowire network transparent electrodes by copper electrodeposition on the silver nanowire networks. The electrodeposited copper lowered the sheet resistance of the silver nanowire networks from 21.9 Ω/□ to 12.6 Ω/□. We perform detailed X-ray diffraction analysis revealing the effect of the amount of electrodeposited copper-shell on the sheet resistance of the core-shell(silver/copper) nanowire network transparent electrodes. From the relationship between the cross-sectional area of the copper-shell and the sheet resistance of the transparent electrodes, we deduce the electrical resistivity of electrodeposited copper to be approximately 4.5 times that of copper bulk.

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of Cu2SO4 and H2SO4 at a current density of 10 mA/cm2. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about 80 μm. The contact resistance of the copper electrode is 0.89 mΩ·cm2, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are 1 Ω/□ and 40 Ω/□, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

본 연구에서는 무전해도금법을 이용한 Pd coating 기술을 활용하여 폐수처리를 위한 전기분해 공정에 anode로의 적용을 목적으로 Ti-mesh 기반 전극을 제조하였다. 제조된 Pd/Ti-mesh 전극은 염색염료인 RO16을 대표로 그 제거성능을 평가하였으며, 전극 제조조건을 다르게 하여 내구성 및 성능을 극대화한 결과 coating 조건은 성능에 크게 영향을 미치지 않았지만, Pd coating 후 열처리 공정의 경우 성능에 크게 영향을 미쳤으며, 내구성 역시 증진됨을 확인하였다. 또한 Ir, Ru, Ta을 복합화하여 성능 및 내구성을 극대화하고자 하였으나, coating법의 한계로 layer의 thickness가 증가함에 따라 저항이 커졌으며, 이에 따라 성능이 감소함을 확인하였다.

In this study, clinching characteristics of aluminum and galvanized steels were investigated for the application of clinching as a joining technique to aluminum wheelhouse assembly. A6451 aluminium alloy and galvanized steel sheets were joined by hybrid joining(clinching + adhesive bonding). Tensile-shear load and fracture mode of hybrid joints were investigated. Maximum tensile-shear load of hybrid joints was about six times higher than that of clinched joints without adhesive. Energy absorption values of hybrid joints were higher than those of clinched joints without adhesive as well as resistance spot welded steel joints. Developed aluminum wheelhouse assembly showed higher static stiffness than the existing steel parts. Aluminum wheelhouse inner panel unit was 44% lighter than the steel unit, and the final assembled aluminum wheelhouse was 14.6% lighter than the existing steel parts.

수소는 반도체, 수소화 반응, 연료전지 등 다양한 산업 공정에 사용될 뿐만 아니라 높은 에너지 밀도를 가져 미래의 에너지 원으로 각광 받는다. Water Gas Shift(WGS)와 같은 일반적인 수소제조 공정에서 수소 뿐만 아니라 일산화탄소, 이산화탄소 메탄과 같은 불순물들이 포함되며, 농축 및 정제의 필요성이 있다. Pd 수소분리막을 이용한 수소 분리공정은 수소만을 선택적으로 분리하여 99% 이상의 순도를 쉽게 얻을 수 있다. 본 연구에서는 상전이법을 통하여 중공사형 알루미나 지지체를 제조하고, 무전해 도금법을 이용하여 Pd를 코팅하였다. 무전해 도금법을 이용하여 제조한 분리막을 SEM, EDS, XRD 등의 분석을 통하여 특성을 파악하였으며, 온도 및 압력에 따른 수소 분리실험을 진행 하였다. 본 연구는 “교육부 기본연구(NRF-2017R1D1A1B03036250)”의 지원으로 수행되었습니다.

『금강경』은 성왕 9년(531)에 양나라에서 겸익에 의해 전래된 것으로 판단된다.『금강경』은 양(梁) 소명태자(昭明太子)에 의하여 분장(分章)된 것으로, 처음에는 29장으로 분장되었다가, 그 후 32장으로 세분화된 것이다. 초기 <은제도금금강경>의 번역 오류가 <돈황본 1.2>에서는 교정되거나 추기되었다. 이는 <은제도금금강경>이 <돈황본>보다 선본으로 <돈황본>은 다른 번역본에 의하여 교정되거나 추기된 것이다. <은제도금금강경>의 서체는 북조식남조체이다. 이는 북조필법이 혼용된 남조체로 남조에 서 유행한 북조(北朝)필법(筆法)이다. 즉 80%의 남조체와 특징적인 20%의 북조체가 혼용 된 서체이다. 특히 이체자(異體字)의 사용에 있어서 대부분 6세기에서 7세기 초에 유행한 이체자들을 통하여 <은제도금금강경>의 기록법이 <무령왕능묘지(525)>, <왕흥사청동사리 감명문(577)> 등과 거의 같은 시기에 기록된 것으로 볼 수 있다.

실 산성 도금폐수를 입상활성탄(GAC)이 유동메디아로 첨가된 유동상 멤브레인 반응기를 이용하여 처리하였다. GAC 유동조건에서 적용 투과플럭스에 대해 시간에 따른 흡입압의 증가는 관찰되지 않았다. 폐수의 중성 pH에서 파울링 속도는 산성 조건에 비해 GAC 유동조건에서 크게 감소하였다. 해당 폐수의 용액 pH 증가는 입자크기의 증가를 가져왔고 이는 멤브레인 표면에서 상대적으로 성긴 구조의 케이크층 형성을 야기시켰다. 유동상 멤브레인 반응기에서 GAC 유동 하에 95% 이상의 COD 제거율이 관찰되었으며 총부유물질은 거의 완벽하게 제거되었다. 실 도금폐수의 pH에서, 유동상 멤브레인 반응기의 구리 및 크롬의 제거는 거의 관찰 되지 않았다. 그러나 pH를 중성으로 증가 시켰을 시 구리와 크롬의 제거율은 각각 99%와 94%까지 증가를 하였다. 적용해 준 pH에 상관 없이, 시안의 경우 95% 이상의 제거율을 달성하였다. 이는 유기물과 시안 착물 형성으로 인해 유동상 멤브레인 반응기 내 GAC의 강한 흡착으로 제거된 것으로 사료된다.