Sintering behavior of iron nanopowder agglomerate compact prepared by slurry compaction method was investigated. The Fe nanopowder agglomerates were prepared by hydrogen reduction of spray dried agglomerates of ball-milled nanopowder at various reduction temperatures of , and , respectively. It was found that the Fe nanopowder agglomerates produced at higher reduction temperature have a higher green density compact which consists of more densified nanopowder agglomerates with coarsed nanopowders. The sintering behavior of the Fe nanopowder agglomerates strongly depended on the powder packing density in the compact and microstructure of the agglomerated nanopowder. It was discussed in terms of two sintering factors affecting the entire densification process of the compact.

Successful implementation of the powder forming process requires a detailed understanding of several interacting phenomena. The aim is to better control the process variables and to optimize the design parameters. A number of studies were carried out using various constitutive models that take the density change during powder forming into account. Most of them were developed for powders and sintered porous metals, but few of them can describe powder agglomerates, whose behaviour is different from that of uniformly arranged powders. The modification is needed to account for the effect of agglomeration on densification behaviour. Incorporating powder agglomeration into a constitutive model is of considerable importance, as it provides a possibility of relating the powder densification response to microstructural characteristics of powder particles, especially in case of nano powders. In this paper, we proposed a new powder agglomerate model in order to describe the unique densification behaviour of nano powders. The proposed model was applied to the densification of powder agglomerates during cold isostatic pressing.

각종 전자부품에 이용되는 백금막의 밀착력과 응집화 현상에 대해 연구하였다. 온도저항계수(TCR)의 열화 없이 밀착력을 향상 시키기 위해서 AI, Si의 산화물을 adhesion promoting layer로 이용한 결과 매우 우수한 밀착력과 TCR을 보였다. 질소분위기 600-900˚C의 온도범위에서 행한 열처리를 통해 응집화현상을 관찰한 결과 응집화는 기판거칠기에 따라 다른 양상을 보였다. Si3N4등의 기판거칠기가 작은 adhesion promoting layer를 이용한 시편의 경우 고온인 900˚C에서 응집화 현상이 발생되었다. 표면거칠기가 큰 AI-Si 산화물을 adhesion promoting layer로 이용한 시편의 경우 비교적 저온인 600˚C에서 응집화 현상이 발생했으며 800˚C이상의 열처리의 경우 중앙응집체와 응집체고갈지역이 형성되는 현상을 나타내었다.