Recent industrialization has led to a high demand for the use of fossil fuels. Therefore, the need for producing hydrogen and its utilization is essential for a sustainable society. For an eco-friendly future technology, photoelectrochemical water splitting using solar energy has proven promising amongst many other candidates. With this technique, semiconductors can be used as photocatalysts to generate electrons by light absorption, resulting in the reduction of hydrogen ions. The photocatalysts must be chemically stable, economically inexpensive and be able to utilize a wide range of light. From this perspective, cuprous oxide(Cu2O) is a promising p-type semiconductor because of its appropriate band gap. However, a major hindrance to the use of Cu2O is its instability at the potential in which hydrogen ion is reduced. In this study, gold is used as a bottom electrode during electrodeposition to obtain a preferential growth along the (111) plane of Cu2O while imperfections of the Cu2O thin films are removed. This study investigates the photoelectrochemical properties of Cu2O. However, severe photo-induced corrosion impedes the use of Cu2O as a photoelectrode. Two candidates, TiO2 and SnO2, are selected for the passivation layer on Cu2O by by considering the Pourbaix-diagram. TiO2 and SnO2 passivation layers are deposited by atomic layer deposition(ALD) and a sputtering process, respectively. The investigation of the photoelectrochemical properties confirmed that SnO2 is a good passivation layer for Cu2O.

본 연구에서는 하이드라진 기조의 환원성 제염제를 이용한 마그네타이트 산화물의 용해를 다루고 있다. 마그네타이트로부터의 Fe(Ⅱ) 및 Fe(Ⅲ)의 용해는 protonation, surface complexation 및 reduction에 의해 지배를 받는다. 하이드라진과 황산은 산소결합을 파괴하거나 Fe(Ⅲ)이온을 Fe(Ⅱ)이온으로 환원시키기 위한 수소 및 전자를 각각 제공하게 된다. 속도론적 관점에서 보다 효율적인 용해를 위하여 다수의 전이금속의 영향을 분석하여 Cu(Ⅱ) 이온이 효과적임을 확인한 바 있다. Cu(Ⅰ) 이온은 Cu(Ⅱ) 이온으로 산화되는 동안 전자를 방출하여 Fe(Ⅲ) 이온을 환원시키고 다시 하이드라진에 의해 Cu(Ⅰ) 이온으로 환원되게 된다. 본 연구를 통해 제염용액에 매우 적은 양의 구리 이온 (약 0.5 mM)을 첨가함에 따라 평균 40% 용해속도가 향상됨을 확인하였고, 특히 특정 조건에서는 70% 이상 용해속도가 향상 됨을 확인하였다. 구리 이온이 하이드라 진과 배위결합을 이루는 지에 대해서는 아직 명확하지 않으나, 분명한 것은 Cu(Ⅱ)/H+/ N2H4으로 이루어진 제염제는 효과적인 용해성능을 가지고 있다는 것이다.

To study the effects of graphite shape and the composite fabricating method on the mechanical properties of graphite/copper (Gr/Cu) composites, a copper composite using graphite flakes or graphite granules as reinforcing phases is fabricated using mechanical mixing or electroless plating method. The mechanical properties of the Gr/Cu composites are evaluated by compression tests, and the compressive strength and elongation of the Gr/Cu composites using graphite granules as a reinforcing phase are compared with those of Cu composites with graphite flakes as a reinforcing phase. The compressive yield strength or maximum strength of the Gr/Cu composites with graphite granules as a reinforcing phase is higher than that of the composites using graphite flakes as a reinforcing phase regardless of the alignment of graphite. The strength of the composite produced by the electroless plating method is higher than that of the composite material produced by the conventional mechanical mixing method regardless of the shape of the graphite. Using graphite granules as a reinforcing phase instead of graphite flakes improves the strength and elongation of the Gr/Cu composites in all directions, and reduces the difference in strength or elongation according to the direction.

In the present study, we develop a conductive copper/carbon nanomaterial additive and investigate the effects of the morphologies of the carbon nanomaterials on the conductivities of composites containing the additive. The conductive additive is prepared by mechanically milling copper powder with carbon nanomaterials, namely, multi-walled carbon nanotubes (MWCNTs) and/or few-layer graphene (FLG). During the milling process, the carbon nanomaterials are partially embedded in the surfaces of the copper powder, such that electrically conductive pathways are formed when the powder is used in an epoxy-based composite. The conductivities of the composites increase with the volume of the carbon nanomaterial. For a constant volume of carbon nanomaterial, the FLG is observed to provide more conducting pathways than the MWCNTs, although the optimum conductivity is obtained when a mixture of FLG and MWCNTs is used.

Copper oxide thin films are deposited using an ultrasonic-assisted spray pyrolysis deposition (SPD) system. To investigate the effect of substrate temperature and incorporation of a chelating agent on the growth of copper oxide thin films, the structural and optical properites of the copper oxide thin films are analyzed by X-ray diffraction (XRD), field-emssion scanning electron microscopy (FE-SEM), and UV-Vis spectrophotometry. At a temperature of less than 350 ℃, threedimensional structures consisting of cube-shaped Cu2O are formed, while spherical small particles of the CuO phase are formed at a temperature higher than 400 ℃ due to a Volmer-Weber growth mode on the silicon substrate. As a chelating agent was added to the source solutions, two-dimensional Cu2O thin films are preferentially deposited at a temperature less than 300 ℃, and the CuO thin film is formed even at a temperature less than 350 ℃. Therefore the structure and crystalline phase of the copper oxide is shown to be controllable.

Crystal structure of the L12 type (Al,X)3Ti alloy (X = Cr,Cu) is analyzed by X-ray diffractometry and the nonuniform strain behavior at high temperature is investigated. The lattice constants for the L12 type (Al,X)3Ti alloys decrease in the order of the atomic number of the substituted atom X, and the hardness tends to increase. In a compressive test at around 473K for Al67.5Ti25Cr7.5, Al65Ti25Cr10 and Al62.5Ti25Cu12.5 alloys, it is found that the stress-strain curves showed serration, and deformation rate dependence appeared. It is assumed that the generation of serration is due to dynamic strain aging caused by the diffusion of solute atoms. As a result, activation energy of 60-95 kJ/mol is obtained. This process does not require direct involvement. In order to investigate the generation of serrations in detail, compression tests are carried out under various conditions. As a result, in the strain rate range of this experiment, serration is found to occur after 470K at a certain critical strain. The critical strain increases as the strain rate increases at constant temperature, and the critical strain tends to decrease as temperature rises under constant strain rate. This tendency is common to all alloys produced. In the case of this alloy system, the serration at around 473K corresponds to the case in which the dislocation velocity is faster than the diffusion rate of interstitial solute atoms at low temperature.

This study investigated the effect of the grinding media of a ball mill under various conditions on the raw material of copper powder during the milling process with a simulation of the discrete element method. Using the simulation of the three-dimensional motion of the grinding media in the stirred ball mill, we researched the grinding mechanism to calculate the force, kinetic energy, and medium velocity of the grinding media. The grinding behavior of the copper powder was investigated by scanning electron microscopy. We found that the particle size increased with an increasing rotation speed and milling time, and the particle morphology of the copper powder became more of a plate type. Nevertheless, the particle morphology slightly depended on the different grinding media of the ball mill. Moreover, the simulation results showed that rotation speed and ball size increased with the force and energy.

The friction characteristics of Al-Fe alloy powders are investigated in order to develop an eco-friendly friction material to replace Cu fiber, a constituent of brake-pad friction materials. Irregularly shaped Al-Fe alloy powders, prepared by gas atomization, are more uniformly dispersed than conventional Cu fiber on the brake pad matrix. The wear rate of the friction material using Al-8Fe alloy powder is lower than that of the Cu fiber material. The change in friction coefficient according to the friction lap times is 7.2% for the Cu fiber, but within 3.8% for the Al- Fe alloy material, which also shows excellent judder characteristics. The Al-Fe alloy powders are uniformly distributed in the brake pad matrix and oxide films of Al and Fe are homogeneously formed at the friction interface between the disc and pad, thus exhibiting excellent friction and lubrication characteristics. The brake pad containing Al-Fe powders avoids contamination by Cu dust, which is generated during braking, by replacing the Cu fiber while maintaining the friction and lubrication performance.

When the heat flux on the heating surface following changing heat condition in the boiling heat transfer system exceeds critical heat flux, the critical heat flux phenomenon is going over to immediately the film boiling area and then it is occurred the physical destruction phenomenon of various heat transfer systems. In order to maximize the safe operation and performance of the heat transfer system, it is essential to improve the CHF(Critical Heat Flux) of the system. Therefore, we have analysis the effect of improving CHF and characteristics of heat transfer following the nanoparticle coating thickness. As the results, copper nanocoating time are increased to CHF, and in case of nano-coatings are increased spray-deposited coating times more than in the fure water; copper nanopowder is increased up to 6.40%. The boiling heat transfer coefficients of the pure water are increased up to 5.79% respectively. Also, the contact angle is decreased and surface roughness is increased when nano-coating time is increasingly going up.

한국도로공사는 ‘고차원 설계환경 기반의 차세대 고속도로 설계 및 관리역량 강화’, BIM 기반의 건설·운영 프로세스를 정립하기 위하여 EX-BIM 로드맵을 수립하였다(2016. 5). 현재 초기 도입단계로써,「EX-BIM 시공단계 표준모델 구축 연구」(한국도로공사, 건설처, 2017)를 수행하고 있다. 연구의 일환으로 시공단계 BIM 적용방안 마련을 위하여 ‘성남-구리간 고속도로 건설공사’를 대상으로 설계단계 BIM 성과품에 대한 검토 및 효과분석을 시행하고 있다. 성남-구리 노선 5개공구는 모두 설계-시공 일괄입찰방식으로 추진중이며, 수도권 주요 도심지를 우회하고 한강을 횡단하는 노선으로, 대부분 교량과 터널 등 구조물 위주로 설계되어 있다. 설계단계 BIM 성과품은 작성완료단계에 있으며, 이어 시공단계 BIM을 수행할 예정이다. BIM 적용 목표로 공기의 적정성, 수량의 적정성, 주요 시설물에 대한 간섭검토 등을 요구하였다. 그래서, 각 공구별 수행사는 BIM 실행계획서(BEP, BIM Execution Plan)를 작성하여 BIM 활용방안을 제시하고 설계단계 BIM을 수행하였으며, 이를 반영하여 최종 BIM 성과품을 작성하는 절차로 진행하였다 설계단계에서는 공기와 수량의 적정성 검토, 주요 시설물에 대한 간섭검토 위주로 BIM을 적용하였다. 공구별 3D/4D 모델을 작성하여, 일련의 과정과 결과를 BIM 결과보고서에 포함하여 성과품으로 작성하였으며, 이를 근거로, 설계 성과품 품질 향상과 시공단계 BIM 활용을 위하여 설계BIM 성과품을 검토하고 효과분석을 수행하였다. 성과품 검토 결과, 노선 특성에 따라 교량 및 터널 등 구조물 위주로 BIM을 적용하였으며, 도공 자체 WBS 모델 분류 체계에 따라 일부 모델을 구성하였으나, 공종별 주요 수량검토를 수행하기에는 공구 및 대상별 LOD가 다소 상이하고 미흡한 수준이었다. 설계단계 효과분석은 도면오류, 간섭검토, 주요 수량검토 등 설계시 대표업무에 대한 결과를 분석하였으며, 발주처나 시공사 입장에서 가시적 효과는 간섭검토, 도면오류검토 순으로 예상되었다. 추가로, 건설참여자를 대상으로 설계단계 BIM 모델을 시연하고 시공단계 활용성에 대하여 인터뷰를 실시하였는데, 가상현장과 사전시공 등 사업관리 측면에 대해 관심을 보였다. 본 연구는 성남-구리간 건설공사를 대상으로 설계단계 BIM 성과품을 검토하고 효과분석을 시행하여 고속도로 건설공사시 BIM 도입에 대한 타당성을 제시하고자 한다. 이와 함께, 설계단계 ROI 결과를 토대로 시공단계까지 확대 적용할수 있도록 지속적인 BIM 데이터 관리와 BIM 활용 효과에 대한 모니터링이 필요할 것이다.

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu (0.1 μm and 7 μm) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at 75 oC. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from 0.1 μm Cu particles increased by 192.5% and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of asdeposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37%, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

The biocidal activity of Cu(II) is greatly enhanced by the addition of H2O2 or hydroxylamine (HA), which accelerates the production of cytotoxic Cu(I) and generates a reactive oxidant (cupryl ion, Cu(III)) capable of exerting oxidative cell damages. The bimetallic Fe-Cu nanoparticles also exhibit excellent biocidal activity in the similar biocidal mechanism. These copper-based hybrid disinfection systems were assessed for their potential to inactivate surrogate bacteria and viruses. In addition, combinations of Cu(II) with HA and H2O2 (i.e., Cu(II)/HA, Cu(II)/H2O2, and Cu(II)/HA/H2O2 systems) were tested for the control of bacterial biofilms on reverse osmosis (RO) membranes. The detailed mechanisms for the cell inactivation by different copper-based disinfection systems were discussed.

Copper nanoparticles attract much attention as substitutes of noble metals such as silver and can help reduce the manufacturing cost of electronic products due to their lower cost and good conductivity. In the present work, the chemical reduction is examined to optimize the synthesis of nano-sized copper particles from copper sulfate. Sodium borohydride and ascorbic acid are used as reducing and antioxidant agents, respectively. Polyethylene glycol (PEG) is used as a size-control and capping agent. An appropriate dose of PEG inhibits the abnormal growth of copper nanoparticles, maintaining chemical stability. The addition of ascorbic acid prevents the oxidation of nanoparticles during synthesis and storage. Transmission electron microscopy (TEM) and Fourier transform infrared spectroscopy (FTIR) are used to investigate the size of the synthesized nanoparticles and the coordination between copper nanoparticles and PEG. For chemical reduction, copper nanoparticles less than 100 nm in size without oxidized layers are successfully obtained by the present method.

탄소전극과 이온교환막을 결합한 축전식 탈염(CDI)을 이용하여 셀 구조와 셀 전위에 따른 구리 이온의 제거 특성을 연구하였다. 탄소전극과 이온교환막의 결 합 방식에 따라 4종류의 셀에 대해 실험한 결과 양이온, 음이온교환막을 결합한 셀(MCDI)에서 구리 이온의 제거율과 전하효율이 가장 높은 것으로 나타났다. 셀 전위에 따른 영향을 분석한 결과 0.6 V 이하에서는 전기이중층에 의한 전기 흡착(electrosoprtion)에 의해, 그리고 0.6 V 이상에서는 구리 이온의 전착 (electrodepostion)반응에 의해 구리 이온이 제거됨을 확인하였다. 또한 1.2 V 이상에서는 물이 전기분해되어 전하효율이 감소하였다. MCDI 셀의 운전결과 전하효율은 80% 정도로 구리 이온을 포함한 중금속 이온을 제거하는데 효과적인 것으로 판단되었다.

탄소전극과 이온교환막을 결합한 막결합 축전식 탈염(MCDI) 셀을 이용하여 환원전위가 다른 Na+과 Cu2+ 이온 혼합용액에서 Cu2+ 이온의 제거 특성을 연구 하였다. MCDI 셀에 일정한 전류밀도(1.5 mA/cm2)를 공급하면서 탈염을 실시한 결과 Cu2+ 이온은 일정한 제거속도를 유지하였지만 Na+ 이온의 제거량은 시간에 따라 감소하였다. 이는 Cu2+ 이온은 전착반응에 의해, Na+ 이온은 전기흡착 반응에 의해 제거되기 때문인 것으로 판단된다. Cu2+ 이온의 당량비가 0.14, 0.38, 0.50인 혼합용액을 탈염한 결과 제거된 이온 중 Cu2+ 이온의 당량비는 각 각 0.27, 0.60, 0.79로 나타났다. 이를 통해 Cu2+ 이온의 전착반응에 의해 혼합용 액에서 Cu2+ 이온의 제거율을 증가시킬 수 있음을 알 수 있었다.

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature (300 oC) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

To alloy high melting point elements such as boron, ruthenium, and iridium with copper, heat treatment was performed using metal oxides of B2O3, RuO2, and IrO2 at the temperature of 1200 oC in vacuum for 30 minutes. The microstructure analysis of the alloyed sample was confirmed using an optical microscope and FE-SEM. Hardness and trace element analyses were performed using Vickers hardness and WD-XRF, respectively. Diffusion profile analysis was performed using D-SIMS. From the microstructure analysis results, crystal grains were found to have formed with sizes of 2.97 mm. For the copper alloys formed using metal oxides of B2O3, RuO2, and IrO2 the sizes of the crystal grains were 1.24, 1.77, and 2.23 mm, respectively, while these sizes were smaller than pure copper. From the Vickers hardness results, the hardness of the Ir-copper alloy was found to have increased by a maximum of 2.2 times compared to pure copper. From the trace element analysis, the copper alloy was fabricated with the expected composition. From the diffusion profile analysis results, it can be seen that 0.059 wt%, 0.030 wt%, and 0.114 wt% of B, Ru, and Ir, respectively, were alloyed in the copper, and it led to change the hardness. Therefore, we verified that alloying of high melting point elements is possible at the low temperature of 1200 oC.

Cu-Mn과 Cu-Zn 촉매를 침전제로 다르게 하거나, 금속의 몰비율, 소성온도를 다르게 하여 공침법으로 제조하였고 CO산화반응을 수행하여 혼합산화물 촉매에서 Cu, Mn과 Zn의 영향 및 소성온 도가 미치는 영향을 조사하였다. 촉매의 물리·화학적 특성을 알아보기 위하여 XRD, N2 흡착 및 SEM 의 분석을 수행하였다. Na2CO3로 침전시켜 270℃로 소성하여 제조한 2Cu-1Mn 산화물 촉매가 저온에 서 CO 산화반응 활성이 가장 좋았으며 2Cu-1Mn 산화물 촉매는 43 m2/g으로 가장 높은 비표면적과 촉매 활성을 나타내었다. XRD로 촉매의 결정구조를 분석하였을 때 Cu0.5Mn2.5O4의 결정구조를 갖는 촉 매는 낮은 활성을 보였다. 270℃에서 소성한 촉매가 좋은 활성을 나타냈으며 Pt 촉매와 비교하여도 저 온에서 CO산화반응이 더욱 우수함을 알 수 있었다.