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        검색결과 10

        1.
        2023.12 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO2/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO2/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.
        4,500원
        2.
        2018.06 KCI 등재 구독 인증기관 무료, 개인회원 유료
        In this paper, the recovery and nanoparticle synthesis of Ag from low temperature co-fired ceramic (LTCC) by-products are studied. The effect of reaction behavior on Ag leaching conditions from the LTCC by-products is confirmed. The optimum leaching conditions are determined to be: 5 M HNO3, a reaction temperature of 75℃, and a pulp density of 50 g/L at 60 min. For the selective recovery of Ag, the [Cl]/[Ag] equivalence ratio experiment is performed using added HCl; most of the Ag (more than 99%) is recovered. The XRD and MP-AES results confirm that the powder is AgCl and that impurities are at less than 1%. Ag nanoparticles are synthesized using a chemical reduction process for recycling, NaBH4 and PVP are used as reducing agents and dispersion stabilizers. UV-vis and FE-SEM results show that AgCl powder is precipitated and that Ag nanoparticles are synthesized. Ag nanoparticles of 100% Ag are obtained under the chemical reaction conditions.
        4,000원
        3.
        2017.08 KCI 등재 구독 인증기관 무료, 개인회원 유료
        There has been much interest in recycling electronic wastes in order to mitigate environmental problems and to recover the large amount of constituent metals. Silver recovery from electronic waste is extensively studied because of environmental and economic benefits and the use of silver in fabricating nanodevices. Hydrometallurgical processing is often used for silver recovery because it has the advantages of low cost and ease of control. Research on synthesis recovered silver into nanoparticles is needed for application to transistors and solar cells. In this study, silver is selectively recovered from the by-product of electrodes. Silver precursors are prepared using the dissolution characteristics of the leaching solution. In the liquid reduction process, silver nanoparticles are synthesized under various surfactant conditions and then analyzed. The purity of the recovered silver is 99.24%, and the average particle size of the silver nanoparticles is 68 nm.
        4,000원
        4.
        2009.07 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as TiO2 and SiO2. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.
        4,000원
        5.
        2008.02 KCI 등재 SCOPUS 구독 인증기관 무료, 개인회원 유료
        A sensor element array for combinatorial solution deposition research was fabricated using LTCC (Low-temperature Co-fired Ceramics). The designed LTCC was co-fired at 800˚C for 1 hour after lamination at 70˚C under 3000 psi for 30 minutes. SnO2 sol was prepared by a hydrothermal method at 200˚C for 3 hours. Tin chloride and ammonium carbonate were used as raw materials and the ammonia solution was added to a Teflon jar. 20 droplets of SnO2 sol were deposited onto a LTCC sensor element and this was heat treated at 600˚C for 5 hours. The gas sensitivity (S = Ra/Rg) values of the SnO2 sensor and 0.04 wt% Pd-added SnO2 sensor were measured. The 0.04 wt% Pd-added SnO2 sensor showed higher sensitivity (S = 8.1) compared to the SnO2 sensor (S = 5.95) to 200 ppm CH3COCH3 at 400˚C.
        3,000원
        6.
        2006.09 구독 인증기관·개인회원 무료
        The HTCC based multilayer structure plasma head unit have some difficulties in fabrication due to complicated post-processes, such as heat treatment at reduced atmosphere, re-bonding of each layer, and silver metallization. On the other hand, LTCC based technology provides relatively simple process for multilayer plasma unit except weak mechanical properties. To overcome this problem a combined scheme using both LTCC and HTCC technology has been developed in our group, recently. In this work, we report the structural design, materials selection, joining of LTCC with HTCC substrate, and co-firing process for the fabrication of multilayered atmospheric plasma head unit.
        8.
        2006.09 구독 인증기관·개인회원 무료
        A novel sintering process is proposed for bonding of and layers. Common commercial glass was used and infilterated among filler particles. As the kind of commercial glass, the phenomenon of the infilteration is different. Although Sud-1140 glass forms a glass/filler composite, it is not completely infilterated into the filler particles at . However as the increase of sintering temperature the infilteration of glass was improved. In this study, GA-1 and GA-12 glasses were infilterated the more than Sud-1140 glass. However, they are reacted by layer. The results of the experiment show that constrained sintering and the co-firing of the different materials were possible for glass infilteration using Sud-1140 glass at .