Effects of annealing temperature on the microstructure and mechanical properties through thickness of a cold-rolled Cu-3.0Ni-0.7Si alloy were investigated in detail. The copper alloy with thickness of 3 mm was rolled to 50 % reduction at ambient temperature without lubricant and subsequently annealed for 0.5h at 200~900 oC. The microstructure of the copper alloy after annealing was different in thickness direction depending on an amount of the shear and compressive strain introduced by rolling; the recrystallization occurred first in surface regions shear-deformed largely. The hardness distribution of the specimens annealed at 500~700 oC was not uniform in thickness direction due to partial recrystallization. This ununiformity of hardness corresponded well with an amount of shear strain in thickness direction. The average hardness and ultimate tensile strength showed the maximum values of 250Hv and 450MPa in specimen annealed at 400 oC, respectively. It is considered that the complex mode of strain introduced by rolling effected directly on the microstructure and the mechanical properties of the annealed specimens.

Porous Cu with a dispersion of nanoscale Al2O3 particles is fabricated by freeze-drying CuO-Al2O3/camphene slurry and sintering. Camphene slurries with CuO-Al2O3 contents of 5 and 10 vol% are unidirectionally frozen at -30oC, and pores are generated in the frozen specimens by camphene sublimation during air drying. The green bodies are sintered for 1 h at 700oC and 800oC in H2 atmosphere. The sintered samples show large pores of 100 μm in average size aligned parallel to the camphene growth direction. The internal walls of the large pores feature relatively small pores of ~10 μm in size. The size of the large pores decreases with increasing CuO-Al2O3 content by the changing degree of powder rearrangement in the slurry. The size of the small pores decreases with increasing sintering temperature. Microstructural analysis reveals that 100-nm Al2O3 particles are homogeneously dispersed in the Cu matrix. These results suggest that a porous composite body with aligned large pores could be fabricated by a freeze-drying and H2 reducing process.

The friction characteristics of Al-Fe alloy powders are investigated in order to develop an eco-friendly friction material to replace Cu fiber, a constituent of brake-pad friction materials. Irregularly shaped Al-Fe alloy powders, prepared by gas atomization, are more uniformly dispersed than conventional Cu fiber on the brake pad matrix. The wear rate of the friction material using Al-8Fe alloy powder is lower than that of the Cu fiber material. The change in friction coefficient according to the friction lap times is 7.2% for the Cu fiber, but within 3.8% for the Al- Fe alloy material, which also shows excellent judder characteristics. The Al-Fe alloy powders are uniformly distributed in the brake pad matrix and oxide films of Al and Fe are homogeneously formed at the friction interface between the disc and pad, thus exhibiting excellent friction and lubrication characteristics. The brake pad containing Al-Fe powders avoids contamination by Cu dust, which is generated during braking, by replacing the Cu fiber while maintaining the friction and lubrication performance.

표면 플라즈마 처리된 Cu nanoparticle (NPs)로 제작된 Organic photovoltaic (OPV)소자는 일잔 OPV 소자보 다 높은 효율성을 보여준다. Nps는 다양한 합성법으로 제조되어 29 nm의 지름을 가진 입자형태를 갖추었다. 이러한 Nps는 P3HT:PCBM과 결합하여 OPV 활성층으로 사용되었는데 적층방법으로 spin과 bar 코팅 방식을 사용하였다. 제작된 소자의 효율 평가에서 스핀코팅으로 제작된 P3HT:PCBM과 Nps가 결합된 P3HT:PCBM 이 각각 1.01과 4.39%로 Np의 효과로 인한 효율 증가를 볼 수 있었다. 바코팅 프로세스를 (8, 20, 50 um 갭)를 사용하였을 경우 20 um 갭의 바코터에서 스핀코터와 같은 두께의 활성층 두께를 보였다. 제작된 활성층은 바코터 그루브 특성으로 인해 트렌치 패턴이 형성되어 빛 흡수를 약화시켜 효율성을 저하시켰다.

In this study, an Al-0.7wt%Fe-0.2wt%Mg-0.2wt%Cu-0.02wt%B alloy was designed to fabricate an aluminum alloy for electrical wire having both high strength and high conductivity. The designed Al alloy was processed by casting, extrusion and drawing processes. Especially, the drawing process was done by severe deformation of a rod with an initial diameter of 12 mm into a wire of 2 mm diameter; process was equivalent to an effective strain of 3.58, and the total reduction in area was 97 %. The drawn Al alloy wire was then annealed at various temperatures of 200 to 400 °C for 30 minutes. The mechanical properties, microstructural changes and electrical properties of the annealed specimens were investigated. As the annealing temperature increased, the tensile strength decreased and the elongation increased. Recovery or/and recrystallization occurred as annealing temperature increased, and complete recrystallization occurred at annealing temperatures over 300 °C. Electric conductivity increased with increasing temperature up to 250 °C, but no significant change was observed above 300 °C. It is concluded that, from the viewpoint of the mechanical and electrical properties, the specimen annealed at 350 oC is the most suitable for the wire drawn Al alloy electrical wire.

올레핀/파라핀 분리는 산업에서 가장 중요하고 도전적인 분리 이슈 중의 하 나이다. 흡착 및 막은 에너지 절약적 분리 기술이기에 올레핀/파라핀 분리를 위한 흡착 및 막 기술의 개발이 많은 관심을 받고 있다. 본 연구에서는 유무기 하이브리드 세공체(metal-organic framework, MOF)의 기공 내부에 올레핀 분자와 π complexation이라는 특별한 인력을 지니는 Cu 1가 이온을 효율적이며 안정적으로 함침하는 방법을 제시하였다. 또한, Cu 1가 이온이 함침된 MOF를 고분자 막과 결합하여 올레핀 선택 분리용 혼합기질막(mixed matric membranes)을 성공적으로 개발하였다.

A Nanosized WO3 and CuO powder mixture is prepared using novel high-energy ball milling in a bead mill to obtain a W-Cu nanocomposite powder, and the effect of milling time on the structural characteristics of WO3-CuO powder mixtures is investigated. The results show that the ball-milled WO3-CuO powder mixture reaches at steady state after 10 h milling, characterized by the uniform and narrow particle size distribution with primary crystalline sizes below 50 nm, a specific surface area of 37 m2/g, and powder mean particle size (D50) of 0.57 μm. The WO3-CuO powder mixtures milled for 10 h are heat-treated at different temperatures in H2 atmosphere to produce W-Cu powder. The XRD results shows that both the WO3 and CuO phases can be reduced to W and Cu phases at temperatures over 700oC. The reduced W-Cu nanocomposite powder exhibits excellent sinterability, and the ultrafine W-Cu composite can be obtained by the Cu liquid phase sintering process.

Microstructure, electric, and thermal properties of the Ta-Cu composite is evaluated for the application in electric contact materials. This material has the potential to be used in a medium for a high current range of current conditions, replacing Ag-MO, W, and WC containing materials. The optimized SPS process conditions are a temperature of 900oC for a 5 min holding time under a 30 MPa mechanical pressure. Comparative research is carried out for the calculated and actual values of the thermal and electric properties. The range of actual thermal and electric properties of the Ta-Cu composite are 50~300W/mk and 10~90 %IACS, respectively, according to the compositional change of the 90 to 10 wt% Ta-Cu system. The results related to the electric contact properties, suggest that less than 50 wt% of Ta compositions are possible in applications of electric contact materials.

In this study, Fe-Cu-C alloy is sintered by spark plasma sintering (SPS). The sintering conditions are 60 MPa pressure with heating rates of 30, 60 and 9oC/min to determine the influence of heating rate on the mechanical and microstructure properties of the sintered alloys. The microstructure and mechanical properties of the sintered Fe-Cu-C alloy is investigated by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FE-SEM). The temperature of shrinkage displacement is changed at 450oC with heating rates 30, 60, and 90oC/min. The temperature of the shrinkage displacement is finished at 650oC when heating rate 30oC/min, at 700oC when heating rate 60oC/min and at 800oC when heating rate 90oC/min. For the sintered alloy at heating rates of 30, 60, and 90oC/min, the apparent porosity is calculated to be 3.7%, 5.2%, and 7.7%, respectively. The hardness of the sintered alloys is investigated using Rockwell hardness measurements. The objective of this study is to investigate the densification behavior, porosity, and mechanical properties of the sintered Fe-Cu-C alloys depending on the heating rate.

The aim of this study is to consider the effect hydrogen on dezincification behavior of Cu-Zn alloys. The investigations include microstructural observations with scanning electron microscope and chemical composition analysis with energy dispersive spectrometer. The dezincification layer was found to occur in high pressure hydrogen atmosphere, not in air atmosphere. In addition, the layers penetrated into the inner side along the grain boundaries in the case of hydrogen condition. The shape of the dezincification layers was porous because of Zn dissolution from the α or β phase. In the case of stress corrosion cracks formed in the Cu-Zn microstructure, the dezincification phenomenon with porous voids was also accompanied by grain boundary cracking.

We investigate the microstructural and magnetic property changes of DyH2, Cu + DyH2, and Al + DyH2 diffusion-treated NdFeB sintered magnets with the post annealing (PA) temperature. The coercivity of all the diffusiontreated magnets increases with increasing heat treatment temperature except at 910oC, where it decreases slightly. Moreover, at 880oC, the coercivity increases by 3.8 kOe in Cu and 4.7 kOe in Al-mixed DyH2-coated magnets, whereas this increase is relatively low (3.0 kOe) in the magnet coated with only DyH2. Both Cu and Al have an almost similar effect on the coercivity improvement, particularly over the heat treatment temperature range of 790-880oC. The diffusivity and diffusion depth of Dy increases in those magnets that are treated with Cu or Al-mixed DyH2, mainly because of the comparatively easy diffusion path provided by Cu and Al owing to their solubility in the Nd-rich grain boundary phase. The formation of a highly anisotropic (Nd, Dy)2Fe14B phase layer, which acts as the shell in the core-shell-type structure so as to prevent the reverse domain movement, is the cause of enhanced coercivity of diffusion-treated Nd-Fe-B magnets.

Effect of heavy metals (Cd, Cu, Zn) on the survival and population growth rates (PGR) of marine rotifer, Brachionus plicatilis were examined. B. plicatilis were exposed to Cd, Cu and Zn for 24 h to determine their survival and 72 h to determine their PGR. Survival rates in the control groups were greater than 90%. They were decreased with increasing concentrations of Cd, Cu and Zn. Survival rates were reduced in a concentration-dependent manner. Significant reduction in survival rates after exposure to Cd, Cu and Zn at concentration greater than 40.00, 0.13 and 10.00 mg L-1, respectively. PGR in the control groups were greater than 0.50. They were decreased with increasing concentrations of heavy metals. PGR were reduced in a concentrationdependent manner. Significant reduction in PGR after exposure to Cd, Cu and Zn occurred at concentration greater than 12.5, 0.06 and 1.00 mg L-1, respectively. The order of heavy metal toxicity based on PGR was Cu>Zn>Cd, with EC50 (50% Effective Concentration) values of 0.12, 6.15 and 21.41 mg L-1, respectively. The lowest-observed-effective-concentrations (LOEC) of PGR after exposure to Cd, Cu and Zn were 12.50, 0.06 and 1.00 mg L-1, respectively. The No-observedeffective- concentrations (NOEC) of PGR after exposure to Cd, Cu and Zn were 6.25, 0.03 and 0.01 mg L-1, respectively, in marine ecosystems have toxic effects on PGR of B. plicatilis. These results suggest that the PGR of B. plicatilis are useful tool to assess the effect of heavy metals on primary consumers in marine natural ecosystems.

We report on the fabrication and characterization of a novel Cu2O/CuO heterojunction structure with CuO nanorods embedded in Cu2O thin film as an efficient photocathode for photoelectrochemical (PEC) solar water splitting. A CuO nanorod array was first prepared on an indium-tin-oxide-coated glass substrate via a seed-mediated hydrothermal synthesis method; then, a Cu2O thin film was electrodeposited onto the CuO nanorod array to form an oxide semiconductor heterostructure. The crystalline phases and morphologies of the heterojunction materials were examined using X-ray diffraction and scanning electron microscopy, as well as Raman scattering. The PEC properties of the fabricated Cu2O/CuO heterojunction photocathode were evaluated by photocurrent conversion efficiency measurements under white light illumination. From the observed PEC current density versus voltage (J-V) behavior, the Cu2O/CuO photocathode was found to exhibit negligible dark current and high photocurrent density, e.g. −1.05 mA/cm2 at −0.6 V vs. Hg/HgCl2 in 1 mM Na2SO4 electrolyte, revealing the effective operation of the oxide heterostructure. The photocurrent conversion efficiency of the Cu2O/CuO photocathode was estimated to be 1.27% at −0.6 V vs. Hg/HgCl2. Moreover, the PEC current density versus time (J-T) profile measured at −0.5 V vs. Hg/HgCl2 on the Cu2O/CuO photocathode indicated a 3-fold increase in the photocurrent density compared to that of a simple Cu2O thin film photocathode. The improved PEC performance was attributed to a certain synergistic effect of the bilayer heterostructure on the light absorption and electron-hole recombination processes.

Ce0.8Sm0.2O2–δ―Sm0.1Sr0.9Cu0.2Fe0.8O3–δ dual-phase membranes were prepared with one-pot method and citric acid sol-gel process. After calcination of the powder at 850 ℃, the dual-phase membranes were prepared by uniaxially pressing the powder. The dual-phase membranes were sintered at 1150 ℃ for 5h with heating/cooling rates of 2 ℃/min. The phase structure and microstructure of the sintered membrane were studied by XRD and SEM. Elemental analysis of the membrane surface and cross section was performed. The oxygen permeation fluxes of Cu-containing dual-phase membranes were evaluated in the temperature range of 800―950 ℃ with He and CO2 as the sweep gas.

Using current-voltage (I-V) and capacitance-voltage (C-V) measurements, the electrical properties of Au and Cu Schottky contacts to n-Ge were comparatively investigated. Lower values of barrier height, ideality factor and series resistance were obtained for the Au contact as compared to the Cu contact. The values of capacitance showed strong dependence on the bias voltage and the frequency. The presence of an inversion layer at the interface might reduce the intercept voltage at the voltage axis, lowering the barrier height for C-V measurements, especially at lower frequencies. In addition, a higher interface state density was observed for the Au contact. The generation of sputter deposition-induced defects might occur more severely for the Au contact; these defects affected both the I-V and C-V characteristics.

본 연구는 구리 아연 금속합금의 산화 환원 반응과 합성 알루미늄 실리케이트의 흡착 반응을 이용한 폐수 중 중금속 처리에 관한 연구이다. 극세사 형태로 제조된 구리 아연 금속합금이 수용액 중에 서 산화 환원반응에 의해 아연보다 이온화 경향이 작은 중금속은 환원 처리되고, 이온화 된 아연 및 미 반응 중금속은 흡착 처리하여 제거하는 연구이다. 극세사 형태로 제조된 금속합금 물질은 표면적이 커서 1회 처리만으로도 반응 평형에 도달하게 하여 효율이 높은 것으로 나타났다. 크롬(Cr+3)은 redox 반응 1 회 처리만으로도 100.0 % 제거 되었으며, 수은은 98.0 %, 주석 92.0 %, 구리는 91.4 % 정도 제거되었 다. 카드뮴, 니켈, 납도 각각 40.0 %, 50.0 %, 58.0 %가 제거 되었다. 크롬(Cr+3)은 아연과 이온화 경향 차이가 거의 없지만 제거 효율이 높은 것으로 나타났는데 이는 3가 크롬은 이온 상태로 존재하면 redox 반응에서 발생한 OH- 이온과 결합하여 수산화물 침전을 형성하는 것으로 판단된다. Redox 반응 후 증 가한 아연 및 미반응 중금속 농도를 알루미늄실리케이트를 1회 통과하여 거의 100.0 % 제거할 수 있었 다. 이는 합성 알루미늄 실리케이트의 비표면적이 크고 금속 이온의 흡착능력이 우수한 것으로 나타났으 며, 반응 후 알루미늄 이온은 증가하지 않는 것으로 보아 이온 교환이 아닌 흡착으로 아연 및 중금속 이 온들을 제거할 수 있는 것으로 나타났다.

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

In this study, Fe-Cu-Ni-Mo-C low alloy steel powder is consolidated by spark plasma sintering (SPS) process. The internal structure and the surface fracture behavior are studied using field-emission scanning electron microscopy and optical microscopy techniques. The bulk samples are polished and etched in order to observe the internal structure. The sample sintered at 900oC with holding time of 10 minutes achieves nearly full density of 98.9% while the density of the as-received conventionally sintered product is 90.3%. The fracture microstructures indicate that the sample prepared at 900oC by the SPS process is hard to break out because of the presence of both grain boundaries and internal particle fractures. Moreover, the lamellar pearlite structure is also observed in this sample. The samples sintered at 1000 and 1100oC exhibit a large number of tiny particles and pores due to the melting of Cu and aggregation of the alloy elements during the SPS process. The highest hardness value of 296.52 HV is observed for the sample sintered at 900oC with holding time of 10 minutes.

Refuse-derived fuel (RDF) produced using municipal solid waste was pyrolyzed to produce RDF char. For the first time, the RDF char was used to remove aqueous copper, a representative heavy metal water pollutant. Activation of the RDF char using steam and KOH treatments was performed to change the specific surface area, pore volume, and the metal cation quantity of the char. N2 sorption, Inductively Coupled Plasma-Atomic Emission Spectrometer (ICP-AES), and Fourier transform infrared spectroscopy were used to characterize the char. The optimum pH for copper removal was shown to be 5.5, and the steam-treated char displayed the best copper removal capability. Ion exchange between copper ions and alkali/alkaline metal cations was the most important mechanism of copper removal by RDF char, followed by adsorption on functional groups existing on the char surface. The copper adsorption behavior was represented well by a pseudo-second-order kinetics model and the Langmuir isotherm. The maximum copper removal capacity was determined to be 38.17 mg/g, which is larger than those of other low-cost char adsorbents reported previously.