The purpose of this study was to identify the observable symptoms of musculoskeletal disease from electronic components manufacturing workers who involved in many repetitive tasks and to provide the basic data for the prevention and management. The survey was conducted on 721 people from 15 April, 2013 to 17 May, 2013 by selfrecording type. The results of the study are as follows. First, symptom complaints based on different body parts are in following order, waist was 12.9%, shoulder was 10.5%, neck was 7.4%, hand/wrist/finger was 7.4%, leg/foot was 4.4%, arm/elbow was 2.8%, and 21.9% of the respondents showed symptoms in more than one body part. Sex, age, marital status, work experience, work intensity, and past accident experience were statistically significant. Second, in the job stress evaluation, all male and female workers were below the median of Korean workers in all of 8 categories. the higher the scores for lack of job autonomy, the higher the symptom complaints of musculoskeletal disease. In the case of patients complain observable symptoms of musculorskeletal disease, they should receive proper outpatient treatment, various programs such as stretching by body parts, setting up a desirable working posture, switching to cyclical work, should b developed as much as possible.

본 연구는 2005년과 2007년에 시행한 중소기업기술통계조사에 모두 응한 중소 기업 중 전자부품, 영상, 음향, 통신 장비 업체(KSIC 32) 142개사를 대상으로 외부 자원 활용 과 흡수능력이 2년 후 경영성과와 혁신성과에 어떠한 영향을 미치는지, 또한 흡수능력이 이 들 관계를 어떻게 조절하는지를 실증 분석하였다. 분석 결과, 공동기술개발 여부와 정부지원액으로 측정한 외부 자원 활용은 성과에 유의미 한 영향을 미치지 않았고, 매출액에 대해서만 R&D투자비는 정(+)의, R&D인력비는 부(-)의 영향을 끼쳤다. 그리고 흡수능력의 조절효과는 측정방식과 독립변수에 따라 다르게 나타났 다. 즉, 공동기술개발을 수행할 때의 성과는 R&D투자비가 증가할수록 향상했지만, R&D인 력비는 반대로 작용했다. 그리고 정부의 자금지원이 늘어날수록 성과가 향상하는 기업은 R&D투자비가 낮거나 R&D인력비가 높은 기업이었다. 이러한 연구 결과는 중소기업의 외부 자원 활용이 내부 역량을 대체하지 못하며 오히려 흡수능력을 축적하여 외부 자원 활용의 효과를 극대화 할 필요가 있음을 보여준다. 또한, 공 동기술개발을 수행할 때에는 중소기업의 적극적인 R&D투자가 필요하며 정부의 자금지원은 R&D인력을 보유하고 있으나 자금을 확보하지 못해 독자적인 기술개발이 어려운 기업에 더 욱 효과적이다. 본 연구는 제한된 산업과 표본에서 이루어진 한계가 있지만, 종단적 자료를 통해 인과관계를 규명함으로써 기존 연구들의 한계를 극복하였다.

Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of 5~20 μm at 50˚C. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

The reliability prediction and evaluation for general electronic components are required to guarantee in quality and in efficiency. Although many methodologies for predicting the reliability of electronic components have been developed, their reliability might be subjective according to a particular set of circumstances, and therefore it is not easy to quantify their reliability. In this study reliability prediction of electronic components, that is the interface card, which is used in the CNC(Computerized Numerical Controller) of machine tools, was carried out using PRISM reliability prediction specification. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for weak components before they are used.

Recently, all kind of 21C-typed electronic goods show the tendency of hightechnology and digital convergence rapidly. Also, failure mechanism which differs from original goods concept presents. Today, failure mechanism which differs from one that was happened by restricted harmful environment material before adapted the raw of environment material is changing the paradigm of reliability engineering. Thus, when applied the environment matter of original and secondary material at the electronic goods were removed, reliability assessment method and prediction stay into low level. This study suggests as solution to overcome these phenomenon. The study on the management method of environmental restriction substances which is recognized as important element in the reliability assessment about environment material of electronic goods and the study on reliability assessment method of PWB without environment material are progressed.

Recently, all kind of 21C-typed electronic goods show the tendency of hightechnology and digital convergence rapidly. Also, failure mechanism which differs from original goods concept presents. Today, failure mechanism which differs from one that was happened by restricted harmful environment material before adapted the raw of environment material is changing the paradigm of reliability engineering. Thus, when applied the environment matter of original and secondary material at the electronic goods were removed, reliability assessment method and prediction stay into low level. This study suggests as solution to overcome these phenomenon. The study on the management method of environmental restriction substances which is recognized as important element in the reliability assessment about environment material of electronic goods and the study on reliability assessment method of PWB without environment material are progressed.

엑스선을 이용하면 다양한 종류의 시료에 대한 투영 영상을 얻을 수 있다. 시료가 저밀도 및 고밀도의 복합 물질로 구성되어 있는 경우는 단일 관전압 엑스선을 이용해서 두 물질을 모두 대조도가 높도록 영상화하기 어렵다. 저관전압과 고관전압을 이용하여 영상을 획득하고 영상처리하면 밀도의 차이가 큰 물질을 영상화하기에 용이하다. 크기가 작은 전자부품을 저관전압과 고관전압에서 영상을 획득하여 visual C++을 이용하여 픽셀-픽셀 영상 합성을 통하여 전자부품의 합성수지부분과 금속부분을 동시에 영상화하여 전자부품의 검사 및 관찰의 가능성을 검증하였다.